KR910700544A - 히트 파이프식 반도체 냉각기의 제조방법 - Google Patents
히트 파이프식 반도체 냉각기의 제조방법Info
- Publication number
- KR910700544A KR910700544A KR1019900702192A KR900702192A KR910700544A KR 910700544 A KR910700544 A KR 910700544A KR 1019900702192 A KR1019900702192 A KR 1019900702192A KR 900702192 A KR900702192 A KR 900702192A KR 910700544 A KR910700544 A KR 910700544A
- Authority
- KR
- South Korea
- Prior art keywords
- heat pipe
- manufacturing
- type semiconductor
- semiconductor cooler
- pipe type
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims 2
- 238000005553 drilling Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000005304 joining Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 229910001369 Brass Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000010951 brass Substances 0.000 claims 1
- 230000001680 brushing effect Effects 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000005554 pickling Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/02—Making uncoated products
- B21C23/04—Making uncoated products by direct extrusion
- B21C23/14—Making other products
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49373—Tube joint and tube plate structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시에에 제조된 히트 파이프식 반도체 냉각기의 정면도,
제2도는 제1도의 히트 파이프식 반도체 냉각기의 평면도,
제3도는 금속블럭을 만들기 위한 장척체(長尺體)의 정면도.
Claims (10)
- 금속장척체에 단수 또는 복수의 관통공을 뚫는공정과, 이 금속장척체를 소정길이로 절단하여 소망한 형상의 금속블럭을 얻는 공정과, 상기 관통공의 일단부를 봉지(封止)하는 공정과, 봉지한 상기 관통공내에 저온납과 히트 파이프의 일단부를 장착하고, 이를 가열 접합하여 흡열부를 구성하는 공정과, 상기 히트 파이프의 타단부에 휜을 압입장착하여 방열부를 구성하는 공정과를 구비한 히트 파이프식 반도체 냉각기의 제조방법.
- 제1항에 있어서, 관통공의 단면형상의 거의 타원형, 거의 반원형, 각형 거의 원형중 어느 1종인 히트 파이프식 반도체 냉각기의 제조방법.
- 제1항에 잇어서, 관통공에 산화막 제거를 위한 산세정처리 또는 브러싱 처리를 하는 히트 파이프식 반도체 냉각기의 제조방법.
- 제1항에 있어서, 금속장척체의 재질은 알루미늄, 황동인 히트파이프식 반도체 냉각기의 제조방법.
- 제1항에 있어서, 금속장척체는 주조재, 압출재중 어느 하나로 구성된 히트 파이프식 반도체 냉각기의 제조방법.
- 제1항에 있어서, 관통공의 일단부를 봉지하는 수단이 이 관통공의 일단부에 마개를 나사로 끼워 넣는 것, 이 관통공의 일단부에 마개를 용접하는 것 중 어느 하나인 히트 파이프식 반도체 냉각기의 제조방법.
- 제1항에 있어서, 히트 파이프의작동액은 물, 프론, 또는 플오로카본인 히트 파이프식 반도체 냉각기의 제조방법.
- 제1항에 있어서, 히트 파이프는 그 중간부분에 전기전연통을 형성한 히트 파이프인 히트 파이프식 반도체 냉각기의 제조방법.
- 제1항에 있어서, 전기 연통은 알루미나로 형성된 히트 파이프식 반도체 냉각기의 제조방법.
- 금속장척체에 단수 또는 복수의 관통공을 뚫는 공정과, 이 금속장척체를 소정길이로 절단하여 소망한 형상의 금속블럭을 얻는 공정과, 이 금속블럭을 내열 평판상에 얹어놓아, 상기 관통공의 구멍을 막고, 이 관통 공내에 저온납과 히트 파이프의 일단부를 장착하고, 이들을 가열 접합하여 흡열부를 구성하는 공정과, 상기 히트 파이프의 타단부에 휜을 압입 장착하여 방열부를 구성하는 공정과를 구비한 히트 파이프식 반도체 냉각기의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2702589 | 1989-02-06 | ||
JP1-27025 | 1989-02-06 | ||
JP27025/1 | 1989-02-06 | ||
PCT/JP1990/000145 WO1990009036A1 (fr) | 1989-02-06 | 1990-02-06 | Procede de production d'un dispositif de refroidissement du type a caloduc pour element semi-conducteur |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910700544A true KR910700544A (ko) | 1991-03-15 |
KR930005490B1 KR930005490B1 (ko) | 1993-06-22 |
Family
ID=12209540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900702192A KR930005490B1 (ko) | 1989-02-06 | 1990-02-06 | 히트 파이프식 반도체 냉각기의 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5084966A (ko) |
EP (1) | EP0539583B1 (ko) |
KR (1) | KR930005490B1 (ko) |
CA (1) | CA2026437C (ko) |
DE (1) | DE69023925T2 (ko) |
WO (1) | WO1990009036A1 (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6935409B1 (en) * | 1998-06-08 | 2005-08-30 | Thermotek, Inc. | Cooling apparatus having low profile extrusion |
US7147045B2 (en) * | 1998-06-08 | 2006-12-12 | Thermotek, Inc. | Toroidal low-profile extrusion cooling system and method thereof |
US7305843B2 (en) | 1999-06-08 | 2007-12-11 | Thermotek, Inc. | Heat pipe connection system and method |
US6981322B2 (en) | 1999-06-08 | 2006-01-03 | Thermotek, Inc. | Cooling apparatus having low profile extrusion and method of manufacture therefor |
US6462949B1 (en) | 2000-08-07 | 2002-10-08 | Thermotek, Inc. | Electronic enclosure cooling system |
US7198096B2 (en) * | 2002-11-26 | 2007-04-03 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
US7857037B2 (en) | 2001-11-27 | 2010-12-28 | Thermotek, Inc. | Geometrically reoriented low-profile phase plane heat pipes |
WO2003046463A2 (en) * | 2001-11-27 | 2003-06-05 | Parish Overton L | Stacked low profile cooling system and method for making same |
US9113577B2 (en) | 2001-11-27 | 2015-08-18 | Thermotek, Inc. | Method and system for automotive battery cooling |
TWM247810U (en) * | 2003-12-05 | 2004-10-21 | Tai Sol Electronics Co Ltd | Liquid/gas phase heat dissipation apparatus with seal structure |
US20090050297A1 (en) * | 2005-09-08 | 2009-02-26 | Neobulb Technologies, Inc. | Dissipating Module Structure for Heat Generating Device |
US20080149307A1 (en) * | 2006-12-20 | 2008-06-26 | Cheng Home Electronics Co., Ltd. | Heat transfer duct fastening structure |
US8298682B2 (en) * | 2007-07-05 | 2012-10-30 | Alcoa Inc. | Metal bodies containing microcavities and apparatus and methods relating thereto |
US20150075761A1 (en) * | 2013-09-04 | 2015-03-19 | Ingersoll-Rand Company | Heat sink attachment to tube |
JP2018173193A (ja) * | 2017-03-31 | 2018-11-08 | 古河電気工業株式会社 | ヒートシンク |
DE102018124053B4 (de) | 2018-09-28 | 2023-10-12 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Hochvolt (HV)-Batterie mit einer Kühleinrichtung zum Kühlen elektrischer Module derselben |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2928166A (en) * | 1955-02-17 | 1960-03-15 | Lummus Co | Tube welding |
GB1478015A (en) * | 1973-07-27 | 1977-06-29 | Delanair Ltd | Heat exchanger |
JPS55116092A (en) * | 1979-02-26 | 1980-09-06 | Fujitsu Ltd | Connecting method for heat pipe |
JPS56100293A (en) * | 1980-01-14 | 1981-08-12 | Oki Densen Kk | Cooler device |
JPS56108098A (en) * | 1980-01-29 | 1981-08-27 | Matsushita Electric Ind Co Ltd | Heat pipe |
JPS5941858A (ja) * | 1982-04-21 | 1984-03-08 | Hitachi Cable Ltd | 半導体放熱器用ヒ−トパイプ及びヒ−トパイプに入熱部を形成する方法 |
JPS5971072A (ja) * | 1982-10-15 | 1984-04-21 | Canon Inc | 定着装置 |
JPS5971072U (ja) * | 1982-10-26 | 1984-05-14 | 三菱電機株式会社 | ヒ−トパイプ |
JPS6057956A (ja) * | 1983-09-09 | 1985-04-03 | Furukawa Electric Co Ltd:The | 半導体用ヒ−トパイプ放熱器 |
JPS61113265A (ja) * | 1984-11-08 | 1986-05-31 | Mitsubishi Electric Corp | 半導体素子等の冷却装置 |
JPS61138092A (ja) * | 1984-12-10 | 1986-06-25 | Matsushita Refrig Co | ヒ−トパイプ式放熱装置の製造方法 |
JPS62117352A (ja) * | 1985-11-18 | 1987-05-28 | Toshiba Corp | 電力用半導体素子冷却器 |
JPS63254755A (ja) * | 1987-04-10 | 1988-10-21 | Mitsubishi Electric Corp | 電子素子体の冷却装置の製造方法 |
US4932469A (en) * | 1989-10-04 | 1990-06-12 | Blackstone Corporation | Automotive condenser |
-
1990
- 1990-02-06 DE DE69023925T patent/DE69023925T2/de not_active Expired - Fee Related
- 1990-02-06 WO PCT/JP1990/000145 patent/WO1990009036A1/ja active IP Right Grant
- 1990-02-06 KR KR1019900702192A patent/KR930005490B1/ko not_active IP Right Cessation
- 1990-02-06 EP EP90902689A patent/EP0539583B1/en not_active Expired - Lifetime
- 1990-02-06 US US07/582,194 patent/US5084966A/en not_active Expired - Lifetime
- 1990-02-06 CA CA002026437A patent/CA2026437C/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0539583A4 (en) | 1992-04-27 |
EP0539583B1 (en) | 1995-11-29 |
WO1990009036A1 (fr) | 1990-08-09 |
KR930005490B1 (ko) | 1993-06-22 |
DE69023925D1 (de) | 1996-01-11 |
US5084966A (en) | 1992-02-04 |
CA2026437A1 (en) | 1990-08-07 |
DE69023925T2 (de) | 1996-05-23 |
EP0539583A1 (en) | 1993-05-05 |
CA2026437C (en) | 1992-12-22 |
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Payment date: 20030605 Year of fee payment: 11 |
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