KR910000077B1 - 폴리(아릴렌 설파이드)프린트 회로판의 제조방법 - Google Patents

폴리(아릴렌 설파이드)프린트 회로판의 제조방법 Download PDF

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Publication number
KR910000077B1
KR910000077B1 KR1019830003858A KR830003858A KR910000077B1 KR 910000077 B1 KR910000077 B1 KR 910000077B1 KR 1019830003858 A KR1019830003858 A KR 1019830003858A KR 830003858 A KR830003858 A KR 830003858A KR 910000077 B1 KR910000077 B1 KR 910000077B1
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KR
South Korea
Prior art keywords
poly
plate
arylene sulfide
conductive metal
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019830003858A
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English (en)
Korean (ko)
Other versions
KR840006119A (ko
Inventor
데니프 볼팅하우스 해롤드
죤 뵈케 폴
에드워어드 베너필드 쥬니어 로버어트
에버라드 리런드 죤
Original Assignee
휘립프스 피트로오리암 캄파니
제이 이이 휘립프스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23621990&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR910000077(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 휘립프스 피트로오리암 캄파니, 제이 이이 휘립프스 filed Critical 휘립프스 피트로오리암 캄파니
Publication of KR840006119A publication Critical patent/KR840006119A/ko
Application granted granted Critical
Publication of KR910000077B1 publication Critical patent/KR910000077B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Burglar Alarm Systems (AREA)
KR1019830003858A 1982-08-20 1983-08-18 폴리(아릴렌 설파이드)프린트 회로판의 제조방법 Expired KR910000077B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US409792 1982-08-20
US06/409,792 US4532015A (en) 1982-08-20 1982-08-20 Poly(arylene sulfide) printed circuit boards

Publications (2)

Publication Number Publication Date
KR840006119A KR840006119A (ko) 1984-11-21
KR910000077B1 true KR910000077B1 (ko) 1991-01-19

Family

ID=23621990

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830003858A Expired KR910000077B1 (ko) 1982-08-20 1983-08-18 폴리(아릴렌 설파이드)프린트 회로판의 제조방법

Country Status (9)

Country Link
US (1) US4532015A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0103149B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5954290A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR910000077B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE33436T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1232864A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3376245D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ES (1) ES525046A0 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SG (1) SG59588G (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
US4803097A (en) * 1987-04-20 1989-02-07 Allied-Signal Inc. Metal plating of plastic materials
DE3731167A1 (de) * 1987-09-14 1989-05-11 Schering Ag Verfahren zur haftfesten metallisierung von emails
DE3901029A1 (de) * 1989-01-14 1990-07-19 Bayer Ag Verfahren zum metallisieren von formkoerpern aus polyarylensulfiden
JP2525030B2 (ja) * 1988-04-07 1996-08-14 北陸電気工業株式会社 印刷回路基板の製造方法
US5230927A (en) * 1989-02-16 1993-07-27 Mitsubishi Gas Chemical Company, Inc. Method for metal-plating resin molded articles and metal-plated resin molded articles
US5200271A (en) * 1989-02-22 1993-04-06 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin compositions and molded articles
JPH02219858A (ja) * 1989-02-22 1990-09-03 Idemitsu Petrochem Co Ltd ポリアリーレンスルフィド樹脂組成物及びその成形体
US5300208A (en) * 1989-08-14 1994-04-05 International Business Machines Corporation Fabrication of printed circuit boards using conducting polymer
DE3931649A1 (de) * 1989-09-22 1991-04-04 Basf Ag Thermoplastische formmassen aus faserverstaerkten hochtemperaturbestaendigen thermoplasten
US5211803A (en) * 1989-10-02 1993-05-18 Phillips Petroleum Company Producing metal patterns on a plastic surface
JPH03197687A (ja) * 1989-12-26 1991-08-29 Mitsubishi Gas Chem Co Inc 樹脂成形品の金属メッキ前処理方法
DE4008462A1 (de) * 1990-03-16 1991-09-19 Bayer Ag Polyarylensulfid-leiterplatten mit guter metallhaftung
JPH05170956A (ja) * 1991-06-14 1993-07-09 Kureha Chem Ind Co Ltd 樹脂成形品の金属化に好適な粗面化方法
JPH0525298A (ja) * 1991-06-19 1993-02-02 Kureha Chem Ind Co Ltd 樹脂成形品の金属化に好適な粗面化方法
US5509557A (en) * 1994-01-24 1996-04-23 International Business Machines Corporation Depositing a conductive metal onto a substrate
US5591354A (en) * 1994-10-21 1997-01-07 Jp Laboratories, Inc. Etching plastics with nitrosyls
DE19620935A1 (de) * 1996-05-24 1997-11-27 Daimler Benz Ag Verfahren zur haftfesten Beschichtung von Polymeren
WO2002004705A1 (fr) * 1999-01-20 2002-01-17 National Institute Of Advanced Industrial Science And Technology Procede de traitement preliminaire d'un materiau devant etre soumis a un depot autocatalytique
US8263196B2 (en) * 2003-09-25 2012-09-11 Hewlett-Packard Development Company, L.P. Protection of printed images from gasfade
US20060204780A1 (en) * 2005-03-14 2006-09-14 Vega Luis F Development of low gloss coated surfaces on vehicle wheels
CN108695585B (zh) 2017-04-12 2021-03-16 日本电产株式会社 高频构件的制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3354129A (en) 1963-11-27 1967-11-21 Phillips Petroleum Co Production of polymers from aromatic compounds
US3567594A (en) * 1969-03-17 1971-03-02 Phillips Petroleum Co Electroplating plastics
US3770571A (en) * 1969-04-02 1973-11-06 Richardson Co Fabrication of printed circuit boards
GB1463304A (en) * 1973-09-25 1977-02-02 Canning & Co Ltd W Treatment of the surfaces of synthetic polymeric materials for electroless metal deposition
DE2424702A1 (de) * 1974-05-21 1975-12-11 Standard Elektrik Lorenz Ag Verfahren zur herstellung von traegerplatten fuer duenn- und dickschichtschaltungen
FR2427350B1 (fr) * 1978-05-30 1986-08-14 Asahi Glass Co Ltd Poly(sulfure de phenylene) moulable
DE2930710A1 (de) * 1979-07-28 1981-02-19 Bayer Ag Verfahren zur herstellung von polyarylensulfiden
US4447471A (en) * 1982-12-30 1984-05-08 Gould Inc. Method of treating thermoplastic surfaces
JPS6052943A (ja) * 1983-09-02 1985-03-26 Victor Co Of Japan Ltd ドロツプアウト持続検出装置
JPS6153880A (ja) * 1984-08-23 1986-03-17 Fujitsu Ltd 文字画像表示制御装置

Also Published As

Publication number Publication date
DE3376245D1 (en) 1988-05-11
US4532015A (en) 1985-07-30
ATE33436T1 (de) 1988-04-15
ES8405577A1 (es) 1984-06-01
JPH0326549B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-04-11
SG59588G (en) 1989-03-10
KR840006119A (ko) 1984-11-21
JPS5954290A (ja) 1984-03-29
EP0103149A1 (en) 1984-03-21
EP0103149B1 (en) 1988-04-06
ES525046A0 (es) 1984-06-01
CA1232864A (en) 1988-02-16

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