KR910005981B1 - 적하스탬프 및 그 장치 - Google Patents

적하스탬프 및 그 장치 Download PDF

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Publication number
KR910005981B1
KR910005981B1 KR1019840007672A KR840007672A KR910005981B1 KR 910005981 B1 KR910005981 B1 KR 910005981B1 KR 1019840007672 A KR1019840007672 A KR 1019840007672A KR 840007672 A KR840007672 A KR 840007672A KR 910005981 B1 KR910005981 B1 KR 910005981B1
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KR
South Korea
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protrusion
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KR1019840007672A
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English (en)
Korean (ko)
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KR850004372A (ko
Inventor
요세푸스 마리아 베리스 페르투스
야콥 본 더젬 얀
얀 브레데르 헨드릭
Original Assignee
엔. 브이. 필립스 글로아이람펜파브리켄
아이. 엠. 레르너
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Application filed by 엔. 브이. 필립스 글로아이람펜파브리켄, 아이. 엠. 레르너 filed Critical 엔. 브이. 필립스 글로아이람펜파브리켄
Publication of KR850004372A publication Critical patent/KR850004372A/ko
Application granted granted Critical
Publication of KR910005981B1 publication Critical patent/KR910005981B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1019840007672A 1983-12-06 1984-12-05 적하스탬프 및 그 장치 Expired KR910005981B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8304185 1983-12-06
NL8304185A NL8304185A (nl) 1983-12-06 1983-12-06 Stempel en inrichting voor het aanbrengen van druppels van een viskeuze vloeistof op een substraat.

Publications (2)

Publication Number Publication Date
KR850004372A KR850004372A (ko) 1985-07-11
KR910005981B1 true KR910005981B1 (ko) 1991-08-09

Family

ID=19842837

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840007672A Expired KR910005981B1 (ko) 1983-12-06 1984-12-05 적하스탬프 및 그 장치

Country Status (6)

Country Link
US (1) US4594961A (enrdf_load_stackoverflow)
EP (1) EP0145075B1 (enrdf_load_stackoverflow)
JP (1) JPS60132673A (enrdf_load_stackoverflow)
KR (1) KR910005981B1 (enrdf_load_stackoverflow)
DE (1) DE3469671D1 (enrdf_load_stackoverflow)
NL (1) NL8304185A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101408110B1 (ko) * 2012-11-12 2014-06-20 한국과학기술원 칩 이송장치
CN109152198A (zh) * 2018-09-06 2019-01-04 京东方科技集团股份有限公司 一种导电胶的保护膜、电路板及显示器件的制作方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834062A (en) * 1996-06-27 1998-11-10 Motorola, Inc. Material transfer apparatus and method of using the same
US5909839A (en) * 1997-05-15 1999-06-08 Ford Motor Company Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins
US6612032B1 (en) * 2000-01-31 2003-09-02 Lexmark International, Inc. Manufacturing method for ink jet pen
DE10258798A1 (de) * 2002-12-16 2004-07-22 Siemens Ag Verfahren und Vorrichtung zum partiellen Aufbringen von Klebstoff auf elektronische Bauelemente, Bestückvorrichtung zum Bestücken von Bauelementen
DE10258800A1 (de) * 2002-12-16 2004-07-08 Siemens Ag Verfahren und Vorrichtung zum Aufbringen einer Klebstoffschicht auf flächige Bauelemente, Bestückvorrichtung zum Bestücken von flächigen Bauelementen
JP2009082876A (ja) * 2007-10-02 2009-04-23 Canon Machinery Inc 液剤塗布装置および液剤塗布方法
DE102013112348B4 (de) * 2013-11-11 2024-05-08 Endress+Hauser SE+Co. KG Lotauftragsstempel und Verfahren zur Reparatur einer Leiterplatte mit zumindest einem defekten Bauteil
DE102019118574A1 (de) * 2019-07-09 2021-01-14 Endress+Hauser SE+Co. KG Stift zum Übertragen von Lotpaste aus einem Reservoir auf eine Kontaktstelle einer Leiterplatte

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1293147A (en) * 1918-07-01 1919-02-04 Irving L Keith Cementing-machine.
US2816755A (en) * 1951-10-05 1957-12-17 Burroughs Corp Method and apparatus for making shingled strips
US2902002A (en) * 1955-10-27 1959-09-01 Corning Glass Works Marking device
NL7905518A (nl) * 1978-07-19 1980-01-22 Matsushita Electric Ind Co Ltd Werkwijze voor het monteren van elektronische delen.
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
NL8103574A (nl) * 1981-07-29 1983-02-16 Philips Nv Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101408110B1 (ko) * 2012-11-12 2014-06-20 한국과학기술원 칩 이송장치
CN109152198A (zh) * 2018-09-06 2019-01-04 京东方科技集团股份有限公司 一种导电胶的保护膜、电路板及显示器件的制作方法

Also Published As

Publication number Publication date
DE3469671D1 (en) 1988-04-07
US4594961A (en) 1986-06-17
EP0145075B1 (en) 1988-03-02
KR850004372A (ko) 1985-07-11
JPS60132673A (ja) 1985-07-15
EP0145075A3 (en) 1985-07-10
EP0145075A2 (en) 1985-06-19
JPH0419908B2 (enrdf_load_stackoverflow) 1992-03-31
NL8304185A (nl) 1985-07-01

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