MY106845A - Substrate package - Google Patents
Substrate packageInfo
- Publication number
- MY106845A MY106845A MYPI90001516A MYPI19901516A MY106845A MY 106845 A MY106845 A MY 106845A MY PI90001516 A MYPI90001516 A MY PI90001516A MY PI19901516 A MYPI19901516 A MY PI19901516A MY 106845 A MY106845 A MY 106845A
- Authority
- MY
- Malaysia
- Prior art keywords
- package
- sides
- opposing
- wafers
- wafer
- Prior art date
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
A SEALABLE CONTAMINATION PROOF CONTAINER PACKAGE BOTTOM AND TOP FOR STORING AND TRANSPORTING A PLURALITY OF SUBSTRATE OR WAFERS IN A ROBOTIC WAFER CARRIER. THE PACKAGE BOTTOM INCLUDES FOUR SIDES, A CONTINUOUS VERTICAL SURFACE FOR TAPE SEALING SURROUNDING THE FOUR SIDES, A LIP POSITIONED ON A THE VERTICAL EDGE, OPPOSING HOOK LATCHES ON OPPOSING SIDES, OPPOSING HAND GRIP RECESSES ON THE OPPOSING SIDES AND A RAISED BOTTOM SURFACE FOR PACKAGE STACKING. THE PACKAGE TOP INCLUDES FOUR SIDES, A CONTINUOUS VERTICAL SURFACE FOR TAPE SEALING SURROUNDING THE FOUR SIDES, A LIP POSITIONED ON THE VERTICAL SURFACE, OPPOSING HOOK CATCHES ON THE OPPOSING SIDE, A TOP SURFACE WITH RAISED STACKING SURFACES, AND TWO ROWS OF WAFER SUPPORT SPRINGS POSITIONED ON BARS ON THE UNDERSIDE OF THE TOP SURFACE. THE PACKAGE TOP AND BOTTOM HALVES PROVIDE THAT THE ROBOTIC WAFER CARRIER MATES BETWEEN THE PACKAGE TOP AND PACKAGE BOTTOM WITH THE WAFERS OR SUBSTRATES IN THE CARRIER. THE PACKAGE TOP AND BOTTOM MATE WITH THE UPPER LIP ENGAGED WITH THE LOWER LIP, AND THE CATCHES OF THE TOP ENGAGE WITH THE LATCHES OF THE BOTTOM. THE PACKAGE HALVES ARE DESIGNED IN SUCH A FASHION AS TO PREVENT WAFER OR SUBSTRATE DAMAGE UPON OPENING, IN THAT THE TOP PACKAGE HALF IS MOVED IN A DIRECTION COINCIDING TO THE PLANE OF THE WAFERS OR SUBSTRATES WITH RESPECT TO POSITIONING OF THE CATCHES AND LATCHES ON THE PACKAGE SIDE. APPROPRIATE SIDES OF THE PACKAGE TOP AND BOTTOM ARE PLUMB WITH EACH OTHER PROVIDING FOR A FLUSH PERIMETER FOR EASE OF TAPING. THE RAISED TOP PORTION OF THE TOP PACKAGE HALF AND THE RECESSED BOTTOM OF THE BOTTOM PACKAGE HALF PROVIDES FOR STACKING OF LIKE PACKAGES. IN AN ALTERNATIVE EMBODIMENT, OPPOSING ROWS OF ARTICULATED CANTILEVERED HORIZONTAL ARMS WITH CENTERING V GROOVES ON EACH END FOR ENGAGING A WAFER,DISK OR SUBSTRATE EXTEND INWARDLY FROM THE EDGES OF AN ARCED TOP SURFACE IN THE PACKAGE TOP.(FIG. 36)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI90001516A MY106845A (en) | 1990-09-04 | 1990-09-04 | Substrate package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI90001516A MY106845A (en) | 1990-09-04 | 1990-09-04 | Substrate package |
Publications (1)
Publication Number | Publication Date |
---|---|
MY106845A true MY106845A (en) | 1995-08-30 |
Family
ID=79554103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI90001516A MY106845A (en) | 1990-09-04 | 1990-09-04 | Substrate package |
Country Status (1)
Country | Link |
---|---|
MY (1) | MY106845A (en) |
-
1990
- 1990-09-04 MY MYPI90001516A patent/MY106845A/en unknown
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