KR900012726A - 환상톱에 의해 바형상가공부재를 슬라이스(slices)로 되게 톱으로 켜는 방법 및 그 방법을 행하는 환상톱 - Google Patents
환상톱에 의해 바형상가공부재를 슬라이스(slices)로 되게 톱으로 켜는 방법 및 그 방법을 행하는 환상톱 Download PDFInfo
- Publication number
- KR900012726A KR900012726A KR1019900002551A KR900002551A KR900012726A KR 900012726 A KR900012726 A KR 900012726A KR 1019900002551 A KR1019900002551 A KR 1019900002551A KR 900002551 A KR900002551 A KR 900002551A KR 900012726 A KR900012726 A KR 900012726A
- Authority
- KR
- South Korea
- Prior art keywords
- saw
- processing member
- saw blade
- movement
- fastening device
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/126—Cut-off wheels having an internal cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
- B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0675—Grinders for cutting-off methods therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T82/00—Turning
- Y10T82/16—Severing or cut-off
- Y10T82/16426—Infeed means
- Y10T82/16442—Infeed means with means to circumrotate tool[s] about work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T82/00—Turning
- Y10T82/25—Lathe
- Y10T82/2502—Lathe with program control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T82/00—Turning
- Y10T82/25—Lathe
- Y10T82/2527—Lathe having hollow cutter head
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (9)
- 절단입자(cutting grains)로 형성되고, 그 외주(outer periphery)에 있는 체결장치에 체결된 회전톱날의 내단(inner margin)이 작동유지 장치에 의해 그 잘단위치에 지지되어 있는 가공부재를 통하여 반경방향으로 안내되고, 공칭위치(nominal position)에서 톱날의 실제위치의 치우침(deviation)을 톱으로 켜는 작동중에 검출되고 영향을 주는, 환상톱(annular saw)에 의해 바형가공부재(bar-shaped workpieces)를 슬라이스(slices)로, 되게 톱으로 켜는 방법에 있어서, 상기 치우침(deviation)이 체결장치와 가공부재 사이에서 이동축 방향의 상대운동에 의해 적어도 부분적으로 보상을 받도록 구성함을 특징으로 하는 상기 톱으로 켜는 방법.
- 제1항에 있어서, 상기 공칭위치에서 톱날의 치우침은 허용할 수 있도록 한 허용치까지 보상을 받도록 함을 특징으로 하는 상기 톱으로 켜는 방법.
- 제1항 또는 제2항에 있어서, 상기 치우침은 체결장치의 이동축방향운동에 의해 보상을 받도록 구성함을 특징으로 하는 상기 톱으로 켜는 방법.
- 제3항에 있어서, 상기 체결장치는 회전속도의 변화에 의해 이동축방향의 운동을 함을 특징으로 하는 상기 톱으로 켜는 방법.
- 제1항 또는 제2항에 있어서, 상기 치우침은 그 가공부재의 이동축방향운동에 의해 보상을 받도록 구성함을 특징으로 하는 상기 톱으로 켜는 방법.
- 제5항에 있어서, 상기 가공부재는 등압구동장치(piezoelectric drive unit)에 의해 그 이동축방향의 운동을 하도록 함을 특징으로 하는 상기 톱으로 켜는 방법.
- 제1항 내지 제6항중 하나 이상의 항에서 청구한 방법을 실시하는 환상톱(annular saw)에 있어서, 톱으로 켜는 작동 중에 가공부재에서 회전용 톱날의 실제위치를 직접 또는 간접으로 검출을 하도록 하는 적어도 하나의 측정장치(measuring unit)와, 체결장치와 가공부재 사이에서 이동축방향의 상대운동을 행하도록 하는 수단(means)과, 회전용톱날의 검출된 실제위치를 공정위치와 비교하고, 그 치우침에 따라 그 이동축방향의 상대운동을 제어하는 조절변수(requlating varaibles)로 변환시키는 제어장치를 구성함을 특징으로 하는 환상톱.
- 제7항에 있어서, 상기 톱날 회전속도를 조절하는 수단은 이동축방향운동을 하도록 하는 수단으로 구성함을 특징으로 하는 상기 환상톱.
- 제7항에 있어서, 상기 가공부재에 작동하는 등압구동장치는 이동축방향운동을 행하는 수단으로 구성함을 특징으로 하는 상기 환상톱.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3906091A DE3906091A1 (de) | 1989-02-27 | 1989-02-27 | Verfahren zum zersaegen von stabfoermigen werkstuecken in scheiben mittels innenlochsaege, sowie innenlochsaegen zu seiner durchfuehrung |
DEP3906091.8 | 1989-02-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900012726A true KR900012726A (ko) | 1990-09-01 |
KR0149996B1 KR0149996B1 (ko) | 1998-10-15 |
Family
ID=6375037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900002551A KR0149996B1 (ko) | 1989-02-27 | 1990-02-27 | 환상톱에 의해 바형가공부재를 슬라이스로 되게 톱으로 켜는 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4991475A (ko) |
EP (1) | EP0385324B1 (ko) |
JP (1) | JP2805370B2 (ko) |
KR (1) | KR0149996B1 (ko) |
DE (2) | DE3906091A1 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE500941C2 (sv) * | 1989-08-16 | 1994-10-03 | Algy Persson | Förfarande och apparat för snittning av ett preparat |
JP2505930B2 (ja) * | 1990-05-10 | 1996-06-12 | 株式会社東京精密 | スライシングマシンの切断方法 |
JPH04122608A (ja) * | 1990-09-14 | 1992-04-23 | Shin Etsu Handotai Co Ltd | 内周刃スライサーによる単結晶インゴットの切断方法及び装置 |
JPH05116138A (ja) * | 1991-09-30 | 1993-05-14 | Mitsubishi Materials Corp | スライシングマシン |
CH687301A5 (fr) * | 1992-01-22 | 1996-11-15 | W S Technologies Ltd | Dispositif de sciage par fil. |
DE4224395A1 (de) * | 1992-07-23 | 1994-01-27 | Wacker Chemitronic | Halbleiterscheiben mit definiert geschliffener Verformung und Verfahren zu ihrer Herstellung |
JP2823493B2 (ja) * | 1993-01-18 | 1998-11-11 | トーヨーエイテック株式会社 | スライシング装置のブレード撓み検出方法及び装置並びにブレード撓み制御装置 |
JP3053336B2 (ja) * | 1994-09-28 | 2000-06-19 | トーヨーエイテック株式会社 | スライシング方法及び装置 |
DE19510625A1 (de) * | 1995-03-23 | 1996-09-26 | Wacker Siltronic Halbleitermat | Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück |
JPH08294816A (ja) * | 1995-04-25 | 1996-11-12 | Asahi Daiyamondo Kogyo Kk | 内周刃張り上げ方法及び内周刃張り上げモニタリング装置 |
DE19607695A1 (de) * | 1996-02-29 | 1997-09-04 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung von Halbleiterscheiben |
JP3102364B2 (ja) | 1996-11-06 | 2000-10-23 | 株式会社村田製作所 | スライシング方法およびスライシング装置 |
FI107319B (fi) * | 1999-02-10 | 2001-07-13 | Joint Capital Oy Solwo | Sahausmenetelmä puulevyn irrottamiseksi |
US6681672B2 (en) * | 2000-02-07 | 2004-01-27 | Warren L. Myrfield | Optimized band saw feed speed system |
DE10032963C2 (de) * | 2000-07-06 | 2002-05-02 | Fraunhofer Ges Forschung | Verfahren und Anordnung zum Abtrennen dünner Oberflächenbereiche von Substraten |
DE10143508A1 (de) * | 2001-09-05 | 2003-03-20 | Biforce Anstalt Vaduz | Verfahren zur Schneidspalteinstellung |
US20070004174A1 (en) * | 2005-07-01 | 2007-01-04 | Harris John P Jr | Semiconductor wafer sawing system and method |
CN101444933B (zh) * | 2008-12-24 | 2012-02-01 | 陈厚樟 | 多刀头内圆切片机 |
CN109500715A (zh) * | 2018-06-29 | 2019-03-22 | 柳州煜华科技有限公司 | 平面铟靶材机加工方法 |
CN110154254A (zh) * | 2019-07-03 | 2019-08-23 | 青岛高测科技股份有限公司 | 一种晶棒开方上料夹持装置 |
CN111992802B (zh) * | 2020-08-05 | 2021-08-13 | 吴政兼 | 一种钢板切割设备 |
CN117656273A (zh) * | 2021-11-01 | 2024-03-08 | 青岛高测科技股份有限公司 | 硅棒切割系统 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3039235A (en) * | 1961-01-31 | 1962-06-19 | Hamco Mach & Elect Co | Cutting apparatus |
US3992614A (en) * | 1974-11-29 | 1976-11-16 | Pre-Con, Inc. | Saw positioning system for sawmill edger |
US4377958A (en) * | 1981-04-02 | 1983-03-29 | The United States Of America As Represented By The Secretary Of The Department Of Health And Human Services | Remotely operated microtome |
JPS57168854A (en) * | 1981-04-05 | 1982-10-18 | Tokyo Seimitsu Co Ltd | Slicing device |
JPS57178660A (en) * | 1981-04-27 | 1982-11-02 | Hitachi Ltd | Slicer |
US4537177A (en) * | 1982-05-07 | 1985-08-27 | Silicon Technology | Balanced rotary saw assembly and a method of balancing the same |
US4502459A (en) * | 1982-10-04 | 1985-03-05 | Texas Instruments Incorporated | Control of internal diameter saw blade tension in situ |
DE3469498D1 (en) * | 1984-06-27 | 1988-04-07 | Meyer & Burger Ag Maschf | Cutting machine with measuring device and utilization of this measuring device |
JPS6179550A (ja) * | 1984-09-28 | 1986-04-23 | Nippon Sheet Glass Co Ltd | 工作機械 |
JPS61122811U (ko) * | 1985-01-19 | 1986-08-02 | ||
DE3680205D1 (de) * | 1986-04-17 | 1991-08-14 | Meyer & Burger Ag Maschf | Verfahren zum trennen eines stabes in teilstuecke, trennschleifmaschine zur durchfuehrung dieses verfahrens und verwendung dieser trennschleifmaschine. |
DE3640645A1 (de) * | 1986-11-28 | 1988-06-09 | Wacker Chemitronic | Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben |
JPH0671727B2 (ja) * | 1988-01-18 | 1994-09-14 | マツダ株式会社 | スライシングマシンおよびその制御方法 |
JPH01121647U (ko) * | 1988-02-09 | 1989-08-17 | ||
JPH02134212A (ja) * | 1988-11-14 | 1990-05-23 | Sumitomo Metal Ind Ltd | 切断方法 |
-
1989
- 1989-02-27 DE DE3906091A patent/DE3906091A1/de not_active Withdrawn
-
1990
- 1990-02-13 US US07/479,480 patent/US4991475A/en not_active Expired - Lifetime
- 1990-02-26 DE DE90103649T patent/DE59003106D1/de not_active Expired - Lifetime
- 1990-02-26 EP EP90103649A patent/EP0385324B1/de not_active Expired - Lifetime
- 1990-02-26 JP JP2042706A patent/JP2805370B2/ja not_active Expired - Lifetime
- 1990-02-27 KR KR1019900002551A patent/KR0149996B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US4991475A (en) | 1991-02-12 |
EP0385324B1 (de) | 1993-10-20 |
JP2805370B2 (ja) | 1998-09-30 |
EP0385324A2 (de) | 1990-09-05 |
EP0385324A3 (en) | 1990-12-05 |
DE3906091A1 (de) | 1990-08-30 |
DE59003106D1 (de) | 1993-11-25 |
KR0149996B1 (ko) | 1998-10-15 |
JPH03173610A (ja) | 1991-07-26 |
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