KR910007119A - 리드프레임 및 그 제조방법 - Google Patents

리드프레임 및 그 제조방법 Download PDF

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Publication number
KR910007119A
KR910007119A KR1019900015528A KR900015528A KR910007119A KR 910007119 A KR910007119 A KR 910007119A KR 1019900015528 A KR1019900015528 A KR 1019900015528A KR 900015528 A KR900015528 A KR 900015528A KR 910007119 A KR910007119 A KR 910007119A
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Prior art keywords
lead frame
adhesive
metal
resin
joining
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KR1019900015528A
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KR100192871B1 (ko
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가즈노리 가토
겐 무라까미
히로미찌 스즈끼
다까유끼 오끼나가
다까시 에마다
오사무 호리우찌
Original Assignee
기다지마 요시도시
다이 니뽄 인사쯔 가부시기가이샤
미다 가쯔시께
가부시기가이샤 히다찌 세이사꾸쇼
오오노 미노루
히다찌 쬬우엘. 에스. 아이 엔지니어링 가부시기가이샤
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Priority claimed from JP1253245A external-priority patent/JP2790675B2/ja
Priority claimed from JP1253244A external-priority patent/JP2911920B2/ja
Application filed by 기다지마 요시도시, 다이 니뽄 인사쯔 가부시기가이샤, 미다 가쯔시께, 가부시기가이샤 히다찌 세이사꾸쇼, 오오노 미노루, 히다찌 쬬우엘. 에스. 아이 엔지니어링 가부시기가이샤 filed Critical 기다지마 요시도시
Publication of KR910007119A publication Critical patent/KR910007119A/ko
Application granted granted Critical
Publication of KR100192871B1 publication Critical patent/KR100192871B1/ko

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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • H01L23/49506Lead-frames or other flat leads characterised by the die pad an insulative substrate being used as a diepad, e.g. ceramic, plastic
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
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    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Abstract

내용 없음

Description

리드 프레임 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 리드 프레임의 1실시예를 나타낸 평면도.
제2도는 제1도에서 Ⅱ-Ⅱ선을 따라 자른 단면도.
제3도는 본 발명의 1실시예에 있어서 리드 프레임의 제조를 설명하는 도면.

Claims (14)

  1. 복수의 리드가 형성되어 있는 리드 프레임 단체에 금속 또는 수지로 된 단층 또는 다층이 기반을 접합함으로써 형성되어 있는 리드 프레임에 있어서, 상기 리드 프레임 단체와 상기 기반은 그들 사이의 복수 소정부분으로 분할해서 개설된 접착제 필름 또는 접착제를 갖고 있는 수지 필름으로 접합되어 있는 것을 특징으로 하는 리드 프레임.
  2. 복수의 리드가 형성되고 있는 리드 프레임 단체에 금속 또는 수지로 된 단층 또는 다층의 기반을 접합함으로써 형성되어 있는 리드 프레임의 제조방법에 있어서, 접착제 필름 또는 양면에 접착제를 갖고 있는 수지필름을 상기 리드 프렘임 단체의 복수 소정부분으로 분할해서 접착하고, 그 후 상기 기반을 상기 접착제 필름 또는 상기 수지 필름의 상기 접착제로 접합하는 것을 특징으로 하는 리드 프레임의 제조 방법.
  3. 복수의 리드가 형성되어 있는 리드 프레임 단체에 금속 또는 수지로 된 단층 또는 다층의 기반을 접합함으로서 형성되어 있는 리드 프레임의 제조방법에 있어서, 접착제 필름 또는 양면에 접착제를 갖고 있는 수지 필름을 상기 기반의 복수 소정부분으로 분할해서 접착하고, 그 후 상기 리드 프레임 단체를 상기 접착제 필름 또는 상기 수지 필름의 상기 접착제로 접합하는 것을 특징으로 하는 리드 프레임의 제조 방법.
  4. 복수의 리드가 형성되어 있는 리드 프레임 단체에 금속 또는 수지로 된 단층 또는 다층의 기반을 접합함으로서 형성되어 있는 리드 프레임의 제조방법에 있어서, 상기 리드 프레임 단체와 상기 기반을 그들 사이의 복수 소정부분으로 분할해서 개설된 접착제 필름 또는 양면에 접착제를 갖고 있는 수지필름으로 접합하고, 상기 접착제필름 또는 상기 양면에 접착제를 갖고 있는 수지 필름을 상기 리드 프레임 단체와 상기 기반에 동시에 접착하는 것을 특징으로 하는 리드 프레임의 제조 방법.
  5. 복수의 리드가 형성되어 있는 리드 프레임 단체에 금속 또는 수지로 된 단층 또는 다층의 기반단체를 접합함으로서 형성되어 있는 리드 프레임에 있어서, 상기 리드 프레임 단체 및 상기 기반 단체를 함께 동일 복수개의 연속상으로 형성되어 있음과 동시에 이들 리드 프레임 단체 및 기반 단체가 연속상으로 서로 접합되어 있는 것을 특징으로 하는 리드 프레임.
  6. 복수의 리드가 형성되어 있는 리드 프레임 단체에 금속 또는 수지로 된 단층 또는 다층의 기반단체를 접합함으로서 형성되어 있는 리드 프레임의 제조방법에 있어서, 상기 리드 프레임 단체 및 상기 기반 단체를 함께 동일 복수개의 연속상으로 형성함과 동시에 이들 리드 프레임 단체 및 기반 단체를 접착제 필름, 양면 접착제를 갖고 있는 수지 필름, 용접 및 코킹중 어느 하나에 의해 연속상으로 서로 접합하는 것을 특징으로 하는 리드 프레임의 제조 방법.
  7. 제 6 항에 있어서, 상기 리드 프레임 단체와 상기 기반과의 위치 맞춤을 연속상의 리드 프레임 단체 및 연속상의 기반 단체의 공통부분에 형성한 치구구멍으로 행하는 것을 특징으로 하는 리드 프레임의 제조 방법.
  8. 제 6 항 또는 제 7 항에 있어서, 탑재된 칩의 부착 공정전, 또는 그 칩의 부착 공정중 혹은 수지 모울드 후에 상기 연속상의 리드 프레임 단체와 상기 연속상의 기반 단체를 상기 리드의 사이에서 각각으로 절단하는 것을 특징으로 하는 리드 프레임의 제조 방법.
  9. 복수의 리드가 형성되어 있는 리드 프레임 단체에 복수의 금속기반을 접합함으로써 형성되어 있는 리드 프레임에 있어서, 상기 복수의 금속기반은 상이한 재질로 형성되어 있는 것을 특징으로 하는 리드 프레임.
  10. 복수의 리드가 형성되어 있는 리드 프레임 단체에 복수의 금속기반을 접합함으로써 형성되어 있는 리드 프레임에 있어서, 상기 복수의 금속기반은 상이한 판두께로 설정되어 있는 것을 특징으로 하는 리드 프레임.
  11. 복수의 리드가 형성되어 있는 리드 프레임 단체에 복수의 금속기반을 접합함으로써 형성되어 있는 리드 프레임에 있어서, 상기 복수의 금속기반은 상이한 표면처리가 시행되어 있는 것을 특징으로 하는 리드 프레임.
  12. 제 9 항에 있어서, 상기 복수의 금속기반은 상이한 판두께로 설정되어 있는 것을 특징으로하는 리드 프레임.
  13. 제9항, 제10항 및 제12항중 어느 한 항에 있어서, 상기 복수의 금속기반은 상이한 표면처리가 시행되어 있는 것을 특징으로 하는 리드 프레임.
  14. 제1항 내지 제13항중 어느 한 항에 있어서, 상기 복수의 금속기반 끼리 및 상기 리드 프레임 단체와 상기 금속 기반과는 절연성의 접착제 필름 또는 양면에 접착제를 갖고 있는 수지 필름으로 접합되어 있는 것을 특징으로 하는 리드 프레임.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임
KR1019900015528A 1989-09-28 1990-09-28 리드프레임 및 그 제조방법 KR100192871B1 (ko)

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JP1253245A JP2790675B2 (ja) 1989-09-28 1989-09-28 リードフレーム
JP1-253245 1989-09-28
JP1253244A JP2911920B2 (ja) 1989-09-28 1989-09-28 リードフレーム及びその製造方法
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