KR900018313A - 다이 결합용 접착 테이프 - Google Patents
다이 결합용 접착 테이프 Download PDFInfo
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- KR900018313A KR900018313A KR1019890007051A KR890007051A KR900018313A KR 900018313 A KR900018313 A KR 900018313A KR 1019890007051 A KR1019890007051 A KR 1019890007051A KR 890007051 A KR890007051 A KR 890007051A KR 900018313 A KR900018313 A KR 900018313A
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 및 2도는 각각 본 발명의 다이(die) 결합용 접착 테이프의 확장된 단면도이다.
Claims (2)
- 하나이상의 지지체면 상에 박리층 및 박리층에 결합된 접착층을 가지며, 접착층의 노출된 표면은 중심선의 평균 조도(roughness) (Ra)가 2.5μm보다 크지 않고, 최대 높이(Rmax)가 20μm보다 크지 않은 거울-형 표면인 박리 필름을 함유함을 특징으로 하는 다이 결합용 접착 테이프.
- 제1항에 있어서, 거울-형 표면의 중심선의 평균 조도(Ra)가 0.5 내지 2.3μm이고, 최대높이(Rmax)가 3.0 내지 15.5μm인 접착 테이프.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63-131077 | 1988-05-28 | ||
JP131077/88 | 1988-05-28 | ||
JP63131077A JPH01299884A (ja) | 1988-05-28 | 1988-05-28 | ダイボンディング接着テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900018313A true KR900018313A (ko) | 1990-12-21 |
KR970009574B1 KR970009574B1 (ko) | 1997-06-14 |
Family
ID=15049449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890007051A KR970009574B1 (ko) | 1988-05-28 | 1989-05-26 | 다이 접합용 접착 제이프 |
Country Status (3)
Country | Link |
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US (1) | US5032438A (ko) |
JP (1) | JPH01299884A (ko) |
KR (1) | KR970009574B1 (ko) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5910010A (en) * | 1994-04-26 | 1999-06-08 | Hitachi, Ltd. | Semiconductor integrated circuit device, and process and apparatus for manufacturing the same |
JP3535281B2 (ja) * | 1995-08-31 | 2004-06-07 | 株式会社巴川製紙所 | 電子部品用接着テープ及び液状接着剤 |
TW326566B (en) | 1996-04-19 | 1998-02-11 | Hitachi Chemical Co Ltd | Composite film and lead frame with composite film attached |
JP3928753B2 (ja) * | 1996-08-06 | 2007-06-13 | 日立化成工業株式会社 | マルチチップ実装法、および接着剤付チップの製造方法 |
US5972152A (en) | 1997-05-16 | 1999-10-26 | Micron Communications, Inc. | Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier |
US6687969B1 (en) | 1997-05-16 | 2004-02-10 | Micron Technology, Inc. | Methods of fixturing flexible substrates and methods of processing flexible substrates |
JP2000349101A (ja) * | 1999-06-07 | 2000-12-15 | Lintec Corp | 転写用テープおよびその使用方法 |
JP3594853B2 (ja) * | 1999-11-08 | 2004-12-02 | 日東電工株式会社 | 加熱剥離型粘着シート |
JP4651805B2 (ja) * | 2000-11-08 | 2011-03-16 | 日東電工株式会社 | 加熱剥離型粘着シート |
DE10056908A1 (de) * | 2000-11-16 | 2002-05-23 | Merck Patent Gmbh | Verfahren zum Verbinden von Kunststoffteilen |
JP2003069262A (ja) * | 2001-08-22 | 2003-03-07 | Shin Etsu Chem Co Ltd | 放熱シートの接着方法 |
US6923881B2 (en) * | 2002-05-27 | 2005-08-02 | Fuji Photo Film Co., Ltd. | Method for producing organic electroluminescent device and transfer material used therein |
JP2004083633A (ja) * | 2002-08-23 | 2004-03-18 | Nihon Micro Coating Co Ltd | 研磨パッド及び研磨テープ用接着テープ |
JP4197447B2 (ja) * | 2003-03-31 | 2008-12-17 | 富士フイルム株式会社 | 有機電界発光素子の製造方法及びその有機電界発光素子 |
US20050058837A1 (en) * | 2003-09-16 | 2005-03-17 | Farnworth Warren M. | Processes for facilitating removal of stereolithographically fabricated objects from platens of stereolithographic fabrication equipment, object release elements for effecting such processes, systems and fabrication processes employing the object release elements, and objects which have been fabricated using the object release elements |
JP4646508B2 (ja) * | 2003-10-01 | 2011-03-09 | 日東電工株式会社 | 両面接着テープ又はシートおよびその製造方法 |
US20050121139A1 (en) * | 2003-12-03 | 2005-06-09 | Texas Instruments Incorporated | System and method used in attaching die for ball grid arrays |
JP4945881B2 (ja) * | 2004-01-23 | 2012-06-06 | 日立化成工業株式会社 | 回路接続用支持体付接着剤、及びそれを用いた回路接続構造体 |
JP5046366B2 (ja) * | 2005-10-20 | 2012-10-10 | 信越化学工業株式会社 | 接着剤組成物及び該接着剤からなる接着層を備えたシート |
JP5157350B2 (ja) * | 2007-09-28 | 2013-03-06 | Tdk株式会社 | 積層フィルムおよび積層セラミック電子部品の製造方法 |
JP2009235402A (ja) * | 2008-03-05 | 2009-10-15 | Hitachi Chem Co Ltd | 接着フィルム |
KR101073698B1 (ko) * | 2009-09-07 | 2011-10-14 | 도레이첨단소재 주식회사 | 점착테이프와 리드프레임의 라미네이션 방법 |
JP5485083B2 (ja) * | 2010-08-31 | 2014-05-07 | 日東電工株式会社 | 熱硬化型接着テープ又はシート |
US9754861B2 (en) * | 2014-10-10 | 2017-09-05 | Stmicroelectronics Pte Ltd | Patterned lead frame |
JP6243313B2 (ja) * | 2014-10-15 | 2017-12-06 | 藤森工業株式会社 | 異方粘着性シート |
US10109563B2 (en) | 2017-01-05 | 2018-10-23 | Stmicroelectronics, Inc. | Modified leadframe design with adhesive overflow recesses |
WO2019078017A1 (ja) * | 2017-10-20 | 2019-04-25 | Dic株式会社 | 物品の製造方法 |
JP6983123B2 (ja) * | 2018-07-24 | 2021-12-17 | 信越化学工業株式会社 | 粘着性基材、粘着性基材を有する転写装置及び粘着性基材の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55164274A (en) * | 1979-06-08 | 1980-12-20 | Yokohama Rubber Co Ltd:The | Preparation of film adhesive and its device |
JPS6053076B2 (ja) * | 1979-06-08 | 1985-11-22 | 横浜ゴム株式会社 | シ−ト状接着剤の製造方法およびその装置 |
JPS5980482A (ja) * | 1982-10-29 | 1984-05-09 | Hitachi Chem Co Ltd | 導電性粘着シ−ト |
US4959008A (en) * | 1984-04-30 | 1990-09-25 | National Starch And Chemical Investment Holding Corporation | Pre-patterned circuit board device-attach adhesive transfer system |
US4761335A (en) * | 1985-03-07 | 1988-08-02 | National Starch And Chemical Corporation | Alpha-particle protection of semiconductor devices |
JP2577938B2 (ja) * | 1987-12-24 | 1997-02-05 | 尾池工業株式会社 | 高反射フイルム |
US4873140A (en) * | 1988-04-27 | 1989-10-10 | Minnesota Mining And Manufacturing Company | Articles having low adhesion articles having coatings thereon |
-
1988
- 1988-05-28 JP JP63131077A patent/JPH01299884A/ja active Pending
-
1989
- 1989-05-25 US US07/356,768 patent/US5032438A/en not_active Expired - Lifetime
- 1989-05-26 KR KR1019890007051A patent/KR970009574B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH01299884A (ja) | 1989-12-04 |
US5032438A (en) | 1991-07-16 |
KR970009574B1 (ko) | 1997-06-14 |
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