KR900002672A - 인쇄 배선반의 제조방법 - Google Patents

인쇄 배선반의 제조방법 Download PDF

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Publication number
KR900002672A
KR900002672A KR1019890004848A KR890004848A KR900002672A KR 900002672 A KR900002672 A KR 900002672A KR 1019890004848 A KR1019890004848 A KR 1019890004848A KR 890004848 A KR890004848 A KR 890004848A KR 900002672 A KR900002672 A KR 900002672A
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South Korea
Prior art keywords
layer
composite film
laminate
insulating
film
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KR1019890004848A
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English (en)
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KR920000988B1 (ko
Inventor
히로시 다까하시
신 다까네자와
마사오 간노
도시로 오까무라
나오끼 후꾸또미
히로요시 요꼬야마
히데오 와따나베
하지메 야마자끼
히로유끼 가와마쯔
도시노부 다까하시
Original Assignee
요꼬야마 료오지
히다찌가세이고오교 가부시끼가이샤
아소 유다까
히다찌콘덴서 가부시끼가이샤
모또야마 가즈오
요꼬하마고무 가부시끼가이샤
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Priority claimed from JP63175133A external-priority patent/JPH0728125B2/ja
Priority claimed from JP63175132A external-priority patent/JPH0760922B2/ja
Priority claimed from JP63210460A external-priority patent/JPH0260195A/ja
Application filed by 요꼬야마 료오지, 히다찌가세이고오교 가부시끼가이샤, 아소 유다까, 히다찌콘덴서 가부시끼가이샤, 모또야마 가즈오, 요꼬하마고무 가부시끼가이샤 filed Critical 요꼬야마 료오지
Publication of KR900002672A publication Critical patent/KR900002672A/ko
Application granted granted Critical
Publication of KR920000988B1 publication Critical patent/KR920000988B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

인쇄 배선반의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1∼3도는 본 발명에서 사용되는 복합필름의 횡단면을 나타낸다.

Claims (17)

  1. 감압하에서 기판의 양면에 주요성분으로 에폭시수지와 합성고무를 함유하는 부가층 및 절연층을 함유하는 복합필름을 라미네이트화하고, 가열하여 수득한 라미네이트를 경화하고, 수득한 라미네이트에서 광통구명을 뚫고, 도금 리지스트로써 비회로 형성부분을 덮어싸고, 수득한 라미네이트를 화학적으로 거칠게 하는 용액에 담그어 리지스트로 덮어싸지 않은 회로 형성부분을 선택적으로 거칠게 하고, 수득한 라미네이트를 비전기 구리도금 용액에 담그어 전도체 패턴을 형성함을 특징으로 하는 인쇄 배선반의 제조방법.
  2. 제1항에 있어서, 라미네이트의 가열 경화가 대기압하에서 수행되는 방법.
  3. 주요성분으로 에폭시수지 및 합성고무를 함유하는 부가층 및 절연층을 함유하는 부가방법에 의해 인쇄 배선반을 제조하기 위한 복합필름.
  4. 제3항에 있어서, 합성고무가 아크릴로니트릴-부타디엔고무인 복합필름.
  5. 제3항에 있어서, 부가층이 경화되지 않는 복합필름.
  6. 제3항에 있어서, 부가층이 경화되는 복합필름.
  7. 제3항에 있어서, 절연층 위에 라미네이트화된 고착층을 함유하는 복합필름.
  8. 제3항에 있어서, 부가층과 절연층 사이에 삽입된 장벽층을 더 함유하는 복합필름.
  9. 제3항에 있어서, 부가층과 접촉하는 절연층의 일부가 경화되는 복합필름.
  10. 제3항에 있어서, 절연층 또는 부가층이 라미네이션시에 103내지 105포아즈의 점성도를 갖는 복합필름.
  11. 절연수지층과 내부층 회로기판을 접촉시키기 위하여 내부층 회로기판의 양면에 절연수지층과 고착층을 함유하는 복합필름을 결합하고, 압력하에서 수득한 라미네이트를 가열하여 결합하고, 수득한 라미네이트에서 관통구멍을 뚫고, 도금 리지스트로써 비회로 형성부분을 덮어싸고, 수득한 라미네이트를 화학적으로 거친 용액에 담그어 리지스트로써 덮히지 않은 회로 형성부분을 선택적으로 거칠게 하고, 수득한 라미네이트를 비전기 구리도금 용액에 담그어 전도체 패턴을 형성함을 특징으로 하는 다층 인쇄 배선반의 제조방법.
  12. 제11항에 있어서, 적어도 하나의 절연수지층 및 고착층이 비전기 도금을 위한 촉매를 함유하는 방법.
  13. 제11항에서, 가압하여 가열하여 결합할 때 절연수지층이 고착층보다 더 큰 유동성을 갖는 방법.
  14. 제11항에 있어서, 복합필름이 고착층 위에 라미네이트화된 절연필름을 더 함유하는 방법.
  15. 제14항에 있어서, 가압하에 결합한 수득 라미네이트를 가열한 후 절연필름을 제거하는 방법.
  16. 금속 플레이트의 관통구멍에 수지조성물을 채우고, 금속 플레이트의 양면에 비경화 부가층 필름을 라미네이트화하여 라미네이트를 수득하고, 부가층 필름을 가열하여 경화하고 원래의 관통구멍 부분에서 보다 작은 관통구멍을 뚫고, 라미네이트를 화학적으로 거칠게 하는 처리를 하고, 도금 촉매를 심어 라미네이트 표면을 활성화시키고, 도금 리지스트로써 비회로 형성부분을 덮어 씌우고, 수득한 라미네이트를 비전기 구리도금용액에 담그어 전도체 패턴을 형성함을 특징으로 하는 인쇄 회로판의 제조방법.
  17. 제16항에 있어서, 주요성분으로 에폭시수지 및 합성고무를 함유하는 부가층 및 절연층을 함유하는 비경화 복합필름이 라미네이트화 단계에서 비경화층 필름 대신 사용되는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004848A 1988-07-15 1989-06-08 인쇄 배선반의 제조방법 KR920000988B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP63175133A JPH0728125B2 (ja) 1988-07-15 1988-07-15 アディティブ法配線板の製造方法
JP63-175133 1988-07-15
JP63-175132 1988-07-15
JP63175132A JPH0760922B2 (ja) 1988-07-15 1988-07-15 アディティブ法配線板用複層フィルム
JP63-210460 1988-08-26
JP63210460A JPH0260195A (ja) 1988-08-26 1988-08-26 アディティブ法配線板の製造方法

Publications (2)

Publication Number Publication Date
KR900002672A true KR900002672A (ko) 1990-02-28
KR920000988B1 KR920000988B1 (ko) 1992-01-31

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Application Number Title Priority Date Filing Date
KR1019890004848A KR920000988B1 (ko) 1988-07-15 1989-06-08 인쇄 배선반의 제조방법

Country Status (4)

Country Link
US (1) US5153987A (ko)
EP (1) EP0351034B1 (ko)
KR (1) KR920000988B1 (ko)
DE (1) DE68909853T2 (ko)

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EP0351034A3 (en) 1990-03-21
EP0351034A2 (en) 1990-01-17
DE68909853D1 (de) 1993-11-18
KR920000988B1 (ko) 1992-01-31
US5153987A (en) 1992-10-13
DE68909853T2 (de) 1994-02-10
EP0351034B1 (en) 1993-10-13

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