KR900015587A - 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로 부터의 프린트 기판의 절단장치 - Google Patents
전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로 부터의 프린트 기판의 절단장치 Download PDFInfo
- Publication number
- KR900015587A KR900015587A KR1019900002691A KR900002691A KR900015587A KR 900015587 A KR900015587 A KR 900015587A KR 1019900002691 A KR1019900002691 A KR 1019900002691A KR 900002691 A KR900002691 A KR 900002691A KR 900015587 A KR900015587 A KR 900015587A
- Authority
- KR
- South Korea
- Prior art keywords
- support frame
- material substrate
- cutting
- printed circuit
- raw material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09927—Machine readable code, e.g. bar code
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49819—Disassembling with conveying of work or disassembled work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예에 사용하는 소재기판의 사시도,
제4도는 절단장치의 실시예를 표시하는 사시도,
제5도는 제4도의 V-V에서 바라본 확대단면도.
Claims (5)
- 소정의 간격을 두고 평행형상으로 대향하는 좌우한쌍의 장척형상의 서포오트프레임(2)과, 각각이 전기한 양 서포오트프레임(2)의 각각에 대하여 최소한 한 개의 연결핀(5)을 개재하여 일체로 형성되고, 전기한 양 서포오트프레임(2) 사이에 그 서포오트 프레임(2)의 길이방향으로 소정의 간격을 두고 배치된 복수의 단위 프린트기판(3)을 구비하여 이루어지는 소재기판(1)을 사용하고, 이 소재기판(1)을 수송하면서 전기한 각 단위 프린트기판(3)에 대하여 각종의 전자부품등을탑재한 다음 전기한 각 단위프린트기판(3)을 전기한 양 서포오트프레임(2)에서 그 양 서포오트프레임(2)에 대한 연결편(5)의 부위에서 절단하여 떼어내는 것을 특징으로 하는 전자장치의 제조방법.
- 소정의 간격을 두고 평행형상으로 대향하는 좌우 한쌍의 장척형상의 서포오트 프레임(2)과 각각이 전기한 양 서포오트프레임(1)의 각각에 대하여 최소한 1개의 연결편(5)을 개재하여 일체로 형성되고, 전기한 양 서포오트프레임(2) 사이에 그 서포오트 프레임(2)의 길이방향으로 소정의 간격을 두고 배치된 복수의 단위 프린트기판(3)을 구비함과 아울러, 전기한 양 서포오트프레임(2)의 어느 한쪽 또는, 양쪽에 기종 판별용 패턴(4)을 설치한 것을 특징으로 하는 전자장치의 제조에 있어서 사용하는 소재기판.
- 제2항에 있어서, 양 서포오트프레임(2)중 한쪽의 서포오트프레임에 기종 판별용 패턴(4)을 설치하는 한편, 다른쪽의 서포오트프레임에 각 단위 프린트기판에 있어서의 배선 패??의 한쪽에 전기적으로 도통(道通)하는 코몬단자부(11)를 설치한 것을 특징으로 하는 전자장치의 제조에 있어서 사용하는 소재기판.
- 소정의 간격을 두고 평행형상으로 대향하는 좌우한쌍의 장척형상의 서포오트프레임(2)과, 각각이 전기한 양 서포오트프레임의 각각에 대하여 최소한1개의 연결편(5)을 개재하여 일체적으로 형성되고, 전기한 양 서포오트프레임(2)사이에 그 서포오트프레임(2)의 길이방향으로 소정의 간격을 두고 배치된 복수의 단위 프린트기판(3)을 구비하여 되는 소재기판(1)을 소송하는 경로에, 전기한 소재기판의 표면에 평행한 평면상에서 서로 직각으로 표차되는 X축선과 Y측선과의 2개의 축선방향을 따라서 각각 왕복이동 하도록 한 XX테이블(20)을 설치하고, 그 XX테이블(20)에 회전하는 스핀들축(25)을 전기한 소재기판으로 향하여 뻗도록 축받이하고, 그 스핀들축(25)의 선단에 전기한 소재기판(1)에서의 각 연결편(5)을 절단하기 위한 회전식의 절삭 또는 연삭용공구(26)을 부착한 것을 특징으로 하는 소재 기판으로 부터의 프린트기판의 절단장치.
- 제4항에 있어서, 전기한 절삭 또는 연산용공구(26)의 근방의 부위에 흡인닥트(27)를 개구시킨 것을 특징으로 하는 소재기판으로 부터의 프린트기판의 절단장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP???1-?26342 | 1989-03-07 | ||
JP1-26342(?) | 1989-03-07 | ||
JP1989026342U JPH0744405Y2 (ja) | 1989-03-07 | 1989-03-07 | プリント基板の切断装置 |
JP1-141567(?) | 1989-06-02 | ||
JP???1-?141567 | 1989-06-02 | ||
JP1141567A JPH0648749B2 (ja) | 1989-06-02 | 1989-06-02 | 電子部品製造用基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900015587A true KR900015587A (ko) | 1990-10-27 |
KR970004752B1 KR970004752B1 (ko) | 1997-04-03 |
Family
ID=26364116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900002691A KR970004752B1 (ko) | 1989-03-07 | 1990-02-28 | 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로부터의 프린트기판의 절단장치 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5027505A (ko) |
KR (1) | KR970004752B1 (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2707871B2 (ja) * | 1991-05-31 | 1998-02-04 | 富士ゼロックス株式会社 | 電子デバイス及びその製造方法 |
US5210922A (en) * | 1991-12-06 | 1993-05-18 | Cencorp, Inc. | Acquiring and maintaining support for and registration with each board during depaneling and transferring of each liberated board to a subsequent station |
US5208729A (en) * | 1992-02-14 | 1993-05-04 | International Business Machines Corporation | Multi-chip module |
JP3024457B2 (ja) * | 1993-09-30 | 2000-03-21 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
JP3552772B2 (ja) * | 1994-01-21 | 2004-08-11 | アマダ・エムエフジー・アメリカ・インコーポレイティド | ミクロジョイント加工用製品分離方法 |
EP0665706A1 (en) * | 1994-01-28 | 1995-08-02 | Molex Incorporated | Method of fabricating flat flexible circuits |
US5630270A (en) * | 1994-03-03 | 1997-05-20 | Alcatel Network Systems, Inc. | Circuit board identification method |
US5938038A (en) * | 1996-08-02 | 1999-08-17 | Dial Tool Industries, Inc. | Parts carrier strip and apparatus for assembling parts in such a strip |
DE19633486C1 (de) * | 1996-08-20 | 1998-01-15 | Heraeus Sensor Nite Gmbh | Verfahren zur Herstellung einer Leiterplatte mit dünnen Leiterbahnen und Anschluß-Kontaktierungsbereichen sowie deren Verwendung |
US5913468A (en) * | 1998-01-06 | 1999-06-22 | Amada Engineering & Service, Inc. | Micro-joint part separator |
DE19813193A1 (de) * | 1998-03-25 | 1999-06-10 | Siemens Ag | Verfahren zum Vereinzeln von elektronischen Modulen |
US6783620B1 (en) | 1998-10-13 | 2004-08-31 | Matsushita Electronic Materials, Inc. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
US6114015A (en) * | 1998-10-13 | 2000-09-05 | Matsushita Electronic Materials, Inc. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
JP3452533B2 (ja) * | 2000-05-11 | 2003-09-29 | ファナック株式会社 | 目的形状部切離し装置、該装置を搭載したロボット及び切離し方法 |
US6637100B1 (en) * | 2002-09-09 | 2003-10-28 | Para Light Electronics Co., Ltd. | Method for mounting external heat dissipater to light emitting diode |
JP4394432B2 (ja) * | 2003-12-15 | 2010-01-06 | 日東電工株式会社 | 配線回路基板保持シートの製造方法 |
WO2006044739A2 (en) * | 2004-10-18 | 2006-04-27 | Intraglobal Corporation | Microelectronics package and method |
US7626831B2 (en) * | 2004-10-21 | 2009-12-01 | Tyco Electronics Corporation | Circuit board retention system |
AT12722U1 (de) * | 2010-03-16 | 2012-10-15 | Austria Tech & System Tech | Verfahren und verbund zum bearbeiten bzw. behandeln einer mehrzahl von leiterplatten sowie verwendung hiefür |
AT12324U1 (de) | 2010-03-16 | 2012-03-15 | Austria Tech & System Tech | Verfahren und verbund zum bearbeiten bzw. behandeln einer mehrzahl von leiterplatten sowie verwendung hiefür |
KR101885786B1 (ko) | 2016-10-26 | 2018-08-06 | (주)아진웰텍 | 가우징 토치 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4202092A (en) * | 1976-09-17 | 1980-05-13 | Matsushita Electric Industrial Co., Ltd. | Automatic part insertion machine |
CA1138122A (en) * | 1978-10-13 | 1982-12-21 | Yoshifumi Okada | Flexible printed circuit wiring board |
US4393083A (en) * | 1980-07-07 | 1983-07-12 | Kikkoman Corporation | Method for producing grape must and wine |
JPH0636393B2 (ja) * | 1987-04-15 | 1994-05-11 | 松下電器産業株式会社 | 電子部品の製造方法 |
US4956605A (en) * | 1989-07-18 | 1990-09-11 | International Business Machines Corporation | Tab mounted chip burn-in apparatus |
-
1990
- 1990-02-28 KR KR1019900002691A patent/KR970004752B1/ko not_active IP Right Cessation
- 1990-03-05 US US07/488,129 patent/US5027505A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR970004752B1 (ko) | 1997-04-03 |
US5027505A (en) | 1991-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR900015587A (ko) | 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로 부터의 프린트 기판의 절단장치 | |
DE69119682D1 (de) | Werkzeugmaschine, insbesondere zur Bearbeitung von gedruckten Schaltungsplatten | |
KR860003756A (ko) | 전자회로 장치와 그 제조방법 | |
MY102558A (en) | Process for mounting chip type circuit elements on printed circuit boards and apparatus therefor. | |
JPH02117812U (ko) | ||
KR880009545A (ko) | 자동 장착장치 | |
DE69123290D1 (de) | Inspektionsgerät für gedruckte Leiterplatten | |
DE69903994D1 (de) | Bohrmaschine mit mindestens zwei Bohrköpfen zum Bearbeiten von Leiterplatten | |
SE9000823D0 (sv) | Gehaeuseteil fuer eine arbeits-bzw. bearbeitungsstation einer fertigungsanlage | |
DE69817492D1 (de) | Werkzeugmaschine mit mehreren Bearbeitungsköpfen für die Bearbeitung von Leiterplatten | |
GB2351256A (en) | Die boards and method of making | |
DE69023972D1 (de) | Randverbinder für gedruckte Leiterplatten. | |
DE69427180D1 (de) | Maschine zum mechanischen Bearbeiten von Platten, insbesondere von Leiterplatten | |
DE59106366D1 (de) | Vorrichtung zum Trennen und Besäumen von Leiterplatten. | |
IN152404B (ko) | ||
DE59002587D1 (de) | Anordnung zum Bohren von Leiterplatten. | |
EP0899069A3 (de) | Verfahren und Vorrichtung zur Weiterverarbeitung von unbesäumten Rohbrettern | |
DE69401567D1 (de) | Bearbeitungskopf zum mechanischen Bearbeiten von Platten, insbesondere von Leiterplatten | |
JPH08181398A (ja) | プリント基板 | |
DK0852014T3 (da) | Fremgangsmåde til at kontrollere printkredsløb | |
KR960028780A (ko) | 부품 장착장치 | |
SU606722A1 (ru) | Устройство дл склеивани шитов | |
ATE120677T1 (de) | Lötvorrichtung zum auflöten von bauelementen auf leiterplatten. | |
CN110102968A (zh) | 一种smt红胶网印刷模板的加工方法 | |
JPS6477988A (en) | Printed wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20020723 Year of fee payment: 6 |
|
LAPS | Lapse due to unpaid annual fee |