KR910005440A - 알루미늄 필름의 부식방지를 위한 2중층 증착방법 - Google Patents

알루미늄 필름의 부식방지를 위한 2중층 증착방법 Download PDF

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Publication number
KR910005440A
KR910005440A KR1019890012559A KR890012559A KR910005440A KR 910005440 A KR910005440 A KR 910005440A KR 1019890012559 A KR1019890012559 A KR 1019890012559A KR 890012559 A KR890012559 A KR 890012559A KR 910005440 A KR910005440 A KR 910005440A
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KR
South Korea
Prior art keywords
double layer
aluminum film
deposition method
layer deposition
corrosion prevention
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Application number
KR1019890012559A
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English (en)
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KR0136914B1 (ko
Inventor
박남규
Original Assignee
문정환
금성일렉트론 주식회사
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Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019890012559A priority Critical patent/KR0136914B1/ko
Publication of KR910005440A publication Critical patent/KR910005440A/ko
Application granted granted Critical
Publication of KR0136914B1 publication Critical patent/KR0136914B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

내용 없음

Description

알루미늄 필름의 부식방지를 위한 2중층 증착방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 CMOS구조의 단면도.

Claims (1)

  1. MOS소자에 있어서 Al/Si/Cu를 4000-5000Å디포지션하여 메탈(2)형성후 Al/Si필름(3)을 500-1000Å정도 증착하여 Al/Si/Cu+Al/Si의 2증층 구조를 형성하므로 웨트 스트립 용액으로 감광제를 제거해도 위에 덮인 Al/Si필름(3)에 Cu가 함유되지 않아 부식이 방지되게 함을 특징으로 하는 알루미늄 필름의 부식방지를 위한 2증층 증착방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890012559A 1989-08-31 1989-08-31 알루미늄 필름의 부식방지를 위한 2중층 증착방법 KR0136914B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890012559A KR0136914B1 (ko) 1989-08-31 1989-08-31 알루미늄 필름의 부식방지를 위한 2중층 증착방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890012559A KR0136914B1 (ko) 1989-08-31 1989-08-31 알루미늄 필름의 부식방지를 위한 2중층 증착방법

Publications (2)

Publication Number Publication Date
KR910005440A true KR910005440A (ko) 1991-03-30
KR0136914B1 KR0136914B1 (ko) 1998-04-29

Family

ID=19289492

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890012559A KR0136914B1 (ko) 1989-08-31 1989-08-31 알루미늄 필름의 부식방지를 위한 2중층 증착방법

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KR (1) KR0136914B1 (ko)

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Publication number Publication date
KR0136914B1 (ko) 1998-04-29

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