KR900002441A - Semiconductor Wafer Shifter - Google Patents

Semiconductor Wafer Shifter Download PDF

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Publication number
KR900002441A
KR900002441A KR1019890009990A KR890009990A KR900002441A KR 900002441 A KR900002441 A KR 900002441A KR 1019890009990 A KR1019890009990 A KR 1019890009990A KR 890009990 A KR890009990 A KR 890009990A KR 900002441 A KR900002441 A KR 900002441A
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KR
South Korea
Prior art keywords
semiconductor wafer
switching device
wafer
movement switching
inverting
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KR1019890009990A
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Korean (ko)
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KR0147374B1 (en
Inventor
히로츠구 시라이와
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후세 노보루
테루 사가미 가부시끼 가이샤
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Publication of KR900002441A publication Critical patent/KR900002441A/en
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Publication of KR0147374B1 publication Critical patent/KR0147374B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

내용 없음No content

Description

반도체 웨이퍼 이동전환장치Semiconductor Wafer Shifter

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 3도는 본 발명의 제1실시예의 장치에서 사이에 두고 지지하는 기구의 부분을 나타낸 확대 단면도,3 is an enlarged cross-sectional view showing a part of a mechanism supported between and in the apparatus of the first embodiment of the present invention;

제 4도는, 본 발명에서 사이에 두고 지지하는 기구의 반전축을 나타낸 사시도,4 is a perspective view showing an inverted axis of the mechanism supported by the present invention,

제5도는 (A) 내지 제5도의 (F)는, 각각 카세트에서 보우트로 웨이퍼를 이동전환하는 경우의 동작을 설명하기 위한 도식적인 도면이다.5A to 5F are schematic diagrams for explaining the operation in the case of shifting the wafer from the cassette to the bow, respectively.

Claims (16)

제1 및 제2의 웨이터 수납부재가 얹어 놓여지는 장치 본체와, 제1의 웨이퍼 수납부재에 배열되어 수납된 웨이퍼(21) 를, 제1의 웨이퍼 수납부재에서 빼내는 리프트 수단과, 빼내어진 웨이퍼(21)를 제2의 웨이퍼 수납부재로 반송하여, 제2의 웨이퍼 수납부재에 이동 적재하는 핸들링 수단과, 이 핸들링수단의 기구에서 발생된 먼지를, 상기 장치본체내로 강제적으로 도입하고, 또한, 장치본체에서 외부로 배출하는 배기수단과로 이루어진 반도체 웨이퍼 이동전환장치.The apparatus main body on which the first and second waiter accommodating members are placed, the lift means for extracting the wafer 21 arranged and accommodated in the first wafer accommodating member from the first wafer accommodating member, and the ejected wafer ( 21) is conveyed to the second wafer storage member, the handling means for moving and stacking the second wafer storage member, and the dust generated by the mechanism of the handling means are forcibly introduced into the apparatus main body, A semiconductor wafer movement switching device comprising an exhaust means for discharging from the main body to the outside. 제1항에 있어서, 반송수단이 호울드 수단을 Z축 주위로 반전시키는 반전수단을 갖고 있으며, 이 반전수단의 반전축(40) 내부에 통로(41)가 형성되고, 이 통로(41)가 호울드 수단의 기구내부 및 장치 본체내로 연이어 통하게 되어 있는 것인 반도체 웨이퍼 이동전환장치.2. The conveying means according to claim 1, wherein the conveying means has an inverting means for inverting the holder means about the Z axis, and a passage 41 is formed inside the inverting shaft 40 of the inverting means, and the passage 41 is The semiconductor wafer transfer switching device is connected to the inside of the mechanism and the main body of the holder means. 제2항에 있어서, 반전축(40)의 내부통로(41)의 배기구멍(42)이, 축 주위부에서 개구되어 있는 것인 반도체 웨이퍼 이동전환장치.3. The semiconductor wafer movement switching device according to claim 2, wherein the exhaust hole (42) of the inner passage (41) of the inverted shaft (40) is opened at the periphery of the shaft. 제2항에 있어서, 반전축(40)의 내부통로(41)의 배기구멍(42)이, 축(40)의 아래끝단에서 개구되어 있는 것인 반도체 웨이퍼 이동전환장치.3. The semiconductor wafer movement switching device according to claim 2, wherein the exhaust hole (42) of the inner passage (41) of the inverted shaft (40) is opened at the lower end of the shaft (40). 제1항에 있어서, 호울드 수단의 기구에, 배기수단이 조립되어 있는 것인 반도체 웨이퍼 이동전환장치.The semiconductor wafer movement switching device according to claim 1, wherein an exhaust means is assembled to a mechanism of the holder means. 제1항에 있어서, 장치본체의 기구에, 배기수단이 조립되어 있는 것인 반도체 웨이퍼 이동전환장치.The semiconductor wafer movement switching device according to claim 1, wherein an exhausting means is assembled in a mechanism of the apparatus main body. 제1항에 있어서, 호울드 수단과 장치본체가 연결부재(12)에 의하여 연결되고, 이 연결부재(12)에 배기수단이 조립되어 있는 것인 반도체 웨이퍼 이동전환장치.2. The semiconductor wafer transfer switching device according to claim 1, wherein the holder means and the apparatus body are connected by a connecting member (12), and exhaust means are assembled in the connecting member (12). 제1항에 있어서, 호울드 수단의 기구내부와 연결부재(12)가 외부통로에 의하여 연이어 통하고 있는 것인 반도체 웨이퍼 이동전환장치.2. The semiconductor wafer movement switching device according to claim 1, wherein the mechanism inside of the holder means and the connecting member (12) are connected in series by an external passage. 제1및 제2의 웨이퍼 수납부재의 얹어 놓여지는 장치본체와, 제1의 웨이퍼 수납부재에 배열되어 수납된 웨이퍼(12)를, 제1의 웨이퍼 수납부재에서 빼내는 리프트 수단과, 빼내어진 웨이퍼(21) 상호간의 피치간격의 피치변환 기구(60)에 의하여 변환하는 호울드 수단과, 상기 호울드 수단에 의하여 피치변화된 웨이퍼(21)를 제2의 웨이퍼 수납부재에 이동 적재하는 핸들링 수단과, 피치변환기구(60) 및 사이에 두고 지지하는 동작기구에서 발생된 먼지를, 상기 장치본체 내로 강제적으로 도입하고, 또한, 장치본체에서 외부로 배출하는 배기수단과로 이루어진 반도체 웨이퍼 이동전환장치.A device body on which the first and second wafer storage members are placed, a lift means for pulling out the wafer 12 arranged and housed in the first wafer storage member from the first wafer storage member, and a removed wafer ( 21) a holder means for converting by a pitch converting mechanism 60 of the pitch intervals between each other; a handling means for moving and stacking the wafer 21 changed in pitch by said holder means onto a second wafer storage member; And a displacement means for forcibly introducing dust generated by a converter mechanism (60) and an operation mechanism held therebetween into the apparatus body, and exhausting the dust from the apparatus body to the outside. 제9항에 있어서, 반송수단이 호울드 수단을 Z축 주위로 반전시키는 반전수단을 갖고 있으며, 이 반전 수단의 반전축(50) 내부에 통로(51)가 형성되고, 이 통로(51)가 호울드 수단의 기구 내부 및 장치본체내로 연이어 통하게 되어 있는 것인 반도체 웨이퍼 이동전환장치.10. The conveying means according to claim 9, wherein the conveying means has an inverting means for inverting the holder means about the Z axis, and a passage 51 is formed inside the inverting shaft 50 of the inverting means, and the passage 51 is A semiconductor wafer transfer switching device which is in communication with the inside of the mechanism and the apparatus body of the holder means. 제10항에 있어서, 반전축(50)의 내부통로(51)의 배기구멍의, 축주위부에서 개구되어 있는 것인 반도체웨이퍼 이동전환장치.The semiconductor wafer movement switching device according to claim 10, wherein the exhaust hole of the inner passageway (51) of the inverted shaft (50) is opened around the axis. 제10항에 있어서, 반전축(50)의 내부통로(51)의 배기구멍이, 축(50)의 아래끝단에서 개구되어 있는 반도체 웨이퍼 이동전환장치.The semiconductor wafer movement switching device according to claim 10, wherein the exhaust hole of the inner passageway (51) of the inverted shaft (50) is opened at the lower end of the shaft (50). 제9항에 있어서, 호울드 수단의 기구에, 배기수단이 조립되어 있는 것인 반도체 웨이퍼 이동전환장치.10. The semiconductor wafer movement switching device according to claim 9, wherein an exhaust means is assembled to the mechanism of the holder means. 제9항에 있어서, 장치본체의 기구에, 배기수단이 조립되어 있는 것인 반도체 웨이퍼 이동전환장치.10. The semiconductor wafer movement switching device according to claim 9, wherein an exhausting means is assembled in the mechanism of the apparatus main body. 제9항에 있어서, 호울드 수단의 사이에 두고 지지하는 동작기구와 장치 본체가 연결부재(12)에 의하여 연결되고, 이 연결부재(12)에 배기수단이 조립되어 있는 것인 반도체 웨이퍼 이동전환장치.10. The semiconductor wafer movement switching according to claim 9, wherein the operating mechanism and the apparatus main body which are held between the holder means and the main body of the device are connected by the connecting member 12, and the exhaust means is assembled to the connecting member 12. Device. 제9항에 있어서, 호울드 수단의 피치변환기구(60)와 사이에 두고 지지하는 동작기구가, 외부통로에 의하여 연이어 통하고 있는 것은 반도체 웨이퍼 이동전환장치.10. The semiconductor wafer movement switching device according to claim 9, wherein an operating mechanism that is supported by the pitch conversion mechanism (60) of the holder means is in communication with each other by an external passage. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890009990A 1988-07-13 1989-07-13 Apparatus for transferring semiconductor wafers KR0147374B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP174070 1988-07-13
JP17407088 1988-07-13

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Publication Number Publication Date
KR900002441A true KR900002441A (en) 1990-02-28
KR0147374B1 KR0147374B1 (en) 1998-11-02

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US (1) US5054988A (en)
JP (1) JP2673157B2 (en)
KR (1) KR0147374B1 (en)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03125453A (en) * 1989-10-09 1991-05-28 Toshiba Corp Semiconductor wafer transfer device
JP2919054B2 (en) * 1990-11-17 1999-07-12 東京エレクトロン株式会社 Transfer device and transfer method
US5193969A (en) * 1991-05-20 1993-03-16 Fortrend Engineering Corporation Wafer transfer machine
FR2676666B1 (en) * 1991-05-24 1993-10-01 Sapi Equipements METHOD AND DEVICE FOR TREATING AND CLEANING PLATES WITH CENTRAL REACTOR.
US5275521A (en) * 1991-07-03 1994-01-04 Tokyo Electron Sagami Limited Wafer transfer device
US5299901A (en) * 1992-04-16 1994-04-05 Texas Instruments Incorporated Wafer transfer machine
JPH0689837A (en) * 1992-09-08 1994-03-29 Fujitsu Ltd Substrate treatment device
US5475892A (en) * 1993-10-29 1995-12-19 Texas Instruments Incorporated Semiconductor wafer particle extractor
US5544421A (en) * 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
WO1995030239A2 (en) * 1994-04-28 1995-11-09 Semitool, Incorporated Semiconductor processing system with wafer container docking and loading station
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US5664337A (en) * 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
US6833035B1 (en) 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US5590996A (en) * 1994-10-13 1997-01-07 Semitherm Wafer transfer apparatus
US6036426A (en) * 1996-01-26 2000-03-14 Creative Design Corporation Wafer handling method and apparatus
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6672820B1 (en) 1996-07-15 2004-01-06 Semitool, Inc. Semiconductor processing apparatus having linear conveyer system
US6203582B1 (en) 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
JP3244220B2 (en) * 1996-08-06 2002-01-07 信越半導体株式会社 Method and apparatus for drying flat plate
US6068002A (en) * 1997-04-02 2000-05-30 Tokyo Electron Limited Cleaning and drying apparatus, wafer processing system and wafer processing method
JPH1126550A (en) * 1997-07-04 1999-01-29 Tokyo Electron Ltd Substrate conveyer and apparatus for treating substrate, using the same
AU3052099A (en) * 1998-03-30 1999-10-18 Sizary Ltd. Semiconductor purification apparatus and method
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
JP4100466B2 (en) * 2000-12-25 2008-06-11 東京エレクトロン株式会社 Liquid processing equipment
US6575186B2 (en) 2001-01-16 2003-06-10 Chartered Semiconductor Manufacturing Ltd. Multiple speed slit valve controller
EP1231626A1 (en) * 2001-02-10 2002-08-14 Infineon Technologies SC300 GmbH & Co. KG Measurement arrangement
US6749386B2 (en) 2001-08-20 2004-06-15 Maclean-Fogg Company Locking fastener assembly
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
KR100581795B1 (en) * 2004-08-13 2006-05-23 현대자동차주식회사 Mounting apparatus for baffle plate
JP2013041645A (en) * 2011-08-16 2013-02-28 Fuji Electric Co Ltd Method and device for uv treatment of magnetic recording medium
US8936425B2 (en) * 2012-01-23 2015-01-20 Tera Autotech Corporation Ancillary apparatus and method for loading glass substrates into a bracket
JP7137047B2 (en) * 2018-03-15 2022-09-14 シンフォニアテクノロジー株式会社 EFEM and gas replacement method in EFEM
CN111731819B (en) * 2020-06-01 2022-02-08 南京瑞杜新材料科技有限公司 Conveying line for semiconductor processing of 5G base station filtering isolator
CN113998461B (en) * 2021-12-15 2023-08-15 苏州博众智能机器人有限公司 Feeding structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573851A (en) * 1983-05-18 1986-03-04 Microglass, Inc. Semiconductor wafer transfer apparatus and method
US4568234A (en) * 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
JPS60182735A (en) * 1984-02-29 1985-09-18 Tomuko:Kk Changing device for pitch of arrangement of wafer
JPH019166Y2 (en) * 1984-10-19 1989-03-13
JPH067542B2 (en) * 1984-11-22 1994-01-26 株式会社日立製作所 Manufacturing equipment
JPH0451995Y2 (en) * 1985-05-21 1992-12-07
JPS624142A (en) * 1985-06-28 1987-01-10 Dainippon Screen Mfg Co Ltd Shifter for thin plate material
GB2198413B (en) * 1986-11-20 1990-01-17 Shimizu Construction Co Ltd Transporting robot for semiconductor wafers
KR0133676B1 (en) * 1987-12-07 1998-04-23 후세 노보루 Apparatus and method for transfering wafers
JPH0756879B2 (en) * 1988-03-31 1995-06-14 日鉄セミコンダクター株式会社 Semiconductor dust-free manufacturing equipment

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KR0147374B1 (en) 1998-11-02
JPH02132842A (en) 1990-05-22
JP2673157B2 (en) 1997-11-05
US5054988A (en) 1991-10-08

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