CN1218364C - Wafer carrier with stacking adaptor plate - Google Patents
Wafer carrier with stacking adaptor plate Download PDFInfo
- Publication number
- CN1218364C CN1218364C CN018199313A CN01819931A CN1218364C CN 1218364 C CN1218364 C CN 1218364C CN 018199313 A CN018199313 A CN 018199313A CN 01819931 A CN01819931 A CN 01819931A CN 1218364 C CN1218364 C CN 1218364C
- Authority
- CN
- China
- Prior art keywords
- container
- adaptor plate
- chip
- chip container
- stacking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
Abstract
A front opening wafer container has a container portion with a transparent shell and a door to close the open front. The container portion has a machine interface on the bottom of the shell, such as a kinematic coupling, and a receptacle at the top of the shell to receive an accessories, in particular a robotic lifting flange or an adaptor plate. The adaptor plate will ideally have a cooperating machine interface portions to allow stacking of the wafer carriers. The receptacle has, in preferred embodiments, sliding support guides with undercut portions for retention of the robotic lifting flange or the adaptor plate. The accessory will ideally have a detent positioned on the accessories to releasably lock said accessory in place on the container portion.
Description
The application requires the priority of the provisional application 60/251025 of submission on December 4th, 2000, and described application is incorporated herein by reference.
Technical field
The application relates to the carrier that is used for semiconductor wafer, but and relates in particular to a kind of closed container that is used to store and transport wafer.
Background technology
In semiconductor machining industry, utilize the salable shell that is commonly referred to as transportation module depositing and transporting wafer between each procedure of processing and/or between each equipment for many years.Semiconductor chip is to be easy to by such as the contaminants of particle and be celebrated.Take special measure to eliminate the clean room and deposit wafer at this place and wafer process is become pollutant in other environment of circuit.
For in the 200mm scope or littler wafer, utilized the container that is known as SMIF case (standardized mechanical interface), the sealing subenvironment of cleaning is provided.The example of these casees is shown in United States Patent (USP) 4532970 and 4534389.The transparent box-like housing of this SMIF case general using, this housing has the door of lower gate framework or flange and breech locked, and lower gate framework or flange limit the bottom of an opening.Door frame is clamped on the process equipment, and the door of the bottom SMIF case of the door of process equipment and sealing open bottom is simultaneously the sealing processing environment in housing drops to described process equipment downwards.Be positioned on the upper surface inboard of SMIF chamber door and an independent H bar carrier that carries wafer along with chamber door descends, be used near and the described wafer of processing.In this case, deposit with transportation in the weight of wafer act directly on the door.
Semiconductor machining industry is towards using bigger and heavier wafer, the particularly direction of 30mm wafer to develop.The transportation module that is used for this wafer utilizes the door of open front to insert and remove wafer, and opposite with the door of the bottom of landing downwards from module.This is the load of supporting wafer not, but a container part is with the load of bearing wafer, this container part comprises plastics (such as the Merlon) housing of a cleaning and the container part of other elements, be used for supporting wafer, other elements are by low molded the forming of plastics (such as polyether-ether-ketone (polyetheretberketone)) of sending out grain (lowparticle generating).This container part must be made by a plurality of parts that are assembled into together.
Industrial standard for this 300mm module needs a mechanical interface in the bottom of module, connect device such as kinematic pair, so that repeatedly and accurately module is aimed at respect to process equipment.This allows the door on robot maniputator's splice module front side, opens door, and with the precision clamping of required size and the wafer of mobile specified level layout.(located) and damage are not vital so that wafer can not misplace in the process of described wafer is removed and inserted in robot to make wafer be positioned at certain height and orientation with reference to the plant machinery interface.
On 300mm wafer size and the weight significantly greater than the 200mm module; Therefore, need module firmer on the structure to transport in batch wafer.Generally for the SIMF case of 200mm, module only simply the lower limb of the junction point of door flange by catching housing and door come manual transporting.Case for bottom opening is provided with handle in case top.In order to carry bigger, the heavier and huge module that is used for the 300mm wafer, side handle is suitable.For specific purposes, can move the 300mm module by means of the robot device specially.This robot device finishes the work by the flange that promotes on the upper surface of carrier top.
Processing, deposit or transportation in, in given range chip container as much as possible being assembled into is useful together.Especially in the factory that is of great rarity in the space (fab), will load or the chip container of unloaded is stacked can save the space, and can be easily near a plurality of chip containers.Usually, the chip container that can deposit in given range is good more more at most.
Mechanical interface on the 300mm chip container bottom provides a highly stable detent mechanism when this container is connected with the process equipment that is equipped with kinematic pair to connect device, yet, up to now, one on one stacked this chip container be accompanied by danger, and general this wafer carrier can not be stacked.Need a kind of device of in a little space, stablizing the stacked wafer carrier.
In addition, any position in semiconductor carrier or container uses metal fastenings or other metal partss not to expect very much.Metal parts can produce the particle of height damageability when friction or scraping.The assembling of module and securing member can cause this friction and scraping.Thereby, avoid using the transportation module that needs metal fastenings or other metal partss.Thereby, avoid utilizing the stacked device of metal fastenings.
Summary of the invention
The chip container of open front has the container part of band transparent shell and closes the door of open front.Container part has mechanical interface on housing bottom, connect device as kinematic pair, and generally has socket in case top, to receive the annex that promotes flange such as robot.Adaptor plate has the mechanical interface part that matches ideally, to allow wafer carrier stacked.In a preferred embodiment, this plug has the sliding bearing guidance part, and this guidance part has the undercut part, is used to keep robot to promote flange or adaptor plate.Annex has the ratchet that is positioned on the annex ideally, so that described annex is latched in position on the container part releasedly.
The features and advantages of the present invention are that chip container can have traditional robot and handle feature, and also have reliable stacked ability.Stacking adaptor plate removably is placed on or is fixed on the container part, so that provide a reliable pedestal for the mechanical interface of wanting stacked chip container thereon.A plurality of chip containers can be stacked to together so that save factory floor space.
Other feature and advantage of specific embodiment of the present invention are that stacking adaptor plate provides 3 contacts for the upper wafer container that adaptor plate supported, and for the supporting adaptor plate the lower wafer carrier 3 contacts are provided.
Description of drawings
Fig. 1 is the perspective view with prior art wafer carrier of the robot flange that is attached on the container part top;
Fig. 2 has the perspective view that kinematic pair connects the wafer carrier of device mechanical interface, and mechanically moves down the stacking adaptor that matches from this;
Fig. 3 is the front view of stacking adaptor;
Fig. 4 is the perspective view of the stacking adaptor among Fig. 3;
Fig. 5 is the perspective view of the stacking adaptor in Fig. 3 and 4;
Fig. 6 is the perspective view according to stacked a pair of wafer carrier of the present invention.
Embodiment
For this mechanical interface, Fig. 1 illustrates the chip container 30 of prior art.This carrier comprises container part 32, door 34 and robot flange 36 and handle 44.This wafer carrier has the wafer slit of a plurality of levels, and they form wafer rack by being positioned at many in the container part.Fig. 2 illustrates the chip container of another kind of type, also has container part 32, handle 33 similarly, and also shows and be configured to the mechanical interface 48 that kinematic pair connects first configuration of device.Kinematic pair connects utensil three grooves 49, described in United States Patent (USP) 5755332,5944194,6010008 and 6010009.These patents all are incorporated herein by reference.Kinematic pair connects that device has been proved to be effective mechanical interface and is the industrial standard of 300mm wafer carrier.Kinematic pair connects utensil the each several part that matches, a part has three projectioies, as be positioned at the part sphere that three summits of equilateral triangle are located, and another part has three grooves that hold this part-spherical, can repeat and accurately two part seats be come to together.This kinematic pair connects device part can be as forming separately by injection molding, and suitably be attached on the container part bottom.The explanation in the application person's of owning together United States Patent (USP) 6216874 of this part.Described thus patent is incorporated herein by reference.In addition, mechanical interface can be an integral part of container part, maybe can be the part of structural framing, as disclosed in United States Patent (USP) 6010008.Stacking adaptor 50 is illustrated and is on the ad-hoc location, so that connect device and engage with kinematic pair among Fig. 2.
Fig. 3,4 and 5 illustrates the preferred embodiment of stacking adaptor.This adaptor plate has main part 54, and main part 54 has top side 55 and bottom side 58, and the top side has kinematic pair and connects device part 56, and bottom side 58 has attachment portion 59.Kinematic pair connects the projection 60 that device partly comprises at least three circles, and as shown in the figure, has other one group of three auxiliary projection 62.Three supporting leg 63 horizontal-extendings, and each supporting leg has in described at least three projectioies at least one.Each projection can form separately, and adheres to suitable securing member 68; Perhaps, each projection is integrally moulded with main part.Bottom side 58 comprises three wafer carrier contact portions 66, and they connect the device projection near kinematic pair and are placed on the top side.In addition, contact portion 70 is configured to corresponding with the substrate of robot flange, engages with the wafer carrier top synergistically to replace the robot flange.Adapter also has the hook component 71 that act as ratchet.
Fig. 6 illustrates the jack part 73 of container part 32, and it puts the annex that promotes flange or stacking adaptor plate such as robot.Jack part can have a pair of slide guide element 72,74, they have the undercut part 75,76 that limits slit 78,79, the undercut part can put in place to allow the annex wedging from the horizontal by certain angle, and annex further is fixed on the container part.Equally, latch portion 80 can put the ratchet on the annex, so that releasedly at jack part place fixing fitting.Fig. 6 also is illustrated in utilization according to a pair of wafer carrier in stacked process on another of stacking adaptor of the present invention.
With reference to Fig. 4, two wedge-shaped elements 88,90 cooperate with slit 78,79 on the jack part.Be used for the attachment portion that kinematic pair connects the device stacking adaptor plate and can have a facies posterior hepatis, it is identical with the facies posterior hepatis of robot flange that this facies posterior hepatis is configured to, as shown in the figure.Robot flange and stacking adaptor plate can suitably pass through injection molded thermoplastic (as the Merlon of carbon fiber or carbon filling) and form.Can utilize other plastics, also be suitable such as the other materials of metal.For the plastics that carbon is filled, carbon provides desirable antistatic (static dissipative) characteristic.The kinematic pair that stacking adaptor plate can be connected to container part conductively connects on the device, adheres to adaptor plate on it, to be used for constituting a conductive path by stacked wafer carrier.
In the embodiment that replaces, the robot flange can keep original position, and stacking adaptor plate can be configured to cooperate with described robot flange, and preferably directly is attached on the robot flange.In another embodiment, stacking adaptor can around or cover the robot flange and be fitted on the top of container part.In the wafer carrier that does not have socket or robot flange, the specific embodiment of stacking adaptor other available top structures on can the joint wafer carrier.In a particular embodiment, stacking adaptor can be permanently attached on the top of wafer carrier or become one with it.In a particular embodiment, on the wafer carrier of the opening that stacking adaptor plate can be shown in United States Patent (USP) 6010009 grades.
Do not deviating under marrow of the present invention or the base attribute prerequisite, the present invention can implement with other particular forms; Therefore, it is illustrative that present embodiment all is considered in all fields, and nonrestrictive, and scope of the present invention should be with reference to appending claims, rather than the description of front.
Claims (17)
1. chip container system comprises:
A) have the container part of front portion, top and the bottom of opening;
B) be used to close the door of the front portion of opening;
C) mechanical interface on the container part bottom, this mechanical interface has a plurality of grooves that are formed on its bottom surface;
D) jack part on the container part top; And
E) stacking adaptor plate, it has top side and bottom side, described bottom side is suitable for engaging with jack part, described top side has a plurality of circular protrusions, this circular protrusions is suitable for being bonded in a plurality of grooves in the mechanical interface of independent chip container, wherein, described stacking adaptor plate is not to be fastened on the described container part, and described thus stacking adaptor plate is beneficial to the stacked of a plurality of chip containers.
2. chip container as claimed in claim 1 system, wherein, the top side of described stacking adaptor plate has at least three circular protrusions.
3. chip container as claimed in claim 1 system, wherein, the bottom side of described stacking adaptor plate has three container part contact portions, and their extend downwards and near described three circular protrusions location at least.
4. stacking adaptor plate that is used for stacked a plurality of chip containers, this container has top, bottom and the kinematic pair on described bottom respectively and connects device, stacking adaptor plate is suitable for the joint wafer container, and have supine kinematic pair and connect the device part, this kinematic pair connects the kinematic pair that device partly is suitable for engaging independent chip container stacked on it and connects device.
5. stacking adaptor plate as claimed in claim 4, wherein, adaptor plate has and is used for this plate removably is attached to ratchet on the chip container.
6. chip container system, comprise container part, this container part wherein has a plurality of slits, be used for fixing a plurality of wafers, the adaptor plate that container part also comprises top, bottom, is positioned at the mechanical interface of bottom and is suitable for removably engaging with the top of chip container, stacked thereon the time at independent chip container, adaptor plate is suitable for engaging with the mechanical interface of described independent chip container.
7. stacking adaptor plate as claimed in claim 6, wherein, adaptor plate has and is used for this plate removably is attached to ratchet on the chip container.
8. stacking adaptor plate as claimed in claim 6, wherein, this adaptor plate also comprises three supporting legs, this three supporting leg horizontal-extendings and each other uniformly-spaced.
9. stacking adaptor plate as claimed in claim 6, wherein, this mechanical interface is that kinematic pair connects device, adaptor plate has horizontally extending three supporting legs, and each has the circular protrusions that is directed upwards towards in described three supporting legs, and the kinematic pair that is used to engage independent chip container stacked on it connects device.
10. chip container system, comprise container part, this container part wherein has a plurality of slits, be used for fixing a plurality of wafers, container part also comprises the top, the bottom, be positioned at the mechanical interface of bottom, and the stacking adaptor of locating at the chip container top, this mechanical interface comprises three grooves, connect a part of device as kinematic pair, adaptor plate comprises at least three circular protrusions, this circular protrusions comprises that kinematic pair connects the part that matches of device, and two parts that a plurality of thus described chip containers can connect device by just in time adjacent each other kinematic pair are stacked to together.
11. a chip container reduplicative placing system comprises:
At least the first and second chip containers, each described chip container has housing parts, and housing parts has bottom and top at least, each chip container also has the mechanical interface part that is positioned on the described bottom; And
Be used to be beneficial to the stacked device of described first and second chip containers, described device removably is attached on the top of described first chip container, and engages with the mechanical interface of described second chip container.
12. chip container reduplicative placing system as claimed in claim 1, wherein, describedly be used to be beneficial to stacked device and comprise at least one stacking adaptor plate, described plate has top side and bottom side, described top side is suitable for partly engaging with the mechanical interface of described second chip container on it time in that described second container is stacked, and described bottom side is suitable for engaging the described top of described first chip container.
13. chip container reduplicative placing system as claimed in claim 12, wherein, each described mechanical interface partly is that kinematic pair connects device.
14. chip container reduplicative placing system as claimed in claim 13, wherein, described each kinematic pair connects utensil three circular groove, and described adaptor plate has three circular protrusions, is used to engage described groove.
15. chip container reduplicative placing system as claimed in claim 12, wherein, described first chip container has the adaptor plate holding portion, and the described bottom side of described adaptor plate has removably and engages with described adaptor plate holding portion.
16. chip container reduplicative placing system as claimed in claim 15, wherein, described adaptor plate holding portion is that robot handles flange.
17. the method for a stacked wafer container comprises:
A stacking adaptor plate is provided, and this adaptor plate has top side and bottom side, and described top side is suitable for partly engaging with the mechanical interface of chip container, and described bottom side is suitable for engaging with the top of chip container;
Described stacking adaptor plate is placed on the top of first chip container; And
Engage and second chip container is stacked on described first chip container with described stacking adaptor plate by mechanical interface part second chip container.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25102500P | 2000-12-04 | 2000-12-04 | |
| US60/251,025 | 2000-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1478293A CN1478293A (en) | 2004-02-25 |
| CN1218364C true CN1218364C (en) | 2005-09-07 |
Family
ID=22950160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN018199313A Expired - Fee Related CN1218364C (en) | 2000-12-04 | 2001-12-04 | Wafer carrier with stacking adaptor plate |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20020114686A1 (en) |
| EP (1) | EP1339622A4 (en) |
| JP (1) | JP2004515916A (en) |
| KR (1) | KR20040019264A (en) |
| CN (1) | CN1218364C (en) |
| AU (1) | AU2002237697A1 (en) |
| WO (1) | WO2002047118A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106796905A (en) * | 2014-08-28 | 2017-05-31 | 恩特格里斯公司 | Substrate container |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4146718B2 (en) | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | Thin plate support container |
| JP2006351604A (en) * | 2005-06-13 | 2006-12-28 | Miraial Kk | Sheet supporting vessel |
| CN100431930C (en) * | 2005-08-04 | 2008-11-12 | 北京市塑料研究所 | Packaging container for large diameter silicon wafer storage and transport |
| TWI363030B (en) * | 2009-07-10 | 2012-05-01 | Gudeng Prec Industral Co Ltd | Wafer container with top flange structure |
| KR102000025B1 (en) * | 2012-10-29 | 2019-07-17 | 세메스 주식회사 | Substrate treating apparatus |
| KR102143884B1 (en) | 2013-09-11 | 2020-08-12 | 삼성전자주식회사 | Wafer loaders having buffer regions |
| US20150214084A1 (en) | 2014-01-30 | 2015-07-30 | Infineon Technologies Ag | Frame cassette |
| US9852934B2 (en) * | 2014-02-14 | 2017-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor wafer transportation |
| JP6675257B2 (en) * | 2016-04-14 | 2020-04-01 | 株式会社荏原製作所 | Plating apparatus and plating method |
| AU201711337S (en) * | 2016-09-08 | 2017-03-29 | Battlemax Pty Ltd | Adaptor Plate |
| AU201711335S (en) * | 2016-09-08 | 2017-03-29 | Battlemax Pty Ltd | Suction Cover |
| CN106586180A (en) * | 2017-01-06 | 2017-04-26 | 佛山市南海区广工大数控装备协同创新研究院 | Silicon wafer splicing material box and automatic feeding device thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4557382A (en) * | 1983-08-17 | 1985-12-10 | Empak Inc. | Disk package |
| CA2218260C (en) * | 1995-10-13 | 2006-05-23 | Empak, Inc. | 300mm microenvironment pod with door on side |
| US6010008A (en) * | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
| JP3838786B2 (en) * | 1997-09-30 | 2006-10-25 | 信越ポリマー株式会社 | Precision substrate storage container, positioning structure thereof, and positioning method of precision substrate storage container |
| US6216874B1 (en) * | 1998-07-10 | 2001-04-17 | Fluoroware, Inc. | Wafer carrier having a low tolerance build-up |
| JP3916342B2 (en) * | 1999-04-20 | 2007-05-16 | 信越ポリマー株式会社 | Substrate storage container |
| JP3556519B2 (en) * | 1999-04-30 | 2004-08-18 | 信越ポリマー株式会社 | Substrate storage container identification structure and substrate storage container identification method |
-
2001
- 2001-12-04 US US10/005,188 patent/US20020114686A1/en not_active Abandoned
- 2001-12-04 WO PCT/US2001/046538 patent/WO2002047118A2/en not_active Application Discontinuation
- 2001-12-04 AU AU2002237697A patent/AU2002237697A1/en not_active Abandoned
- 2001-12-04 JP JP2002548751A patent/JP2004515916A/en active Pending
- 2001-12-04 CN CN018199313A patent/CN1218364C/en not_active Expired - Fee Related
- 2001-12-04 EP EP01986506A patent/EP1339622A4/en not_active Withdrawn
- 2001-12-04 KR KR10-2003-7007319A patent/KR20040019264A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106796905A (en) * | 2014-08-28 | 2017-05-31 | 恩特格里斯公司 | Substrate container |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004515916A (en) | 2004-05-27 |
| CN1478293A (en) | 2004-02-25 |
| EP1339622A2 (en) | 2003-09-03 |
| WO2002047118A2 (en) | 2002-06-13 |
| WO2002047118B1 (en) | 2003-03-06 |
| EP1339622A4 (en) | 2006-03-08 |
| WO2002047118A3 (en) | 2002-10-17 |
| AU2002237697A1 (en) | 2002-06-18 |
| US20020114686A1 (en) | 2002-08-22 |
| KR20040019264A (en) | 2004-03-05 |
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