JPS6361781B2 - - Google Patents
Info
- Publication number
- JPS6361781B2 JPS6361781B2 JP58100104A JP10010483A JPS6361781B2 JP S6361781 B2 JPS6361781 B2 JP S6361781B2 JP 58100104 A JP58100104 A JP 58100104A JP 10010483 A JP10010483 A JP 10010483A JP S6361781 B2 JPS6361781 B2 JP S6361781B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- substrate
- groove
- grooves
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10010483A JPS605548A (ja) | 1983-06-03 | 1983-06-03 | 集積回路及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10010483A JPS605548A (ja) | 1983-06-03 | 1983-06-03 | 集積回路及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS605548A JPS605548A (ja) | 1985-01-12 |
| JPS6361781B2 true JPS6361781B2 (ko) | 1988-11-30 |
Family
ID=14265077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10010483A Granted JPS605548A (ja) | 1983-06-03 | 1983-06-03 | 集積回路及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS605548A (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2810134A1 (de) * | 1978-03-09 | 1979-09-20 | Bosch Gmbh Robert | Zirkonoxid-keramik mit feinkoernigem und thermisch stabilem gefuege sowie mit hoher thermoschockbestaendigkeit, daraus hergestellte formkoerper, verfahren zur herstellung der formkoerper und ihre verwendung |
| JPS6380856U (ko) * | 1986-11-17 | 1988-05-27 | ||
| US6174489B1 (en) | 1995-09-01 | 2001-01-16 | Denso Corporation | Method for manufacturing a gas sensor unit |
| US6621071B2 (en) * | 2001-09-07 | 2003-09-16 | Raytheon Co. | Microelectronic system with integral cryocooler, and its fabrication and use |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4943875U (ko) * | 1972-07-20 | 1974-04-17 |
-
1983
- 1983-06-03 JP JP10010483A patent/JPS605548A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4943875U (ko) * | 1972-07-20 | 1974-04-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS605548A (ja) | 1985-01-12 |
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