KR910001916A - 패키지를 포함하는 반도체 디바이스 제조 방법 - Google Patents

패키지를 포함하는 반도체 디바이스 제조 방법 Download PDF

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Publication number
KR910001916A
KR910001916A KR1019900008171A KR900008171A KR910001916A KR 910001916 A KR910001916 A KR 910001916A KR 1019900008171 A KR1019900008171 A KR 1019900008171A KR 900008171 A KR900008171 A KR 900008171A KR 910001916 A KR910001916 A KR 910001916A
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KR
South Korea
Prior art keywords
plastic
mold
semiconductor device
providing
cavities
Prior art date
Application number
KR1019900008171A
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English (en)
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KR970010150B1 (ko
Inventor
비. 맥쉐인 마이클
티. 린 폴
Original Assignee
빈센트 죠셉 로너
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 빈센트 죠셉 로너, 모토로라 인코포레이티드 filed Critical 빈센트 죠셉 로너
Publication of KR910001916A publication Critical patent/KR910001916A/ko
Application granted granted Critical
Publication of KR970010150B1 publication Critical patent/KR970010150B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

내용 없음

Description

패키지를 포함하는 반도체 디바이스 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 2도는 표준 캐리어 링 구조를 사용하는 반도체 장치 패키지 구성을 나타내는 각각의 투시도.
제3도는 반도체 장치 패키지 및 캐리어 링의 단면도.

Claims (3)

  1. 패키지 몸체부와 몸체부를 둘러싸는 금형된 캐리어 링을 포함하는 반도체 디바이스를 캡슐 봉입하는 방법에 있어서, 캐리어 링 형태를 한정하는 제1캐비티와 삽입부를 수용하는 제2캐비티를 갖는 금형을 제공하는 단계와, 패키지 몸체 형태를 한정하는 상기 제2캐비티를 만들도록 상기 금형의 상기 제2캐비티에 삽입부를 제공하는 단계와, 리드 프레임을 제공하는 단계와, 반도체 디바이스 다이를 상기 리드 프레임에 부착시키는 단계와, 상기 금형 내에 부착된 상기 다이에 상기 리드 프레임을 삽입하는 단계와, 상기 다리를 캡슐 봉입하는 플라스틱 몸체부와 상기 몸체부를 둘러싸는 플라스틱 캐리어 링을 형성하도록 상기 금형에 플라스틱을 채우는 단계를 구비하는 반도체 디바이스 캡슐 봉입 방법.
  2. 금형된 플라스틱 패키지 몸체와, 상기 패키지를 둘러싸는 금형된 캐리어 링을 포함하는 직접 회로 디바이스 제조 방법에 있어서, 캐리어 링을 한정하는 제1캐비티와 삽입부가 플라스틱 패키지 몸체를 한정하는 위치에 있는 제2캐비티를 갖는 플라스틱 캡슐 봉입 금형을 제공하는 단계를 구비하는 직접 회로 디바이스 제조 방법.
  3. 플라스틱 몸체부를 포함하는 반도체 디바이를 캡슐 봉입하는 방법에 있어서, 각각이 플라스틱 몸체 형태를 한정하는 다수의 제1캐비티, 플라스틱 캡슐 봉입하는 물질을 운반하는 런너 및 삽입부를 수용하는 다수의 제2캐비티를 갖는 금형을 제공하는 단계와, 삽입부는 상기 런너로부터 상기 다수의 제1캐비티까지 플라스틱 캡슐 봉입하는 물질을 운반하는 게이트가 제공되도록 구성되며, 상기 다수의 제2캐비티에 다수의 삽입부를 제공하는 단계와, 상기 런너로부터 상기 다수의 제1캐비티까지 플라스틱 캡슐 봉입 물질용 통로로 한정하도록 상기 다수의 제2캐비티에 상기 다수의 삽입부를 조화시키는 단계와, 다수의 디바이스 위치를 갖는 리드 프레임을 제공하는 단계와, 상기 각 디바이스 위치에 하나의 반도체 디바이스 다이가 있으며 다수의 반도체 디바이스 다이를 상기 리드 프레임에 부착시키는 단계와, 상기 금형내에 부착된 상기 다수의 반도체 디바이스 다이에 상기 리드 프레임을 삽입시키는 단계와, 상기 다수의 반도체 디바이스 다이의 각각을 캡슐 봉입하는 플라스틱 몸체부를 형성하도록 상기 금형에 플라스틱 캡슐 봉입 물질을 채우는 단계를 구비하는 반도체 디바이스 캡슐 봉입 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900008171A 1989-06-07 1990-06-04 패키지를 포함하는 반도체 디바이스 제조 방법 KR970010150B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/362,644 US5049526A (en) 1989-06-07 1989-06-07 Method for fabricating semiconductor device including package
US362,644 1989-06-07
US362644 1989-06-07

Publications (2)

Publication Number Publication Date
KR910001916A true KR910001916A (ko) 1991-01-31
KR970010150B1 KR970010150B1 (ko) 1997-06-21

Family

ID=23426950

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900008171A KR970010150B1 (ko) 1989-06-07 1990-06-04 패키지를 포함하는 반도체 디바이스 제조 방법

Country Status (6)

Country Link
US (1) US5049526A (ko)
EP (1) EP0401586A3 (ko)
JP (1) JPH0330343A (ko)
KR (1) KR970010150B1 (ko)
MY (1) MY105920A (ko)
SG (1) SG71652A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1050298A3 (en) * 1999-05-07 2001-03-07 Johnson & Johnson China Ltd. Composition for treating and/or ameliorating the diseases of dandruff, seborrheic dermatitis, psoriasis and eczema and symptoms thereof
US6731153B2 (en) 2000-10-16 2004-05-04 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit having switching transistors and varactors

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US5689137A (en) * 1995-10-16 1997-11-18 Hestia Technologies, Inc. Method for transfer molding standard electronic packages and apparatus formed thereby
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US6306331B1 (en) 1999-03-24 2001-10-23 International Business Machines Corporation Ultra mold for encapsulating very thin packages
US6305921B1 (en) * 1999-07-12 2001-10-23 Accu-Mold Corp. Saw tooth mold
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US6856006B2 (en) * 2002-03-28 2005-02-15 Siliconix Taiwan Ltd Encapsulation method and leadframe for leadless semiconductor packages
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SG111092A1 (en) * 2002-11-15 2005-05-30 St Microelectronics Pte Ltd Semiconductor device package and method of manufacture
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JP4885475B2 (ja) * 2005-05-13 2012-02-29 東芝機械株式会社 ダイカストマシン等の型締装置及び同型締装置を備えた金型交換方法ならびに移動側ダイプレートの交換システム
US9539743B2 (en) * 2014-07-02 2017-01-10 Gregory Arther Huber Insertable aperture molding

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1050298A3 (en) * 1999-05-07 2001-03-07 Johnson & Johnson China Ltd. Composition for treating and/or ameliorating the diseases of dandruff, seborrheic dermatitis, psoriasis and eczema and symptoms thereof
US6731153B2 (en) 2000-10-16 2004-05-04 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit having switching transistors and varactors

Also Published As

Publication number Publication date
US5049526A (en) 1991-09-17
EP0401586A3 (en) 1991-07-10
EP0401586A2 (en) 1990-12-12
SG71652A1 (en) 2000-04-18
KR970010150B1 (ko) 1997-06-21
MY105920A (en) 1995-02-28
JPH0330343A (ja) 1991-02-08

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