KR900002534B1 - 동장적층 라미네이트 제조용 에폭시수지 조성물 - Google Patents

동장적층 라미네이트 제조용 에폭시수지 조성물 Download PDF

Info

Publication number
KR900002534B1
KR900002534B1 KR1019870000121A KR870000121A KR900002534B1 KR 900002534 B1 KR900002534 B1 KR 900002534B1 KR 1019870000121 A KR1019870000121 A KR 1019870000121A KR 870000121 A KR870000121 A KR 870000121A KR 900002534 B1 KR900002534 B1 KR 900002534B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
weight
parts
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870000121A
Other languages
English (en)
Korean (ko)
Other versions
KR870007238A (ko
Inventor
마사미 유사
카쭈지 시바라
야수오 미야데라
Original Assignee
히다찌 가세이 고오교오 가부시끼가이샤
요꼬야마 료오지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61003887A external-priority patent/JPS62161817A/ja
Priority claimed from JP61003886A external-priority patent/JPS62161840A/ja
Application filed by 히다찌 가세이 고오교오 가부시끼가이샤, 요꼬야마 료오지 filed Critical 히다찌 가세이 고오교오 가부시끼가이샤
Publication of KR870007238A publication Critical patent/KR870007238A/ko
Application granted granted Critical
Publication of KR900002534B1 publication Critical patent/KR900002534B1/ko
Expired legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
KR1019870000121A 1986-01-10 1987-01-09 동장적층 라미네이트 제조용 에폭시수지 조성물 Expired KR900002534B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP61003887A JPS62161817A (ja) 1986-01-10 1986-01-10 エポキシ樹脂組成物
JP3887 1986-01-10
JP3886 1986-01-10
JP61003886A JPS62161840A (ja) 1986-01-10 1986-01-10 印刷配線板用プリプレグの製造方法

Publications (2)

Publication Number Publication Date
KR870007238A KR870007238A (ko) 1987-08-17
KR900002534B1 true KR900002534B1 (ko) 1990-04-20

Family

ID=26337542

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870000121A Expired KR900002534B1 (ko) 1986-01-10 1987-01-09 동장적층 라미네이트 제조용 에폭시수지 조성물

Country Status (3)

Country Link
US (1) US4833204A (enExample)
KR (1) KR900002534B1 (enExample)
DE (1) DE3700287A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
DE3915823A1 (de) * 1989-05-16 1990-11-22 Ruetgerswerke Ag Verfahren zur herstellung von verbundwerkstoffen
DE4024466C2 (de) * 1990-07-30 1995-04-20 Dainippon Ink & Chemicals Thermisch härtbare Mischungen aus polyfunktionellen Formamiden und aromatischen Mono-, Di- oder Polyglycidylethern und deren Verwendung
TW324737B (en) * 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
US5883193A (en) * 1997-07-01 1999-03-16 Minnesota Mining And Manufacturing Company Adhesive compositions with durability under conditions of high humidity
KR100501651B1 (ko) * 2001-07-09 2005-07-18 현대자동차주식회사 차체 외판 보강용 실러 조성물
US20030211330A1 (en) * 2002-05-09 2003-11-13 Anderson Robert A. Method of preparing a metal material for bonding
US6797376B2 (en) * 2002-05-09 2004-09-28 The Boeing Company Fiber-metal laminate adhesive coating
US20040058133A1 (en) * 2002-07-19 2004-03-25 Bilodeau Wayne L. Labeling method employing two-part curable adhesives
US6843815B1 (en) 2003-09-04 2005-01-18 3M Innovative Properties Company Coated abrasive articles and method of abrading
US7344574B2 (en) * 2005-06-27 2008-03-18 3M Innovative Properties Company Coated abrasive article, and method of making and using the same
US7344575B2 (en) * 2005-06-27 2008-03-18 3M Innovative Properties Company Composition, treated backing, and abrasive articles containing the same
CN101494949A (zh) * 2009-03-04 2009-07-29 腾辉电子（苏州）有限公司 高频覆铜箔基板,其半固化片及降低覆铜箔基板信号损失的方法
DE102009052061A1 (de) * 2009-11-05 2011-05-12 Alzchem Trostberg Gmbh Verwendung von Guanidin-Derivaten als Härtungsbeschleuniger für Epoxidharze
US9403762B2 (en) 2013-11-21 2016-08-02 Rohm And Haas Electronic Materials Llc Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens
CN111002644B (zh) * 2019-12-20 2022-02-22 江门市德众泰工程塑胶科技有限公司 一种低介电、高剥离强度的覆铜板的制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL133216C (enExample) * 1964-09-22
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
FR1566468A (enExample) * 1968-03-04 1969-05-09
JPS51135999A (en) * 1975-05-21 1976-11-25 Hitachi Ltd Epoxy res in composition
DE2542105B2 (de) * 1975-09-20 1980-06-04 Chemische Werke Huels Ag, 4370 Marl Verfahren zur Herstellung von Überzügen
US4335228A (en) * 1978-02-27 1982-06-15 Air Products And Chemicals, Inc. Isocyanate blocked imidazoles and imidazolines for epoxy powder coating
JPS55147524A (en) * 1979-05-09 1980-11-17 Hitachi Ltd Epoxy resin composition for prepreg
US4240605A (en) * 1979-09-17 1980-12-23 Pennwalt Corporation Jig assembly for preparing dental impressions for casting
US4358571A (en) * 1981-03-10 1982-11-09 Mobil Oil Corporation Chemically modified imidazole curing catalysts for epoxy resin and powder coatings containing them
CH646956A5 (de) * 1981-12-15 1984-12-28 Ciba Geigy Ag Imidazolide.
JPS59190972A (ja) * 1983-04-14 1984-10-29 Shikoku Chem Corp ４，４′−メチレン−ビス−（２−エチル−５−メチルイミダゾ−ル）、該化合物の製造方法及び該化合物を用いてポリエポキシ化合物を硬化ないし硬化促進させる方法
DE3327823A1 (de) * 1983-08-02 1985-02-21 Basf Ag, 6700 Ludwigshafen Haertbare epoxidharze
US4533715A (en) * 1983-09-07 1985-08-06 Hexcel Corporation Single package epoxy resin system
US4552814A (en) * 1984-05-21 1985-11-12 The Dow Chemical Company Advanced epoxy resins having improved impact resistance when cured
EP0166588B1 (en) * 1984-06-23 1988-09-14 Shikoku Chemicals Corporation Epoxy resin composition

Also Published As

Publication number Publication date
US4833204A (en) 1989-05-23
DE3700287A1 (de) 1987-07-16
KR870007238A (ko) 1987-08-17
DE3700287C2 (enExample) 1989-03-30

Similar Documents

Publication Publication Date Title
KR900002534B1 (ko) 동장적층 라미네이트 제조용 에폭시수지 조성물
US20030166796A1 (en) Epoxy resin composition and cured object obtained therefrom
TWI434872B (zh) A thermosetting resin composition, and a pre-absorbent body and a laminate using the same
TWI666248B (zh) 馬來醯亞胺樹脂組合物、預浸料、層壓板和印刷電路板
JP5245526B2 (ja) 絶縁樹脂組成物、及び支持体付絶縁フィルム
US6462147B1 (en) Epoxy resin compositions for printed circuit board and printed circuit board using the same
US5458978A (en) Epoxy resin systems containing glycidylated aromatic amines, phosphorus epoxies and metal salts
US20050095434A1 (en) Resin composition, prepreg and laminate using the composition
CN109535628B (zh) 一种阻燃型树脂预聚物及使用其制备的热固性树脂组合物、半固化片和层压板
US7098267B2 (en) Polyamic acid varnish composition and a flexible printed board
TWI468426B (zh) 用於環氧樹脂及二步擴鏈法（ａｄｖａｎｃｅｍｅｎｔ ｐｒｏｃｅｓｓ）之金屬穩定劑
US6558797B1 (en) Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same
KR100777500B1 (ko) 적층판 또는 프리프레그용 바니시, 이 바니시로부터얻어지는 적층판 또는 프리프레그 및 이 적층판 또는프리프레그를 사용한 프린트 배선판
KR20010062548A (ko) 플렉시블 프린트기판
JP5460322B2 (ja) 熱硬化性樹脂組成物及びその硬化物
JPS62161817A (ja) エポキシ樹脂組成物
KR20010101310A (ko) 시아네이트-에폭시 수지 조성물, 및 이를 이용한프리프레그, 금속 호일 적층판 및 인쇄 배선판
JPH0343413A (ja) 印刷配線板用エポキシ樹脂組成物
JP2006036798A (ja) 樹脂組成物、プリプレグおよび積層板
JPH0912677A (ja) 印刷配線板用エポキシ樹脂組成物
JPH0359947B2 (enExample)
JPH08157569A (ja) 印刷配線板用エポキシ樹脂組成物
JPS62161839A (ja) 印刷配線板用プリプレグの製造方法
JP2003221457A (ja) 樹脂組成物、プリプレグおよび積層板
JPH0229687B2 (ja) Ehokishijushisoseibutsu

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19870109

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19870109

Comment text: Request for Examination of Application

PG1501 Laying open of application
G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

Comment text: Decision on Publication of Application

Patent event code: PG16051S01I

Patent event date: 19900322

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19900703

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19901005

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 19901005

End annual number: 3

Start annual number: 1

PR1001 Payment of annual fee

Payment date: 19930420

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 19940420

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 19950317

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 19960416

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 19970415

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 19980417

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 19990408

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20000411

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20010411

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20020410

Start annual number: 13

End annual number: 13

PR1001 Payment of annual fee

Payment date: 20030409

Start annual number: 14

End annual number: 14

PR1001 Payment of annual fee

Payment date: 20040323

Start annual number: 15

End annual number: 15

PR1001 Payment of annual fee

Payment date: 20050408

Start annual number: 16

End annual number: 16

FPAY Annual fee payment

Payment date: 20060410

Year of fee payment: 17

PR1001 Payment of annual fee

Payment date: 20060410

Start annual number: 17

End annual number: 17

EXPY Expiration of term
PC1801 Expiration of term