KR910001086A - 기판상에 다결정층을 제조하는 방법 - Google Patents

기판상에 다결정층을 제조하는 방법 Download PDF

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KR910001086A
KR910001086A KR1019900009694A KR900009694A KR910001086A KR 910001086 A KR910001086 A KR 910001086A KR 1019900009694 A KR1019900009694 A KR 1019900009694A KR 900009694 A KR900009694 A KR 900009694A KR 910001086 A KR910001086 A KR 910001086A
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temperature
amorphous silicon
silicon layer
dopant
layer
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KR1019900009694A
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KR100217147B1 (ko
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에메리히 베르타크놀리.
헤르베르트 카프짜.
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발도르프, 피켄셔
지멘스 악티엔게젤샤프트
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5806—Thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/584—Non-reactive treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/20—Resistors

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  • Chemical & Material Sciences (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Recrystallisation Techniques (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

내용 없음.

Description

기판상에 다결정층을 제조하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 비정질 실리콘층을 가진 기판을 도시한 단면도.
제2도는 다결정 실리콘층을 가진 기판을 도시한 단면도.
제3도는 여러가지로 처리된 다실리콘에 대한 임프랜테이션 선량에 따른 층저항부의 그래프.

Claims (16)

  1. 기판상에 다결정 실리콘층을 제조하는 방법에 있어서, 기판상에 비정질 실리콘층을 증착시키는 단계 ; 비정질 실리콘에 대한 결정화온도 보다 낮은 온도인 초기 온도로 비정질 실리콘층을 가진 상기 기판을 가열시키는 단계 ; 상기 초기온도에서 열평형을 이루는 단계 ; 및 상기 비정질 실리콘을 가진 상기 기판을 상기 초기온도로 부터 상기 비정질 실리콘이 본질적으로 완전히 결정화하여 다결정이 되도록 상기 비정질 실리콘의 결정화온도보다 더 높은 목적온도까지 조절가열하는 단계로 구성됨을 특징으로 하는 기판상에 다결정 실리콘층을 제조하기 위한 방법.
  2. 제1항에 있어서, 상기 기판을 상기 목적 온도에서 충분히 템퍼링시키는 단계를 더 포함함을 특징으로 하는 방법.
  3. 제2항에 있어서, 상기 목적 온도에서의 상기 충분한 템퍼링단계가 적어도 15분 동안 행해짐을 특징으로 하는 방법.
  4. 제1항에 있어서, 상기 비정질 실리콘층에 대한 상기 증착단계는 약 560℃ 내지 600℃의 온도범위 에서의 화학증착법(CVD)을 이용하고 상기 초기 온도는 약 500℃ 내지 550℃의 온도범위인 것을 특징으로 하는 방법.
  5. 제1항에 있어서, 상기 비정질 실리콘층에 대한 상기 증착단계가 스퍼터링에 의한 것임을 특징으로 하는 방법.
  6. 제1항에 있어서, 상기 목적온도가 약 700℃ 내지 8000℃의 온도범위인 것을 특징으로 하는 방법.
  7. 제1항에 있어서, 상기 초기온도에서 상기 목적온도까지의 상기 조절 가열단계는 분당 단지 10℃의 온도 변화로 행하여짐을 특징으로 하는 방법.
  8. 제1항에 있어서, 상기 초기온도에서 상기 목적온도까지의 상기 조절 가열단계는 초당 적어도 100℃의 온도 변화로 이용하는 빠른 어닐링에 의해 행해짐을 특징으로 하는 방법.
  9. 제1항에 있어서, 상기 증착단계 후 도핑제의 임프랜테이션에 의해 상기 비정질 실리콘층을 도핑시키는 단계를 더 포함함을 특징으로 하는 방법.
  10. 제1항에 있어서, 도핑제의 임프랜테이션에 의해 상기 다결정층을 도핑시키는 단계를 더 포함함을 특징으로 하는 방법.
  11. 제1항에 있어서, 상기 증착단계 중 원위치의 상기 비정질 실리콘층을 도핑시키는 단계를 더 포함함을 특징으로 하는 방법.
  12. 제9항에 있어서, 상기 비정질 실리콘층이 상기 조절 가열 단계로 상기 다결정층으로 변형한 후 상기 도핑제를 고온으로 가열함으로서 상기 도핑제를 활성화시키는 단계를 더 포함함을 특징으로 하는 방법.
  13. 제10항에 있어서, 상기 비정질 실리콘층이 상기 조절 가열 단계로 상기 다결정층으로 변형한 후 상기 도핑제를 고온으로 가열함으로써 상기 도핑제를 활성화시키는 단계를 더 포함함을 특징으로 하는 방법.
  14. 제11항에 있어서, 상기 비정질 실리콘층이 상기 조절 가열 단계로 상기 다결정층으로 변형한 후 상기 도핑제를 고온으로 가열함으로서 상기 도핑제를 활성화시키는 단계를 더 포함함을 특징으로 하는 방법.
  15. 제1항에 있어서, 상기 다실리콘층이 집적회로상의 다실리콘 저항층임을 특징으로 하는 방법.
  16. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900009694A 1989-06-30 1990-06-29 기판 상에 다결정 층을 형성하는 방법 KR100217147B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE3921627.6 1989-06-30
DE3921627.3 1989-06-30
DE3921627 1989-06-30

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KR910001086A true KR910001086A (ko) 1991-01-30
KR100217147B1 KR100217147B1 (ko) 1999-09-01

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EP (1) EP0405451B1 (ko)
JP (1) JP3059195B2 (ko)
KR (1) KR100217147B1 (ko)
DE (1) DE59003200D1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294219B1 (en) * 1998-03-03 2001-09-25 Applied Komatsu Technology, Inc. Method of annealing large area glass substrates
US7914619B2 (en) * 2008-11-03 2011-03-29 International Business Machines Corporation Thick epitaxial silicon by grain reorientation annealing and applications thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634605A (en) * 1984-05-23 1987-01-06 Wiesmann Harold J Method for the indirect deposition of amorphous silicon and polycrystalline silicone and alloys thereof
JPS61101410A (ja) * 1984-10-24 1986-05-20 Hiroshi Ishizuka 多結晶珪素の製造法及びそのための装置
GB2191510A (en) * 1986-04-16 1987-12-16 Gen Electric Plc Depositing doped polysilicon films

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EP0405451A1 (de) 1991-01-02
JPH0347967A (ja) 1991-02-28
KR100217147B1 (ko) 1999-09-01
EP0405451B1 (de) 1993-10-27
DE59003200D1 (de) 1993-12-02
JP3059195B2 (ja) 2000-07-04

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