ES525046A0 - Un procedimiento mejorado para producir un panel para un circuito impreso - Google Patents

Un procedimiento mejorado para producir un panel para un circuito impreso

Info

Publication number
ES525046A0
ES525046A0 ES525046A ES525046A ES525046A0 ES 525046 A0 ES525046 A0 ES 525046A0 ES 525046 A ES525046 A ES 525046A ES 525046 A ES525046 A ES 525046A ES 525046 A0 ES525046 A0 ES 525046A0
Authority
ES
Spain
Prior art keywords
printed circuit
panel
producing
improved procedure
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES525046A
Other languages
English (en)
Other versions
ES8405577A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phillips Petroleum Co
Original Assignee
Phillips Petroleum Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23621990&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES525046(A0) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Phillips Petroleum Co filed Critical Phillips Petroleum Co
Publication of ES8405577A1 publication Critical patent/ES8405577A1/es
Publication of ES525046A0 publication Critical patent/ES525046A0/es
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Burglar Alarm Systems (AREA)
ES525046A 1982-08-20 1983-08-19 Un procedimiento mejorado para producir un panel para un circuito impreso Granted ES525046A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/409,792 US4532015A (en) 1982-08-20 1982-08-20 Poly(arylene sulfide) printed circuit boards

Publications (2)

Publication Number Publication Date
ES8405577A1 ES8405577A1 (es) 1984-06-01
ES525046A0 true ES525046A0 (es) 1984-06-01

Family

ID=23621990

Family Applications (1)

Application Number Title Priority Date Filing Date
ES525046A Granted ES525046A0 (es) 1982-08-20 1983-08-19 Un procedimiento mejorado para producir un panel para un circuito impreso

Country Status (9)

Country Link
US (1) US4532015A (es)
EP (1) EP0103149B1 (es)
JP (1) JPS5954290A (es)
KR (1) KR910000077B1 (es)
AT (1) ATE33436T1 (es)
CA (1) CA1232864A (es)
DE (1) DE3376245D1 (es)
ES (1) ES525046A0 (es)
SG (1) SG59588G (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
US4803097A (en) * 1987-04-20 1989-02-07 Allied-Signal Inc. Metal plating of plastic materials
DE3731167A1 (de) * 1987-09-14 1989-05-11 Schering Ag Verfahren zur haftfesten metallisierung von emails
DE3901029A1 (de) * 1989-01-14 1990-07-19 Bayer Ag Verfahren zum metallisieren von formkoerpern aus polyarylensulfiden
JP2525030B2 (ja) * 1988-04-07 1996-08-14 北陸電気工業株式会社 印刷回路基板の製造方法
US5230927A (en) * 1989-02-16 1993-07-27 Mitsubishi Gas Chemical Company, Inc. Method for metal-plating resin molded articles and metal-plated resin molded articles
US5200271A (en) * 1989-02-22 1993-04-06 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin compositions and molded articles
JPH02219858A (ja) * 1989-02-22 1990-09-03 Idemitsu Petrochem Co Ltd ポリアリーレンスルフィド樹脂組成物及びその成形体
US5300208A (en) * 1989-08-14 1994-04-05 International Business Machines Corporation Fabrication of printed circuit boards using conducting polymer
DE3931649A1 (de) * 1989-09-22 1991-04-04 Basf Ag Thermoplastische formmassen aus faserverstaerkten hochtemperaturbestaendigen thermoplasten
US5211803A (en) * 1989-10-02 1993-05-18 Phillips Petroleum Company Producing metal patterns on a plastic surface
JPH03197687A (ja) * 1989-12-26 1991-08-29 Mitsubishi Gas Chem Co Inc 樹脂成形品の金属メッキ前処理方法
DE4008462A1 (de) * 1990-03-16 1991-09-19 Bayer Ag Polyarylensulfid-leiterplatten mit guter metallhaftung
JPH05170956A (ja) * 1991-06-14 1993-07-09 Kureha Chem Ind Co Ltd 樹脂成形品の金属化に好適な粗面化方法
JPH0525298A (ja) * 1991-06-19 1993-02-02 Kureha Chem Ind Co Ltd 樹脂成形品の金属化に好適な粗面化方法
US5509557A (en) * 1994-01-24 1996-04-23 International Business Machines Corporation Depositing a conductive metal onto a substrate
US5591354A (en) * 1994-10-21 1997-01-07 Jp Laboratories, Inc. Etching plastics with nitrosyls
DE19620935A1 (de) * 1996-05-24 1997-11-27 Daimler Benz Ag Verfahren zur haftfesten Beschichtung von Polymeren
WO2002004705A1 (fr) * 1999-01-20 2002-01-17 National Institute Of Advanced Industrial Science And Technology Procede de traitement preliminaire d'un materiau devant etre soumis a un depot autocatalytique
US8263196B2 (en) * 2003-09-25 2012-09-11 Hewlett-Packard Development Company, L.P. Protection of printed images from gasfade
US20060204780A1 (en) * 2005-03-14 2006-09-14 Vega Luis F Development of low gloss coated surfaces on vehicle wheels
CN108695585B (zh) 2017-04-12 2021-03-16 日本电产株式会社 高频构件的制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3354129A (en) 1963-11-27 1967-11-21 Phillips Petroleum Co Production of polymers from aromatic compounds
US3567594A (en) * 1969-03-17 1971-03-02 Phillips Petroleum Co Electroplating plastics
US3770571A (en) * 1969-04-02 1973-11-06 Richardson Co Fabrication of printed circuit boards
GB1463304A (en) * 1973-09-25 1977-02-02 Canning & Co Ltd W Treatment of the surfaces of synthetic polymeric materials for electroless metal deposition
DE2424702A1 (de) * 1974-05-21 1975-12-11 Standard Elektrik Lorenz Ag Verfahren zur herstellung von traegerplatten fuer duenn- und dickschichtschaltungen
FR2427350B1 (fr) * 1978-05-30 1986-08-14 Asahi Glass Co Ltd Poly(sulfure de phenylene) moulable
DE2930710A1 (de) * 1979-07-28 1981-02-19 Bayer Ag Verfahren zur herstellung von polyarylensulfiden
US4447471A (en) * 1982-12-30 1984-05-08 Gould Inc. Method of treating thermoplastic surfaces
JPS6052943A (ja) * 1983-09-02 1985-03-26 Victor Co Of Japan Ltd ドロツプアウト持続検出装置
JPS6153880A (ja) * 1984-08-23 1986-03-17 Fujitsu Ltd 文字画像表示制御装置

Also Published As

Publication number Publication date
ES8405577A1 (es) 1984-06-01
KR840006119A (ko) 1984-11-21
EP0103149B1 (en) 1988-04-06
KR910000077B1 (ko) 1991-01-19
SG59588G (en) 1989-03-10
ATE33436T1 (de) 1988-04-15
JPH0326549B2 (es) 1991-04-11
JPS5954290A (ja) 1984-03-29
US4532015A (en) 1985-07-30
CA1232864A (en) 1988-02-16
EP0103149A1 (en) 1984-03-21
DE3376245D1 (en) 1988-05-11

Similar Documents

Publication Publication Date Title
ES525046A0 (es) Un procedimiento mejorado para producir un panel para un circuito impreso
SE8203005L (sv) Elektrofri legeringspletering
SE7708675L (sv) Kretskort
GB1266000A (es)
DK291585D0 (da) Kredsloebsplade og fremgangsmaade til fremstilling af samme.
AU512805B2 (en) Control ofan electroless copper plating bath
MY100046A (en) Printed circuit boards
GB2086139B (en) Method of producing printed circuit boards with holes having metallized walls
SE8506105D0 (sv) Metallnet
GB2120017B (en) Making printed circuit boards having plated through-holes
JPS57155819A (en) Printed circuit mounted with resonator and method of producing printed circuit
ES8401684A1 (es) Dispositivo conectador para tarjetas de circuitos impresos.
GB2017416A (en) Circuit board manufacturing method
GB1473223A (en) Circuit board blanks
CH636744GA3 (es)
GB1247908A (en) Copperplating process and agents for use in this process
JPS525467A (en) Method of plating throughhholes opposite copper surfaces of printed circuit wiring board
JPS5372167A (en) Method of plating electrolytic through hole of printed circuit board
KR830005811A (ko) 인쇄 회로용 구리박판 및 그의 제조방법
JPS5758393A (en) Method of producing flexible printed circuit board with through hole
JPS5758394A (en) Method of producing flexible printed circuit board with through hole
JPS5724102A (en) Microwave intergrated circuit
JPS5222078A (en) Insulating board for plating
JPS537541A (en) Plating method of printed circuit board
JPS5342370A (en) Method of producing chemically plated printed circuit board stacking board

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970203