KR900015296A - 기판 패키지 - Google Patents

기판 패키지 Download PDF

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Publication number
KR900015296A
KR900015296A KR1019900004415A KR900004415A KR900015296A KR 900015296 A KR900015296 A KR 900015296A KR 1019900004415 A KR1019900004415 A KR 1019900004415A KR 900004415 A KR900004415 A KR 900004415A KR 900015296 A KR900015296 A KR 900015296A
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KR
South Korea
Prior art keywords
package
opposing
sides
wafers
rectangular
Prior art date
Application number
KR1019900004415A
Other languages
English (en)
Other versions
KR970003729B1 (ko
Inventor
그레게르슨 베리
드레슨 래리
Original Assignee
원본미기재
엠파크 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23293349&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR900015296(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 원본미기재, 엠파크 인코포레이티드 filed Critical 원본미기재
Publication of KR900015296A publication Critical patent/KR900015296A/ko
Application granted granted Critical
Publication of KR970003729B1 publication Critical patent/KR970003729B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용 없음.

Description

기판 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 기판 패키지의 투시도,
제2도는 웨이퍼 캐리어의 투시도, 제3도는 바닥 부재의 상면도.

Claims (4)

  1. 웨이퍼 캐리어에서 복수의 웨이퍼, 디스크 또는 기판을 저장 및 수송하기 위한 밀폐가능한 오염방지 콘테인저 패키지 바닥 및 상단에 있어서, 네개의 측부와, 상기 네개의 측부 주위를 테이프로 밀봉하기위한 연속적인 수직면 상기 수직면 상에 위치한 립, 마주보는측상의 마주보는 흑크 래치, 상기 마주보는 측상의 마주보는 핸드 그립 리세스와 패키지 더미를 위한 세워진 바닥면을 포함하는 패키지 바닥과, 네개의 측부와, 상기 네개의 측부 주위를 테이프로 밀봉하기 위한 연속적인 수직면, 상기 수직면 상에 위치한 립, 상기 마주보는 측상의 마주보는 훅크 캐치, 세워진 더미 표면을 가진 아크로된 상단면과, 그리고 상기 패키지 상단 및 바닥 1/2이 패키지 상단과 패키지 바닥 사이에서 캐리어 내의 웨이퍼 또는 기판과 일치하는 웨이퍼 캐리어를 제공함으로써, 상단면의 아래 측상에 위치한 두개의 막대 결합위에 웨이퍼 지지스프링의 두개 로우를 포함하는 패키지 상단과, 그리고, 마주보는 밀폐된 측벽과, 상기 측벽과 결합하는 후벽 및 가로대, 그리고 로붓을 사용하기 위한 상기 캐리어상의 수단을 포함하는 웨이퍼 캐리어를 구비함을 특징으로 하는 기판 패키지.
  2. 복수의 웨이퍼, 디스크 또는 기판을 포함하기 위한 장치에 있어서, 핸드 그립 요면을 가지는 직사각형의 패키지 바닥과, 이동할 수 있는 웨이퍼 캐리어가 상기 직사각형의 패키지 바닥과 끼워 맞춰지도록 설치되는 상기 복수의 웨이퍼를 마찰이 있게 끼워 맞추기 위하여, 일정한 간격을 둔 복수의 수직 채널을 갖는 이동할 수 있는 웨이퍼 캐리어와, 상기 복수의 웨이퍼가 상기 이동할 수 있는 웨이퍼 캐리어 내에 마찰이 있게 끼워 맞춰지고, 그리고 상기 이동할 수 있는 웨이퍼 캐리어가 상기 직사각형의 패키지 바닥내에 끼워 맞춰지도록 설치될때, 상기 복수의 웨이퍼를 끼워 맞춰지도록 유지하기 위하여 복수의 센터링 V홈을 가지는 마주보는 관절로 접합된 외팔보 수평 아암을 가지는 상기 직사각형의 패키지 바닥상에 직사각형의 패키지 상단이 밀봉되도록 설치되고, 그리고 상기 직사각형의 패키지 상단이 상기 직사각형의 패키지 바닥상에 밀봉되도록 설치되는 직사각형의 패키지 상단을 구비함을 특징으로 하는 장치.
  3. 제2항에 있어서, 상기 직사각형 패키지 상단의 상기 복수의 마주보는 관절로 접합된 외팔보 수평 아암은, 상기 복수의 스플라인된(splined) 각 쌍이 상이한 복수의 웨이퍼, 디스크 또는 기판상에 끼의 맞춰지도록 유지되는 곳에서, 복수의 스플라인된 마주보는 관절로 접합된 외팔보 수평 아암의 쌍을 배치함을 특징으로 하는 복수의 웨이퍼, 디스크 또는 기판을 포함하는 장치.
  4. 제3항에 있어서, 상기 복수의 스플라인된 마주또는 관절로 접합된 외팔보 수평 아암의 각 쌍은, 상기 두 개의 마주보는 스플라인된 관절로 접합된 외팔보 수평 아암의 각각이 상기 직사각형 패키지 상단으로 각각 부착되는 곳에서, 두 개의 마주보는 스플라인된 외팔보 수평 아암이 관절로 접합되도록 함을 특징으로 하는 장치.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019900004415A 1989-03-31 1990-03-31 기판 패키지 KR970003729B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/331,291 1989-03-31
US07/331,291 US4966284A (en) 1987-07-07 1989-03-31 Substrate package

Publications (2)

Publication Number Publication Date
KR900015296A true KR900015296A (ko) 1990-10-26
KR970003729B1 KR970003729B1 (ko) 1997-03-21

Family

ID=23293349

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900004415A KR970003729B1 (ko) 1989-03-31 1990-03-31 기판 패키지

Country Status (6)

Country Link
US (1) US4966284A (ko)
EP (1) EP0400784B1 (ko)
JP (2) JPH0766939B2 (ko)
KR (1) KR970003729B1 (ko)
AT (1) ATE147542T1 (ko)
DE (1) DE69029604T2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100283960B1 (ko) * 1996-07-12 2001-04-02 플루오로웨어, 아이엔씨. 도어를가진 웨이퍼 캐리어

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JPH0563067A (ja) * 1991-08-30 1993-03-12 Shin Etsu Handotai Co Ltd ウエーハ収納容器の積み重ね構造
JPH0563066A (ja) * 1991-08-30 1993-03-12 Shin Etsu Handotai Co Ltd ウエーハ収納容器の係止構造
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JP4997962B2 (ja) 2006-12-27 2012-08-15 ソニー株式会社 音声出力装置、音声出力方法、音声出力処理用プログラムおよび音声出力システム
JP4858978B2 (ja) * 2007-02-22 2012-01-18 信越ポリマー株式会社 カセット及びこれを用いた基板収納容器
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
US4966284A (en) 1990-10-30
JPH07307381A (ja) 1995-11-21
EP0400784A2 (en) 1990-12-05
KR970003729B1 (ko) 1997-03-21
DE69029604D1 (de) 1997-02-20
ATE147542T1 (de) 1997-01-15
EP0400784B1 (en) 1997-01-08
JPH0766939B2 (ja) 1995-07-19
JPH03114245A (ja) 1991-05-15
EP0400784A3 (en) 1991-07-24
DE69029604T2 (de) 1997-07-24

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