ES2055961T3 - Refrigeracion de paquetes de circuitos empleando perforaciones. - Google Patents

Refrigeracion de paquetes de circuitos empleando perforaciones.

Info

Publication number
ES2055961T3
ES2055961T3 ES91305472T ES91305472T ES2055961T3 ES 2055961 T3 ES2055961 T3 ES 2055961T3 ES 91305472 T ES91305472 T ES 91305472T ES 91305472 T ES91305472 T ES 91305472T ES 2055961 T3 ES2055961 T3 ES 2055961T3
Authority
ES
Spain
Prior art keywords
perforations
refrigeration
air
circuit packages
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91305472T
Other languages
English (en)
Inventor
Kaveh Azar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of ES2055961T3 publication Critical patent/ES2055961T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

SE PRESENTA UNA FORMA PARA SUMINISTRAR AIRE REFRIGERANTE A LOS COMPONENTES (22 Y 23) MONTADOS SOBRE TARJETAS DE CIRCUITOS IMPRESOS (20 YN 21) EN CONFIGURACIONES APILADAS. SE SUMINISTRAN UNA PLURALIDAD DE PERFORACIONES (26-29) EN LAS TARJETAS DE CIRCUITO IMPRESO, DE TAL FORMA QUE UN FLUNO DE AIRE EN EL CANAL ENTRE LAS TARJETAS OBLIGA AL AIRE A SER ASPIRADO A TRAVES DE LAS PERFORACIONES PARA, ASI, ELIMINAR ZONAS DE ESTANCAMIENTO ENTRE LOS COMPONENTES Y SUMINISTRAR UN CHORRO DE AIRE LOCAL QUE PROVOCA LA REFRIGERACION.
ES91305472T 1990-06-25 1991-06-17 Refrigeracion de paquetes de circuitos empleando perforaciones. Expired - Lifetime ES2055961T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/542,613 US5121290A (en) 1990-06-25 1990-06-25 Circuit pack cooling using perforations

Publications (1)

Publication Number Publication Date
ES2055961T3 true ES2055961T3 (es) 1994-09-01

Family

ID=24164577

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91305472T Expired - Lifetime ES2055961T3 (es) 1990-06-25 1991-06-17 Refrigeracion de paquetes de circuitos empleando perforaciones.

Country Status (8)

Country Link
US (1) US5121290A (es)
EP (1) EP0463782B1 (es)
JP (1) JPH088425B2 (es)
KR (1) KR100228367B1 (es)
AU (1) AU629751B2 (es)
CA (1) CA2041461C (es)
DE (1) DE69102497T2 (es)
ES (1) ES2055961T3 (es)

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JPH05299858A (ja) * 1991-06-25 1993-11-12 Nec Corp 多数のプリント配線基板を含む電子装置の構造
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US6457654B1 (en) 1995-06-12 2002-10-01 Georgia Tech Research Corporation Micromachined synthetic jet actuators and applications thereof
US6123145A (en) * 1995-06-12 2000-09-26 Georgia Tech Research Corporation Synthetic jet actuators for cooling heated bodies and environments
US5896268A (en) * 1997-08-11 1999-04-20 Abacon Telecommunications Corporation Enclosure for high-density subscriber line modules
US6292556B1 (en) 1997-11-06 2001-09-18 Anacapa Technology, Inc. Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction
US6588497B1 (en) * 2002-04-19 2003-07-08 Georgia Tech Research Corporation System and method for thermal management by synthetic jet ejector channel cooling techniques
US6785138B1 (en) 2002-09-05 2004-08-31 Added Communications Of Georgia, Inc. Repeater case for HDSL modules
US6902299B2 (en) * 2003-02-27 2005-06-07 Cantronic Systems Inc. Long distance illuminator
US20040257763A1 (en) * 2003-06-17 2004-12-23 International Business Machines Corporation Internal hard disc drive scalability using mezzanine backplane technology
ITMI20040105A1 (it) * 2004-01-27 2004-04-27 Rg Group Spa Condizionatore a dislocamento con diffusione dell'aria a vena aderente
US20070089902A1 (en) * 2005-10-25 2007-04-26 Tourne Joseph A Circuit board having a multi-signal via
US20080151052A1 (en) * 2006-11-01 2008-06-26 Videolarm, Inc. Infrared illuminator with variable beam angle
US20100328466A1 (en) * 2006-11-01 2010-12-30 Videolarm, Inc. Infrared illuminator with variable beam angle
US7557303B2 (en) * 2006-12-18 2009-07-07 Lsi Corporation Electronic component connection support structures including air as a dielectric
JP4814132B2 (ja) * 2007-03-20 2011-11-16 ダイトロンテクノロジー株式会社 半導体素子の検査装置
JP4719187B2 (ja) * 2007-06-15 2011-07-06 トヨタ自動車株式会社 半導体素子の冷却構造
US7595999B2 (en) * 2007-06-21 2009-09-29 Dell Products L.P. System and method for coupling an integrated circuit to a circuit board
US8537548B2 (en) * 2008-01-29 2013-09-17 Intel Corporation Method, apparatus and computer system for vortex generator enhanced cooling
US20090194831A1 (en) * 2008-02-01 2009-08-06 Custom Sensors & Technologies, Inc. Integrated cavity in pcb pressure sensor
TWI378761B (en) * 2008-09-12 2012-12-01 Pegatron Corp Heat-dissipating device and method
US7961462B2 (en) * 2009-05-28 2011-06-14 Alcatel Lucent Use of vortex generators to improve efficacy of heat sinks used to cool electrical and electro-optical components
FR2948485B1 (fr) * 2009-07-24 2011-10-21 Sagem Comm Dispositif d'accueil pour disque dur
WO2011024319A1 (ja) * 2009-08-31 2011-03-03 富士通株式会社 電子機器
US9075581B2 (en) 2011-04-19 2015-07-07 Germane Systems, Llc Apparatus and method for cooling electrical components of a computer
JP5275412B2 (ja) * 2011-06-08 2013-08-28 株式会社東芝 電子部品
US20130308266A1 (en) * 2011-11-10 2013-11-21 Jason A. Sullivan Providing and dynamically mounting and housing processing control units
IN2013MU01205A (es) * 2013-03-28 2015-04-10 Control Tech Ltd
JP6225477B2 (ja) * 2013-05-16 2017-11-08 富士通株式会社 電子機器
US20150036292A1 (en) * 2013-08-01 2015-02-05 Lear Corporation Electrical Device for Use in an Automotive Vehicle and Method for Cooling Same
JP2016207928A (ja) * 2015-04-27 2016-12-08 ファナック株式会社 複数の発熱部品を冷却するヒートシンク
CN106356344B (zh) * 2016-09-08 2019-03-05 华进半导体封装先导技术研发中心有限公司 基于三维堆叠封装的风冷散热结构及制造方法
JP2020064941A (ja) * 2018-10-16 2020-04-23 住友電装株式会社 回路構造体及び電気接続箱
CN112930077B (zh) * 2019-12-06 2023-11-07 台达电子工业股份有限公司 适用于电源模块的冷却系统
WO2021132488A1 (ja) * 2019-12-25 2021-07-01 株式会社エンプラス 風案内部材、試験装置ユニット、試験装置、電気部品用ソケット及び該電気部品ソケットを複数有する試験装置
GB2602341B (en) * 2020-12-23 2023-11-08 Yasa Ltd Semiconductor cooling arrangement with improved baffle

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2187011A (en) * 1937-03-13 1940-01-16 Paul F Braden Cooling means for an electrical apparatus
DE2107549A1 (de) * 1970-02-19 1971-09-02 Texas Instruments Inc Trager einer elektronischen Schaltung mit einem Sammelsystem mit Warmeleitungs eigenschaften fur alle Richtungen
US3967874A (en) * 1975-09-30 1976-07-06 Calabro Anthony Denis Uniformly cooled printed circuit board mounting assembly
JPS5554997U (es) * 1978-10-11 1980-04-14
GB2033668B (en) * 1978-11-11 1983-01-06 Ferranti Ltd Circuit assemblies
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4399485A (en) * 1980-03-24 1983-08-16 Ampex Corporation Air baffle assembly for electronic circuit mounting frame
JPS5719864A (en) * 1980-07-09 1982-02-02 Nec Corp Route searching system
AT374034B (de) * 1980-07-18 1984-03-12 Siemens Ag Oesterreich Bauteileanordnung fuer das steuergeraet einer daten-verarbeitungsanlage
US4408255A (en) * 1981-01-12 1983-10-04 Harold Adkins Absorptive electromagnetic shielding for high speed computer applications
US4399484A (en) * 1981-03-10 1983-08-16 The United States Of America As Represented By The Secretary Of The Air Force Integral electric module and assembly jet cooling system
JPS5916195U (ja) * 1982-07-21 1984-01-31 三菱電機株式会社 電子機器
US4662830A (en) * 1985-09-06 1987-05-05 Magnetic Peripherals Inc. Quiet centrifugal fan
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US4839774A (en) * 1988-01-25 1989-06-13 Digital Equipment Corporation Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board
JPH0286498A (ja) * 1988-09-22 1990-03-27 Ricoh Co Ltd 製本装置

Also Published As

Publication number Publication date
JPH04233300A (ja) 1992-08-21
DE69102497D1 (de) 1994-07-21
KR920002004A (ko) 1992-01-30
KR100228367B1 (ko) 1999-11-01
DE69102497T2 (de) 1994-10-06
AU629751B2 (en) 1992-10-08
EP0463782A2 (en) 1992-01-02
CA2041461C (en) 1997-05-20
US5121290A (en) 1992-06-09
EP0463782A3 (en) 1992-05-06
JPH088425B2 (ja) 1996-01-29
EP0463782B1 (en) 1994-06-15
CA2041461A1 (en) 1991-12-26
AU7816891A (en) 1992-01-30

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