KR910003295A - 하드 디스크 장치용 커버 · 패킹 조립체의 제조방법 - Google Patents

하드 디스크 장치용 커버 · 패킹 조립체의 제조방법 Download PDF

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Publication number
KR910003295A
KR910003295A KR1019900009915A KR900009915A KR910003295A KR 910003295 A KR910003295 A KR 910003295A KR 1019900009915 A KR1019900009915 A KR 1019900009915A KR 900009915 A KR900009915 A KR 900009915A KR 910003295 A KR910003295 A KR 910003295A
Authority
KR
South Korea
Prior art keywords
hard disk
disk device
manufacturing
cover
packing assembly
Prior art date
Application number
KR1019900009915A
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English (en)
Other versions
KR950010692B1 (ko
Inventor
노보루 시마모또
도께루 다까무라
류이찌 나까따
Original Assignee
고사까 유따로
신에쓰 가가꾸 고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고사까 유따로, 신에쓰 가가꾸 고오교 가부시끼가이샤 filed Critical 고사까 유따로
Publication of KR910003295A publication Critical patent/KR910003295A/ko
Application granted granted Critical
Publication of KR950010692B1 publication Critical patent/KR950010692B1/ko

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/922—Bonding or joining for manufacture of seal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Gasket Seals (AREA)
  • Sealing Material Composition (AREA)

Abstract

내용 없음.

Description

하드 디스크 장치용 커버·패킹 조립체의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 하드 디스크 장치용 커버부재의 소정 위치에 액상의 자기접착성 실리콘 고무 재료를 도설하여, 이 고무 재료의 경화를 행하는 것을 특징으로 하는 하드 디스크 장치용 커버·팩킹 조립체의 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900009915A 1989-07-03 1990-07-02 하드 디스크 장치용 커버·패킹 조립체의 제조 방법 KR950010692B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP171510/1989 1989-07-03
JP1171510A JPH0337482A (ja) 1989-07-03 1989-07-03 ハードディスク装置用カバー・パッキン組立体の製造方法

Publications (2)

Publication Number Publication Date
KR910003295A true KR910003295A (ko) 1991-02-27
KR950010692B1 KR950010692B1 (ko) 1995-09-21

Family

ID=15924455

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900009915A KR950010692B1 (ko) 1989-07-03 1990-07-02 하드 디스크 장치용 커버·패킹 조립체의 제조 방법

Country Status (3)

Country Link
US (1) US5147691A (ko)
JP (1) JPH0337482A (ko)
KR (1) KR950010692B1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2612979B2 (ja) * 1991-07-25 1997-05-21 信越化学工業株式会社 ハードディスク装置用カバー・パッキング組立体
US5548809A (en) * 1992-07-15 1996-08-20 Southwestern Bell Technology Resources, Inc. Spectrum sharing communications system and system for monitoring available spectrum
CA2129073C (en) 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
US5538262A (en) * 1993-11-08 1996-07-23 Matsumura; Keizo Ultra-high vacuum gasket and vacuum apparatus using the same
JP2658993B2 (ja) * 1995-07-13 1997-09-30 日本電気株式会社 磁気ディスク装置
US5666239A (en) * 1995-12-14 1997-09-09 Seagate Technology, Inc. Laminated base deck for a disc drive
US6646826B1 (en) 2000-02-17 2003-11-11 Seagate Technology Llc Integrated cover and gasket assembly
US6850387B2 (en) 2001-01-17 2005-02-01 Seagate Technology Llc Form-in-place gasket height variability control for a disc drive
EP1729043A1 (en) * 2001-01-31 2006-12-06 Bridgestone Corporation Gasket integrated with cover
US7372662B2 (en) * 2003-08-14 2008-05-13 Seagate Technology Llc Base deck with formed-in-place gaskets and impact dissipation members for a data storage device
US7312949B2 (en) * 2003-10-22 2007-12-25 Seagate Technology Llc Base deck with overmolded elastomeric and rigid structural components
JP4678847B2 (ja) * 2004-10-28 2011-04-27 信越化学工業株式会社 シリコーン組成物から得られる粘着層を有する粘着性フィルム
CN101871533A (zh) * 2010-06-22 2010-10-27 吴江朗科化纤有限公司 一种具备自粘安装功能的硅橡胶密封条及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900617A (en) * 1973-11-27 1975-08-19 Gen Electric Method of rendering flexible sheet material non-adherent and article produced thereby
JPS5123809A (ja) * 1974-08-22 1976-02-26 Erehon Kk Suichupurowaa
JPS5424046U (ko) * 1977-07-20 1979-02-16
JPS5826376B2 (ja) * 1977-09-26 1983-06-02 東芝シリコ−ン株式会社 ゴム状に硬化しうるオルガノポリシロキサン組成物
JPS5944152B2 (ja) * 1979-07-04 1984-10-26 セイコーインスツルメンツ株式会社 気密チヤンバ
DE3108595A1 (de) * 1981-03-06 1982-09-16 Wacker-Chemie GmbH, 8000 München Verfahren zur beschichtung von unterlagen
JPS6163991A (ja) * 1984-09-05 1986-04-02 Hitachi Ltd 磁気デイスク装置
JPS61235461A (ja) * 1985-04-10 1986-10-20 Shin Etsu Chem Co Ltd 硬化性オルガノポリシロキサン組成物
JPH0718080Y2 (ja) * 1985-12-11 1995-04-26 信越化学工業株式会社 固定ディスク装置用カバ−
DE3717670A1 (de) * 1986-11-21 1988-06-01 Hoechst Ceram Tec Ag Verfahren zum abdichten keramischer waermetauscher
US4739427A (en) * 1987-01-14 1988-04-19 Micropolis Corporation High capacity hard disk construction
US4780338A (en) * 1987-03-26 1988-10-25 General Electric Company Solventless silicone coating composition
GB2213744B (en) * 1987-12-17 1991-09-18 Courtaulds Films & Packaging Production of polymeric films
JPH01210460A (ja) * 1988-02-18 1989-08-24 Toray Silicone Co Ltd 剥離剤組成物
JP2594142B2 (ja) * 1988-11-30 1997-03-26 東芝シリコーン株式会社 電子部品の製造方法

Also Published As

Publication number Publication date
US5147691A (en) 1992-09-15
KR950010692B1 (ko) 1995-09-21
JPH0337482A (ja) 1991-02-18
JPH0565744B2 (ko) 1993-09-20

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