KR900005147B1 - 초소형 접속부용 압축 페디스틀 및 그 제조 방법 - Google Patents

초소형 접속부용 압축 페디스틀 및 그 제조 방법 Download PDF

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Publication number
KR900005147B1
KR900005147B1 KR1019870700749A KR870700749A KR900005147B1 KR 900005147 B1 KR900005147 B1 KR 900005147B1 KR 1019870700749 A KR1019870700749 A KR 1019870700749A KR 870700749 A KR870700749 A KR 870700749A KR 900005147 B1 KR900005147 B1 KR 900005147B1
Authority
KR
South Korea
Prior art keywords
chip
substrate
mesa
pedestal
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870700749A
Other languages
English (en)
Korean (ko)
Other versions
KR880701021A (ko
Inventor
닐스 이. 패트로우
Original Assignee
휴우즈 에어크라프트 캄파니
에이.더블유.카람벨라스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 휴우즈 에어크라프트 캄파니, 에이.더블유.카람벨라스 filed Critical 휴우즈 에어크라프트 캄파니
Publication of KR880701021A publication Critical patent/KR880701021A/ko
Application granted granted Critical
Publication of KR900005147B1 publication Critical patent/KR900005147B1/ko
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
KR1019870700749A 1985-12-20 1986-11-24 초소형 접속부용 압축 페디스틀 및 그 제조 방법 Expired KR900005147B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US81156085A 1985-12-20 1985-12-20
US811560 1985-12-20
PCT/US1986/002509 WO1987004009A1 (en) 1985-12-20 1986-11-24 Compressive pedestal for microminiature connections

Publications (2)

Publication Number Publication Date
KR880701021A KR880701021A (ko) 1988-04-13
KR900005147B1 true KR900005147B1 (ko) 1990-07-20

Family

ID=25206887

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870700749A Expired KR900005147B1 (ko) 1985-12-20 1986-11-24 초소형 접속부용 압축 페디스틀 및 그 제조 방법

Country Status (8)

Country Link
EP (1) EP0252115B1 (https=)
JP (1) JPS63501995A (https=)
KR (1) KR900005147B1 (https=)
DE (1) DE3680336D1 (https=)
ES (1) ES2002935A6 (https=)
IL (1) IL80785A (https=)
TR (1) TR22767A (https=)
WO (1) WO1987004009A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
JP3002512B2 (ja) * 1990-09-10 2000-01-24 株式会社日立製作所 集積回路装置
US5345365A (en) * 1992-05-05 1994-09-06 Massachusetts Institute Of Technology Interconnection system for high performance electronic hybrids
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
US6840777B2 (en) * 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
US11152707B1 (en) * 2020-07-02 2021-10-19 International Business Machines Corporation Fast radio frequency package
EP4261872A1 (en) * 2022-04-11 2023-10-18 Nexperia B.V. Molded electronic package with an electronic component encapsulated between two substrates with a spring member between the electronic component and one of the substrates and method for manufacturing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1021066A (en) * 1974-10-17 1977-11-15 James B. Morris (Sr.) Semiconductor chip interconnect package
US4070688A (en) * 1976-12-27 1978-01-24 International Rectifier Corporation Flexible lead
FR2471048A1 (fr) * 1979-12-07 1981-06-12 Silicium Semiconducteur Ssc Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire
JPS58110778A (ja) * 1981-12-23 1983-07-01 ワイケイケイ株式会社 自動開閉扉の制御装置

Also Published As

Publication number Publication date
IL80785A (en) 1994-05-30
WO1987004009A1 (en) 1987-07-02
EP0252115B1 (en) 1991-07-17
IL80785A0 (en) 1987-02-27
JPH0553301B2 (https=) 1993-08-09
DE3680336D1 (de) 1991-08-22
KR880701021A (ko) 1988-04-13
TR22767A (tr) 1988-07-01
ES2002935A6 (es) 1988-10-01
EP0252115A1 (en) 1988-01-13
JPS63501995A (ja) 1988-08-04

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