KR900005348B1 - 반도체장치의 제조방법 - Google Patents

반도체장치의 제조방법 Download PDF

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Publication number
KR900005348B1
KR900005348B1 KR1019850004374A KR850004374A KR900005348B1 KR 900005348 B1 KR900005348 B1 KR 900005348B1 KR 1019850004374 A KR1019850004374 A KR 1019850004374A KR 850004374 A KR850004374 A KR 850004374A KR 900005348 B1 KR900005348 B1 KR 900005348B1
Authority
KR
South Korea
Prior art keywords
wire
semiconductor device
electrode pad
bonding
bowl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019850004374A
Other languages
English (en)
Korean (ko)
Other versions
KR860001477A (ko
Inventor
오사무 우스다
Original Assignee
가부시끼가이샤 도오시바
사바 쇼오이찌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도오시바, 사바 쇼오이찌 filed Critical 가부시끼가이샤 도오시바
Publication of KR860001477A publication Critical patent/KR860001477A/ko
Application granted granted Critical
Publication of KR900005348B1 publication Critical patent/KR900005348B1/ko
Expired legal-status Critical Current

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Classifications

    • H10W72/071—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H10W70/041—
    • H10W72/07232—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/015—
    • H10W72/01551—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/073—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07541—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/754—
    • H10W90/756—

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
KR1019850004374A 1984-07-27 1985-06-20 반도체장치의 제조방법 Expired KR900005348B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15559184A JPS6135545A (ja) 1984-07-27 1984-07-27 半導体装置の製造方法
JP59-155591 1984-07-27

Publications (2)

Publication Number Publication Date
KR860001477A KR860001477A (ko) 1986-02-26
KR900005348B1 true KR900005348B1 (ko) 1990-07-27

Family

ID=15609376

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850004374A Expired KR900005348B1 (ko) 1984-07-27 1985-06-20 반도체장치의 제조방법

Country Status (2)

Country Link
JP (1) JPS6135545A (cg-RX-API-DMAC10.html)
KR (1) KR900005348B1 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3129169B2 (ja) * 1995-11-08 2001-01-29 富士通株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS6135545A (ja) 1986-02-20
KR860001477A (ko) 1986-02-26
JPH0325019B2 (cg-RX-API-DMAC10.html) 1991-04-04

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