KR900015587A - 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로 부터의 프린트 기판의 절단장치 - Google Patents

전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로 부터의 프린트 기판의 절단장치 Download PDF

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KR900015587A
KR900015587A KR1019900002691A KR900002691A KR900015587A KR 900015587 A KR900015587 A KR 900015587A KR 1019900002691 A KR1019900002691 A KR 1019900002691A KR 900002691 A KR900002691 A KR 900002691A KR 900015587 A KR900015587 A KR 900015587A
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support frame
material substrate
cutting
printed circuit
raw material
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KR1019900002691A
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KR970004752B1 (ko
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유우지 사까모도
다까시 가와가미
신야 오오구보
노브유끼 나카무라
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사또오 켄이찌로오
로-무 가부시기가이샤
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Priority claimed from JP1989026342U external-priority patent/JPH0744405Y2/ja
Priority claimed from JP1141567A external-priority patent/JPH0648749B2/ja
Application filed by 사또오 켄이찌로오, 로-무 가부시기가이샤 filed Critical 사또오 켄이찌로오
Publication of KR900015587A publication Critical patent/KR900015587A/ko
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/0909Preformed cutting or breaking line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927Machine readable code, e.g. bar code
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49789Obtaining plural product pieces from unitary workpiece
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49815Disassembling
    • Y10T29/49819Disassembling with conveying of work or disassembled work part
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53261Means to align and advance work part

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

내용 없음.

Description

전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로 부터의 프린트, 기판의 절단장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예에 사용하는 소재기판의 사시도,
제4도는 절단장치의 실시예를 표시하는 사시도,
제5도는 제4도의 V-V에서 바라본 확대단면도.

Claims (5)

  1. 소정의 간격을 두고 평행형상으로 대향하는 좌우한쌍의 장척형상의 서포오트
    프레임(2)과, 각각이 전기한 양 서포오트프레임(2)의 각각에 대하여 최소한 한 개의 연결핀(5)을 개재하여 일체로 형성되고, 전기한 양 서포오트프레임(2) 사이에 그 서포오트 프레임(2)의 길이방향으로 소정의 간격을 두고 배치된 복수의 단위 프린트기판(3)을 구비하여 이루어지는 소재기판(1)을 사용하고, 이 소재기판(1)을 수송하면서 전기한 각 단위 프린트기판(3)에 대하여 각종의 전자부품등을탑재한 다음 전기한 각 단위프린트기판(3)을 전기한 양 서포오트프레임(2)에서 그 양 서포오트프레임(2)에 대한 연결편(5)의 부위에서 절단하여 떼어내는 것을 특징으로 하는 전자장치의 제조방법.
  2. 소정의 간격을 두고 평행형상으로 대향하는 좌우 한쌍의 장척형상의 서포오트 프레임(2)과 각각이 전기한 양 서포오트프레임(1)의 각각에 대하여 최소한 1개의 연결편(5)을 개재하여 일체로 형성되고, 전기한 양 서포오트프레임(2) 사이에 그 서포오트 프레임(2)의 길이방향으로 소정의 간격을 두고 배치된 복수의 단위 프린트기판(3)을 구비함과 아울러, 전기한 양 서포오트프레임(2)의 어느 한쪽 또는, 양쪽에 기종 판별용 패턴(4)을 설치한 것을 특징으로 하는 전자장치의 제조에 있어서 사용하는 소재기판.
  3. 제2항에 있어서, 양 서포오트프레임(2)중 한쪽의 서포오트프레임에 기종 판별용 패턴(4)을 설치하는 한편, 다른쪽의 서포오트프레임에 각 단위 프린트기판에 있어서의 배선 패??의 한쪽에 전기적으로 도통(道通)하는 코몬단자부(11)를 설치한 것을 특징으로 하는 전자장치의 제조에 있어서 사용하는 소재기판.
  4. 소정의 간격을 두고 평행형상으로 대향하는 좌우한쌍의 장척형상의 서포오트프레임(2)과, 각각이 전기한 양 서포오트프레임의 각각에 대하여 최소한1개의 연결편(5)을 개재하여 일체적으로 형성되고, 전기한 양 서포오트프레임(2)사이에 그 서포오트프레임(2)의 길이방향으로 소정의 간격을 두고 배치된 복수의 단위 프린트기판(3)을 구비하여 되는 소재기판(1)을 소송하는 경로에, 전기한 소재기판의 표면에 평행한 평면상에서 서로 직각으로 표차되는 X축선과 Y측선과의 2개의 축선방향을 따라서 각각 왕복이동 하도록 한 XX테이블(20)을 설치하고, 그 XX테이블(20)에 회전하는 스핀들축(25)을 전기한 소재기판으로 향하여 뻗도록 축받이하고, 그 스핀들축(25)의 선단에 전기한 소재기판(1)에서의 각 연결편(5)을 절단하기 위한 회전식의 절삭 또는 연삭용공구(26)을 부착한 것을 특징으로 하는 소재 기판으로 부터의 프린트기판의 절단장치.
  5. 제4항에 있어서, 전기한 절삭 또는 연산용공구(26)의 근방의 부위에 흡인닥트(27)를 개구시킨 것을 특징으로 하는 소재기판으로 부터의 프린트기판의 절단장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900002691A 1989-03-07 1990-02-28 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로부터의 프린트기판의 절단장치 KR970004752B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP???1-?26342 1989-03-07
JP1-26342(?) 1989-03-07
JP1989026342U JPH0744405Y2 (ja) 1989-03-07 1989-03-07 プリント基板の切断装置
JP1-141567(?) 1989-06-02
JP???1-?141567 1989-06-02
JP1141567A JPH0648749B2 (ja) 1989-06-02 1989-06-02 電子部品製造用基板

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KR900015587A true KR900015587A (ko) 1990-10-27
KR970004752B1 KR970004752B1 (ko) 1997-04-03

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JP3452533B2 (ja) * 2000-05-11 2003-09-29 ファナック株式会社 目的形状部切離し装置、該装置を搭載したロボット及び切離し方法
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JP4394432B2 (ja) * 2003-12-15 2010-01-06 日東電工株式会社 配線回路基板保持シートの製造方法
WO2006044739A2 (en) * 2004-10-18 2006-04-27 Intraglobal Corporation Microelectronics package and method
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AT12722U1 (de) * 2010-03-16 2012-10-15 Austria Tech & System Tech Verfahren und verbund zum bearbeiten bzw. behandeln einer mehrzahl von leiterplatten sowie verwendung hiefür
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KR101885786B1 (ko) 2016-10-26 2018-08-06 (주)아진웰텍 가우징 토치

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US5027505A (en) 1991-07-02

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