KR870007238A - 동장적층 라미네이트 제조용 에폭시수지 조성물 - Google Patents

동장적층 라미네이트 제조용 에폭시수지 조성물 Download PDF

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Publication number
KR870007238A
KR870007238A KR870000121A KR870000121A KR870007238A KR 870007238 A KR870007238 A KR 870007238A KR 870000121 A KR870000121 A KR 870000121A KR 870000121 A KR870000121 A KR 870000121A KR 870007238 A KR870007238 A KR 870007238A
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
copper clad
clad laminate
group
Prior art date
Application number
KR870000121A
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English (en)
Other versions
KR900002534B1 (ko
Inventor
마사미 유사
카쭈지 시바타
야수오 미야데라
Original Assignee
요꼬야마 료오지
히다찌 가세이 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61003886A external-priority patent/JPS62161840A/ja
Priority claimed from JP61003887A external-priority patent/JPS62161817A/ja
Application filed by 요꼬야마 료오지, 히다찌 가세이 고오교오 가부시끼가이샤 filed Critical 요꼬야마 료오지
Publication of KR870007238A publication Critical patent/KR870007238A/ko
Application granted granted Critical
Publication of KR900002534B1 publication Critical patent/KR900002534B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

동장적층 라미네이트 제조용 에폭수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. 한 분자내에 적어도 두 에폭시기를 가지는 에폭시지, 경화제로 한 분자내에 적어도 두 관능기를 가지는 페놀 화합물, 경화촉진제로 마스킹된 이미노기를 가지는 이미다졸 화합물, 및 일반구조식 R1-NH-CO-NH2(여기에서, R1은 수소 또는 유기기이다)로 표시되는 우레아 유도체, 산 아마이드 화합물 및 구아니딘 유도체로 이루어진 그룹에서 선택된 1이상의 질소화합물을 함유하는 동장적층 라미네이트 제조용 에폭시 수지 조성물.
  2. 제1항에서, 전술한 질소화합물이 에폭시수지 100중량부당 0.1-10중량부인 동장적층 라미네이트 제조용 에폭시수지 조성물.
  3. 제1항에서, 전술한 우레아 유도체가 우레아 또는 γ-카바밀 프로필트에톡시 실란인 동장적층 라미네이트 제조용 에폭시수지 조성물.
  4. 제1항에서, 전술한 산아마이드 화합물이 1급 아마이드인 동작적층 라미네이트 제조용 에폭시수지 조성물.
  5. 제1항에서, 전술한 구아니딘 유도체가 디시안디아마이드 유도체인 동장적증 라미네이트 제조용 에폭시수지 조성물.
  6. 제1항에서, 전술한 구아니딘 유도체를 축합제와 함께 사용하는 동장적층 라미네이트 제조용 에폭시수지 조성물.
  7. 제1항에서, 전술한 이미노기가 아크릴로니트릴, 페닐렌 디이소 시아네이트, 톨루엔 디이소시아네이트, 나프탈렌 디이소시아네이트, 헥사메틸렌 디이소시아네이트, 메틸렌 디이소시아네이트, 메틸렌 비스페닐 이소시아네이트 및 멜라민 아크릴레이트로 이루어진 그룹에서 선택된 마스킹 제로 마스크된 동작적층 라미네이트 제조용 에폭시수지 조성물.
  8. 제 항에서, 에폭시수지 조성물이 바니스 상태 또는 액체상태인 동장적층 라미네이트 제조용 에폭시수지 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870000121A 1986-01-10 1987-01-09 동장적층 라미네이트 제조용 에폭시수지 조성물 KR900002534B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3887 1986-01-10
JP3886 1986-01-10
JP61003886A JPS62161840A (ja) 1986-01-10 1986-01-10 印刷配線板用プリプレグの製造方法
JP61003887A JPS62161817A (ja) 1986-01-10 1986-01-10 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
KR870007238A true KR870007238A (ko) 1987-08-17
KR900002534B1 KR900002534B1 (ko) 1990-04-20

Family

ID=26337542

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870000121A KR900002534B1 (ko) 1986-01-10 1987-01-09 동장적층 라미네이트 제조용 에폭시수지 조성물

Country Status (3)

Country Link
US (1) US4833204A (ko)
KR (1) KR900002534B1 (ko)
DE (1) DE3700287A1 (ko)

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KR100501651B1 (ko) * 2001-07-09 2005-07-18 현대자동차주식회사 차체 외판 보강용 실러 조성물

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US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
DE3915823A1 (de) * 1989-05-16 1990-11-22 Ruetgerswerke Ag Verfahren zur herstellung von verbundwerkstoffen
DE4024466C2 (de) * 1990-07-30 1995-04-20 Dainippon Ink & Chemicals Thermisch härtbare Mischungen aus polyfunktionellen Formamiden und aromatischen Mono-, Di- oder Polyglycidylethern und deren Verwendung
TW324737B (en) * 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
US5883193A (en) * 1997-07-01 1999-03-16 Minnesota Mining And Manufacturing Company Adhesive compositions with durability under conditions of high humidity
US6797376B2 (en) * 2002-05-09 2004-09-28 The Boeing Company Fiber-metal laminate adhesive coating
US20030211330A1 (en) * 2002-05-09 2003-11-13 Anderson Robert A. Method of preparing a metal material for bonding
EP1560708A4 (en) * 2002-07-19 2007-11-21 Avery Dennison Corp LABELING METHOD USING TWO-PART CURABLE ADHESIVES
US6843815B1 (en) * 2003-09-04 2005-01-18 3M Innovative Properties Company Coated abrasive articles and method of abrading
US7344575B2 (en) * 2005-06-27 2008-03-18 3M Innovative Properties Company Composition, treated backing, and abrasive articles containing the same
US7344574B2 (en) * 2005-06-27 2008-03-18 3M Innovative Properties Company Coated abrasive article, and method of making and using the same
CN101494949A (zh) * 2009-03-04 2009-07-29 腾辉电子（苏州）有限公司 高频覆铜箔基板,其半固化片及降低覆铜箔基板信号损失的方法
DE102009052061A1 (de) 2009-11-05 2011-05-12 Alzchem Trostberg Gmbh Verwendung von Guanidin-Derivaten als Härtungsbeschleuniger für Epoxidharze
US9403762B2 (en) 2013-11-21 2016-08-02 Rohm And Haas Electronic Materials Llc Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100501651B1 (ko) * 2001-07-09 2005-07-18 현대자동차주식회사 차체 외판 보강용 실러 조성물

Also Published As

Publication number Publication date
KR900002534B1 (ko) 1990-04-20
US4833204A (en) 1989-05-23
DE3700287C2 (ko) 1989-03-30
DE3700287A1 (de) 1987-07-16

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