KR910013521A - 에칭된 섬유핵생성 자리를 갖는 증발기 및 그 제조방법 - Google Patents

에칭된 섬유핵생성 자리를 갖는 증발기 및 그 제조방법 Download PDF

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Publication number
KR910013521A
KR910013521A KR1019900021314A KR900021314A KR910013521A KR 910013521 A KR910013521 A KR 910013521A KR 1019900021314 A KR1019900021314 A KR 1019900021314A KR 900021314 A KR900021314 A KR 900021314A KR 910013521 A KR910013521 A KR 910013521A
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South Korea
Prior art keywords
evaporator
graphite
metal
integrated circuit
etching
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KR1019900021314A
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English (en)
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KR100193331B1 (ko
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알. 햄버겐 윌리암
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원본 미기재
디지탈 이큅먼트 코포레이션
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Publication of KR910013521A publication Critical patent/KR910013521A/ko
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Publication of KR100193331B1 publication Critical patent/KR100193331B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

내용 없음.

Description

에칭된 섬유핵생성 자리를 갖는 증발기 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2a도는 본 발명에 따른 바람직한 실시예의 증발기에 대한 측면도,
제2b도는 바람직한 실시예에 따른 증발기의 평면도,
제3도는 바람직한 실시예에 다른 분리된 열분무기의 부가적 성질의 단면도이다.

Claims (13)

  1. 그 내에 유체와 다수의 핵생성자리를 가진 다수의 흑연-금속복합물 핀 핀들을 함유하는 저수조로 이루어지는 증발기 장치.
  2. 집적회로 냉각용 가열 파이프에 이용되는 증발기 장치에 있어서, Cl와 Al를 함유하는 그룹으로부터의 금속과 흑연으로 이루어진고 향상된 표면영역을 가진 스택을 포함함을 특징으로 하는 증발기 장치.
  3. 제2항에 있어서, 상기 스택이 다수의 핀 핀들을 가져 상기 증발기의 표면영역을 증가시킴을 특징으로 하는 증발기 장치.
  4. 제2항에 있어서, 상기 스택표면이 다수의 큰 핵생성 자리를 포함함을 특징으로 하는 증발기 장치.
  5. 제2항에 있어서, 상기 집적회로가 패키지에 포함하고 상기 가열 파이프가 매개 열분무기 없이 사이 직접회로에 직접 연결됨을 특징으로 하는 증발기 장치.
  6. 가열 파이프를 사용하여 집적회로를 냉각시키는 증발기 장치에 있어서, 상기 집적회로가 패키지에 포함되고 상기 가열 파이프가 매개 열분무기 없이 상기 집적회로에 직접 연결됨을 특징으로 하는 증발기 장치.
  7. Al과 Cu로 이루어진 그룹으로 부터의 금속과 흑연을 포함하는 복합물로 제작되고 이 장치의 표면영역을 최소화하는 다수의 핀 핀들을 가지는 증발기장치에 있어서, 상기 표면영역이 생성된 다수의 핵생성자리를 가짐을 특징으로 하는 증발기 장치.
  8. 제7항에 있어서, 베이스와 상기 베이스로부터 확장된 다수의 핀 핀들을 더 구성함을 특징으로 하는 증발기 장치.
  9. 증발기를 제작하는 방법에 있어서, 고압 및 고온하에 Cu와 Al을 함유하는 그룹으로부터의 금속과 흑연섬유를 함유하는 다수의 재료층을 압축시키는 단계; 상기 압축된 층을 기계조작하여 층을 표면영역을 증가시키는 단계; 및 상기 흑연섬유를 상기 기계조작된 압축층에 충분한 깊이로 에칭하여 핵생성자리를 만드는 단계로 구성됨을 특징으로 하는 방법.
  10. 증발기에 핵생성 자리를 생성하는 방법에 있어서, Cu와 Al를 함유하는 그룹의 금속과 흑연섬유의 증발기를 제작하는 단계; 후 에칭 중 상기 금속을 보호하기 위해 상기 금속의 표면을 안정화시키는 단계; 및 상기 흑연섬유를 충분한 깊이로 에칭하여 핵생성자리를 만드는 단계로 이루어짐을 특징으로 하는 방법.
  11. 제10항에 있어서, 상기에칭단계가 상기 증발기에 다수의 구멍을 형성시키는 단계와 구멍의 내부보다 더 작은 개구부를 갖는 구멍을 형성시키는 단계를 더 포함하는 특징으로 하는 방법.
  12. 증발기를 제작하는 방법에 있어서, Cu와 Al을 함유하는 그룹의 금속과 흑연섬유의 증발기를 제작하는 단계; 및 상기 흑연섬유를 충분한 깊이로 에칭하여 증발기면에 구멍을 형성시키는 단계로 구성되는 방법.
  13. 제12항에 있어서, 재오목될 상기 구멍을 형성하는 단계를 더 포함함을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900021314A 1989-12-29 1990-12-21 에칭된 섬유핵생성 부분을 갖는 증발기 및 그 제조방법 KR100193331B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/458909 1989-12-29
US7458909 1989-12-29
US07/458,909 US4995451A (en) 1989-12-29 1989-12-29 Evaporator having etched fiber nucleation sites and method of fabricating same

Publications (2)

Publication Number Publication Date
KR910013521A true KR910013521A (ko) 1991-08-08
KR100193331B1 KR100193331B1 (ko) 1999-07-01

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KR1019900021314A KR100193331B1 (ko) 1989-12-29 1990-12-21 에칭된 섬유핵생성 부분을 갖는 증발기 및 그 제조방법

Country Status (5)

Country Link
US (1) US4995451A (ko)
EP (1) EP0435473B1 (ko)
JP (1) JPH07112031B2 (ko)
KR (1) KR100193331B1 (ko)
DE (1) DE69031651T2 (ko)

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Also Published As

Publication number Publication date
JPH07112031B2 (ja) 1995-11-29
EP0435473A3 (en) 1992-01-02
EP0435473A2 (en) 1991-07-03
EP0435473B1 (en) 1997-10-29
DE69031651D1 (de) 1997-12-04
DE69031651T2 (de) 1998-04-09
KR100193331B1 (ko) 1999-07-01
JPH0621284A (ja) 1994-01-28
US4995451A (en) 1991-02-26

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