JPS57168854A - Slicing device - Google Patents

Slicing device

Info

Publication number
JPS57168854A
JPS57168854A JP56050710A JP5071081A JPS57168854A JP S57168854 A JPS57168854 A JP S57168854A JP 56050710 A JP56050710 A JP 56050710A JP 5071081 A JP5071081 A JP 5071081A JP S57168854 A JPS57168854 A JP S57168854A
Authority
JP
Japan
Prior art keywords
ingot
cut
wafers
measuring devices
cutter blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56050710A
Other languages
Japanese (ja)
Inventor
Yasuhiko Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP56050710A priority Critical patent/JPS57168854A/en
Publication of JPS57168854A publication Critical patent/JPS57168854A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Abstract

PURPOSE:To concurrently perform cutting work and inspection process, by providing ingot surface shape measuring, cutter rotary condition detecting and wafer thickness measuring devices to the above described device of horizontal type cutting an ingot into wafers. CONSTITUTION:An ingot 1 is fed to a direction X at a prescribed pitch by a mounting part A, moved to a direction Y in a rotary part B and cut by a cutter blade 2. A cut wafer is stored in a storage case 19 through a receiving conveyer mechanism 4 after treatment of steps of cleaning, drying, etc. During the time of these operations in the above, there are inspected and measured a condition of the cutter blade 2 by an inspection device 5, supported to an arm 20, cut sectional shape of the ingot 1 by an inspection device 6 and thickness of the wafers by measuring devices 17, 18, respectively, when these three signals are integrated, if a rejected article is suspiciously generated, an alarm is displayed.
JP56050710A 1981-04-05 1981-04-05 Slicing device Pending JPS57168854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56050710A JPS57168854A (en) 1981-04-05 1981-04-05 Slicing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56050710A JPS57168854A (en) 1981-04-05 1981-04-05 Slicing device

Publications (1)

Publication Number Publication Date
JPS57168854A true JPS57168854A (en) 1982-10-18

Family

ID=12866447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56050710A Pending JPS57168854A (en) 1981-04-05 1981-04-05 Slicing device

Country Status (1)

Country Link
JP (1) JPS57168854A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01153259A (en) * 1987-11-05 1989-06-15 Gmn Georg Mueller Nuernberg Ag Method and device for manufacturing circular article with at least one flat surface
EP0385324A2 (en) * 1989-02-27 1990-09-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Method for cutting rod-shaped work pieces into discs using an internal hole saw, and internal hole saw for this purpose
EP0417644A2 (en) * 1989-09-07 1991-03-20 Tokyo Seimitsu Co.,Ltd. Method of slicing cylindrical material into wafers
EP0791444A1 (en) * 1996-02-29 1997-08-27 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Wafer manufacturing process
US8056253B2 (en) * 2006-01-18 2011-11-15 Akrion Systems Llc Systems and methods for drying a rotating substrate
KR20190056829A (en) * 2017-11-17 2019-05-27 조아란 Stone cutting system using waterjet

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4889489A (en) * 1972-02-28 1973-11-22
JPS49114871A (en) * 1973-02-28 1974-11-01
JPS5045393A (en) * 1973-08-30 1975-04-23
JPS5057484A (en) * 1973-09-20 1975-05-19

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4889489A (en) * 1972-02-28 1973-11-22
JPS49114871A (en) * 1973-02-28 1974-11-01
JPS5045393A (en) * 1973-08-30 1975-04-23
JPS5057484A (en) * 1973-09-20 1975-05-19

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01153259A (en) * 1987-11-05 1989-06-15 Gmn Georg Mueller Nuernberg Ag Method and device for manufacturing circular article with at least one flat surface
EP0385324A2 (en) * 1989-02-27 1990-09-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Method for cutting rod-shaped work pieces into discs using an internal hole saw, and internal hole saw for this purpose
EP0417644A2 (en) * 1989-09-07 1991-03-20 Tokyo Seimitsu Co.,Ltd. Method of slicing cylindrical material into wafers
EP0791444A1 (en) * 1996-02-29 1997-08-27 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Wafer manufacturing process
US5975990A (en) * 1996-02-29 1999-11-02 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Method of producing semiconductor wafers
US8056253B2 (en) * 2006-01-18 2011-11-15 Akrion Systems Llc Systems and methods for drying a rotating substrate
KR20190056829A (en) * 2017-11-17 2019-05-27 조아란 Stone cutting system using waterjet

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