KR910019738A - 슬라이싱머신의 절단방법 - Google Patents
슬라이싱머신의 절단방법 Download PDFInfo
- Publication number
- KR910019738A KR910019738A KR1019910007448A KR910007448A KR910019738A KR 910019738 A KR910019738 A KR 910019738A KR 1019910007448 A KR1019910007448 A KR 1019910007448A KR 910007448 A KR910007448 A KR 910007448A KR 910019738 A KR910019738 A KR 910019738A
- Authority
- KR
- South Korea
- Prior art keywords
- cutting
- changing
- axial direction
- blade
- rotating blade
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D5/00—Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line
- B23D5/02—Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line involving rotary and straight-line movements only, e.g. for cutting helical grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
- B23D47/005—Vibration-damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
- B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S125/00—Stone working
- Y10S125/901—Stone working forming piezoelectric crystals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]
- Y10T83/148—Including means to correct the sensed operation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 슬라이싱머신의 절단방법을 설명하기 위한 슬라이싱머신의 개략도,제2도는 제1도의 평면도.
Claims (9)
- 도우넛형 회전 블레이드의 내주칼로서 결정 인고트를 박편형으로 절단하는 슬라이싱머신에 있어서; 절단을 개시하기 전에 회전 블레이드에 축방향의 힘을 미리 가하여 회전 블레이드를 축방향으로 변위 시키는 고정과;이렇게 형성된 상태에서 결정 인고트의 절단을 수행하는 공정을 포함한 슬라이싱머신의 절단방법.
- 제1항에 있어서; 상기의 회전 블레이드를 축방향으로 변화시키는 공정시에 회전 블레이드는 에어 압력에 의해 축방향으로 변위되어 위치 제어됨을 특징으로 하는 슬라이싱머신의 절단방법.
- 제2항에 있어서, 상기의 회전 블레이드를 축방향으로 변화시키는 공정시에 회전 블레이드의 축방향 변위는 에어압력을 변화시켜 수행됨을 특징으로 하는 슬라이싱머신의 절단방법.
- 제3항에 있어서,상기의 회전 블레이드를 축방향으로 변화시키는 공정시에 에어압력의 변화는 에어압력조정장치에 의해 수행됨을 특징으로 하는 슬라이싱머신의 절단방법.
- 제2항에 있어서, 상기의 회전 블레이드를 축방향으로 변화시키는 공정시에 회전 블레이드의 축방향변위는 에어패드로부터 회전블레이드에 분출되는 에어압력이 일정한 에어패드와 회전 블레이드간의 간격을 변화 시킴으로써 수행됨을 특징으로 하는 슬라이싱머신의 절단방법.
- 제5항에 있어서, 상기의 회전 블레이드를 축방향으로 변화시키는 공정시에 에어패드는 판 스프링에 의해 슬라이싱 머신 본체에 지지된 캔틸레버비임의 선단에 설치되고,상기 에어패드와 회전 블레이드간의 간격변화는 캔틸레이버비임을 따라 추를 이동시켜 수행되을 특징으로 하는 슬라이싱머신의 절단방법.
- 제5항에 있어서, 상기의 회전 블레이드를 축방향으로 변화시키는 공정시에 에어패드는 슬라이싱 본체에 지지된 캔틸레버비임의 선단에 있는 에어패드 구동기구에 의해 설치되고, 상기 에어패드 구동기구는 에어패드를 회전블레이드에 대해 진퇴이동시켜 상기 에어패드와 회전 블레이드간의 간격 변화를 수행함을 특징으로 하는 슬라이싱머신의 절단방법.
- 제1항에 있어서, 상기 회전블레이드를 축방향으로 변화시키는 공정시에 회전블레이드의 축방향변위를 검출하는 블레이드 센서를 설치하여 절단을 개시하기전의 회전블레이드의 변위를 기준 위치로 절단중에 블레이드가 기준위치에 위치되도록 상기의 회전블레이드를 위치제어시키을 특징으로 하는 슬라이싱머신의 절단방법.
- 제2항에 있어서, 상기의 회전블레이드를 축방향으로 변화시키는 공정시에 예정된 절단곡선을 따라 회전블레이드가 위치제어됨을 특징으로 하는 슬라이싱머신의 절단방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12037090 | 1990-05-10 | ||
JP2-120370 | 1990-05-10 | ||
JP6032991A JP2505930B2 (ja) | 1990-05-10 | 1991-03-25 | スライシングマシンの切断方法 |
JP3-060329 | 1991-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910019738A true KR910019738A (ko) | 1991-12-19 |
KR970009143B1 KR970009143B1 (ko) | 1997-06-07 |
Family
ID=26401401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910007448A KR970009143B1 (ko) | 1990-05-10 | 1991-05-08 | 슬라이싱머신의 절단방법 |
Country Status (5)
Country | Link |
---|---|
US (2) | US5174270A (ko) |
EP (2) | EP0456223B1 (ko) |
JP (1) | JP2505930B2 (ko) |
KR (1) | KR970009143B1 (ko) |
DE (2) | DE69104766T2 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2615377B2 (ja) * | 1990-05-10 | 1997-05-28 | 株式会社東京精密 | スライシングマシンの切断装置 |
JPH05318460A (ja) * | 1992-05-25 | 1993-12-03 | Tokyo Seimitsu Co Ltd | 半導体ウエハのスライシング方法 |
US5351444A (en) * | 1992-09-25 | 1994-10-04 | Silicon Technology Corporation | Blade track control system |
JP2979870B2 (ja) * | 1992-11-27 | 1999-11-15 | 信越半導体株式会社 | 半導体インゴットのコーン状端部切除方法 |
JP2823493B2 (ja) * | 1993-01-18 | 1998-11-11 | トーヨーエイテック株式会社 | スライシング装置のブレード撓み検出方法及び装置並びにブレード撓み制御装置 |
US5628673A (en) * | 1993-11-26 | 1997-05-13 | Seiko Seiki Kabushiki Kaisha | Dicing machine with non-contact setup function |
US5632666A (en) * | 1994-10-28 | 1997-05-27 | Memc Electronic Materials, Inc. | Method and apparatus for automated quality control in wafer slicing |
JP3085136B2 (ja) * | 1995-03-25 | 2000-09-04 | 信越半導体株式会社 | ワークのスライシング方法および装置 |
JP2943673B2 (ja) * | 1995-10-31 | 1999-08-30 | 日本電気株式会社 | 半導体基板の製造装置及び製造方法 |
US5694821A (en) * | 1995-12-08 | 1997-12-09 | Simonds Industries, Inc. | Method for controlling work feed rate for cutting wood, metal and other materials |
JP3102364B2 (ja) | 1996-11-06 | 2000-10-23 | 株式会社村田製作所 | スライシング方法およびスライシング装置 |
CA2251526C (en) * | 1997-11-07 | 2006-12-05 | Simonds Industries, Inc. | Method for variably controlling work feed rate for cutting wood, metal and other materials |
US7118446B2 (en) * | 2003-04-04 | 2006-10-10 | Strasbaugh, A California Corporation | Grinding apparatus and method |
DE102013202442B4 (de) * | 2013-02-14 | 2014-09-25 | Hilti Aktiengesellschaft | Verfahren zur Steuerung eines Gerätesystems mit einem Werkzeuggerät und einer motorischen Vorschubeinrichtung |
DE102016111545A1 (de) | 2016-06-23 | 2017-12-28 | Keuro Besitz Gmbh & Co. Edv-Dienstleistungs Kg | Sägemaschine und Führungseinrichtung für ein Sägeband oder Sägeblatt einer Sägemasschine |
CN106827261A (zh) * | 2017-03-21 | 2017-06-13 | 刘合融 | 原石器皿的制作方法及由该方法制得的原石器皿 |
US11504869B2 (en) * | 2019-03-06 | 2022-11-22 | Tokyo Seimitsu Co., Ltd. | Workpiece processing device and method |
US11964361B2 (en) | 2019-03-06 | 2024-04-23 | Tokyo Seimitsu Co., Ltd. | Workpiece processing device and method |
CN112605468A (zh) * | 2020-11-17 | 2021-04-06 | 肇庆高峰机械科技有限公司 | 磁材切片机 |
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DE1502455A1 (de) * | 1964-02-04 | 1969-06-26 | Inm Ind Corp | Trennschneidscheibenanordnung und Verfahren zur Herstellung derselben |
CH527014A (de) * | 1970-08-07 | 1972-08-31 | Meyer & Burger Ag Maschf | Spannvorrichtung für ein Innen-Trennsägeblatt |
JPS541961Y2 (ko) * | 1974-07-15 | 1979-01-27 | ||
US4502459A (en) * | 1982-10-04 | 1985-03-05 | Texas Instruments Incorporated | Control of internal diameter saw blade tension in situ |
JPS6198513A (ja) * | 1984-10-19 | 1986-05-16 | 日立金属株式会社 | 切断装置 |
JPS61122811A (ja) * | 1984-11-16 | 1986-06-10 | 株式会社ドリーム総合研究所 | マツトレス |
JPS62225308A (ja) * | 1986-03-27 | 1987-10-03 | 古河電気工業株式会社 | 内周刃切断装置 |
DE3640645A1 (de) * | 1986-11-28 | 1988-06-09 | Wacker Chemitronic | Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben |
JPS63312812A (ja) * | 1987-06-16 | 1988-12-21 | Sumitomo Metal Ind Ltd | 硬脆材料の切断方法 |
JPH01110105A (ja) * | 1987-10-23 | 1989-04-26 | Sumitomo Metal Ind Ltd | 硬脆材料の切断方法 |
US4852304A (en) * | 1987-10-29 | 1989-08-01 | Tokyo Seimtsu Co., Ltd. | Apparatus and method for slicing a wafer |
JPH0671727B2 (ja) * | 1988-01-18 | 1994-09-14 | マツダ株式会社 | スライシングマシンおよびその制御方法 |
JPH02108507A (ja) * | 1988-10-18 | 1990-04-20 | Nippon Steel Corp | 石材薄板の切出し方法及び装置 |
JP2598314B2 (ja) * | 1988-11-14 | 1997-04-09 | 住友シチックス株式会社 | 硬脆材料の切断装置 |
DE3906091A1 (de) * | 1989-02-27 | 1990-08-30 | Wacker Chemitronic | Verfahren zum zersaegen von stabfoermigen werkstuecken in scheiben mittels innenlochsaege, sowie innenlochsaegen zu seiner durchfuehrung |
JPH06198513A (ja) * | 1993-01-05 | 1994-07-19 | Amada Co Ltd | 丸鋸盤 |
-
1991
- 1991-03-25 JP JP6032991A patent/JP2505930B2/ja not_active Expired - Fee Related
- 1991-04-30 US US07/693,568 patent/US5174270A/en not_active Expired - Lifetime
- 1991-05-08 KR KR1019910007448A patent/KR970009143B1/ko not_active IP Right Cessation
- 1991-05-08 DE DE69104766T patent/DE69104766T2/de not_active Expired - Fee Related
- 1991-05-08 EP EP19910107503 patent/EP0456223B1/en not_active Expired - Lifetime
- 1991-05-08 EP EP19940106144 patent/EP0610967B1/en not_active Expired - Lifetime
- 1991-05-08 DE DE69133239T patent/DE69133239T2/de not_active Expired - Fee Related
-
1992
- 1992-07-27 US US07/918,760 patent/US5287843A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69104766T2 (de) | 1995-03-02 |
DE69133239D1 (de) | 2003-05-22 |
KR970009143B1 (ko) | 1997-06-07 |
EP0610967A2 (en) | 1994-08-17 |
EP0456223B1 (en) | 1994-10-26 |
EP0456223A1 (en) | 1991-11-13 |
EP0610967B1 (en) | 2003-04-16 |
US5174270A (en) | 1992-12-29 |
JPH04211909A (ja) | 1992-08-03 |
DE69133239T2 (de) | 2003-10-30 |
EP0610967A3 (en) | 1995-08-02 |
US5287843A (en) | 1994-02-22 |
DE69104766D1 (de) | 1994-12-01 |
JP2505930B2 (ja) | 1996-06-12 |
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