KR850006240A - 전자부품용 리드선 제조방법 - Google Patents
전자부품용 리드선 제조방법 Download PDFInfo
- Publication number
- KR850006240A KR850006240A KR1019840000802A KR840000802A KR850006240A KR 850006240 A KR850006240 A KR 850006240A KR 1019840000802 A KR1019840000802 A KR 1019840000802A KR 840000802 A KR840000802 A KR 840000802A KR 850006240 A KR850006240 A KR 850006240A
- Authority
- KR
- South Korea
- Prior art keywords
- manufacturing
- lead wire
- electronic parts
- copper
- conductor
- Prior art date
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims description 4
- 238000004519 manufacturing process Methods 0.000 title claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
Landscapes
- Details Of Resistors (AREA)
- Non-Insulated Conductors (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 리드선 구성단면도.
제 2 도는 종래의 리드선 구성단면도.
Claims (1)
- 동 또는 동합금등의 도선(1)외주표면에 Sn층(2)을 100%도착피막한 다음, 이의 외주표면에 1-2μ두께의 5% Pb(3)을 재차 피복함을 특징으로 하는 전자부품용 리드선 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019840000802A KR860000476B1 (ko) | 1984-02-20 | 1984-02-20 | 전자 부품용 리드선 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019840000802A KR860000476B1 (ko) | 1984-02-20 | 1984-02-20 | 전자 부품용 리드선 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR850006240A true KR850006240A (ko) | 1985-10-02 |
KR860000476B1 KR860000476B1 (ko) | 1986-04-28 |
Family
ID=19232932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019840000802A KR860000476B1 (ko) | 1984-02-20 | 1984-02-20 | 전자 부품용 리드선 제조 방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR860000476B1 (ko) |
-
1984
- 1984-02-20 KR KR1019840000802A patent/KR860000476B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR860000476B1 (ko) | 1986-04-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910700533A (ko) | 절연 전선 | |
KR910005343A (ko) | 전기 이중층 콘덴서 | |
KR880004724A (ko) | 금속 기판 및 그 제조 방법 | |
KR920018851A (ko) | 메탈플러그의 형성방법 | |
KR900005585A (ko) | 땜납 돌출형 반도체장치와 그 제조방법 | |
EP0798778A3 (en) | Method of manufacturing a semiconductor device of multilayer wire structure | |
KR850000137A (ko) | 평각절연전선의 제조방법 | |
ES546397A0 (es) | Un electrolito para la electrodeposicion de un revestimientode aleacion de hierro-cinc. | |
KR910001089A (ko) | 다층 섭동재료 | |
TW344826B (en) | Chip resistor and method of making the same | |
GB2185704B (en) | Low phosphorus containing band-shaped and/or filamentary material | |
ES8506823A1 (es) | Un procedimiento para la deposicion electroforetica de una pelicula organica sobre un substragto conductor | |
KR850006240A (ko) | 전자부품용 리드선 제조방법 | |
AU581946B2 (en) | Multilayer ohmic contact for P-type semiconductor and method of making same | |
KR890015311A (ko) | 칩형 콘덴서 및 그 제조방법 | |
DK0834600T3 (da) | Overfladebelægning på isolerende materialer, samt fremgangsmåde og anvendelse ved tilvejebringelse af afskærmning af isolerende kasser | |
DE3275963D1 (en) | Method of making alloyed metal contact layers on integrated circuits | |
KR910006522A (ko) | 전극 보호물 | |
KR880010437A (ko) | 전자부품용 리드선 제조방법 | |
KR920700456A (ko) | 절연 전선 | |
KR850005141A (ko) | 집적회로의 리드 프레임용 재료의 제조방법 | |
EP0396276A3 (en) | Method of manufacturing semiconductor device | |
KR960019701A (ko) | 집적 회로 및 그 제조 방법 | |
KR850006223A (ko) | 내식자기 접착테이프 | |
KR920001678A (ko) | 금속 배선의 알루미늄 산화막 형성 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
J206 | Request for trial to confirm the scope of a patent right | ||
FPAY | Annual fee payment |
Payment date: 20000424 Year of fee payment: 15 |
|
LAPS | Lapse due to unpaid annual fee |