JPS5720445A - Handling device for wafer - Google Patents

Handling device for wafer

Info

Publication number
JPS5720445A
JPS5720445A JP9537580A JP9537580A JPS5720445A JP S5720445 A JPS5720445 A JP S5720445A JP 9537580 A JP9537580 A JP 9537580A JP 9537580 A JP9537580 A JP 9537580A JP S5720445 A JPS5720445 A JP S5720445A
Authority
JP
Japan
Prior art keywords
wafer
fingers
recess
grooves
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9537580A
Other languages
Japanese (ja)
Inventor
Mitsutake Nagashima
Shigeru Futagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP9537580A priority Critical patent/JPS5720445A/en
Publication of JPS5720445A publication Critical patent/JPS5720445A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To enable the automatic handling of a wafer without contamination nor damage by opening and closing fingers engaged with the elevational movements of a cylinder rod, interposing the wafer between the recess at the ends of the fingers or releasing the wafer from the recess. CONSTITUTION:Fluid 8 is introduced into housings 2, 3, and cylinder rod 5 is elevationally moved via the pressure of the fluid. Fingers 15, 16 secured to the central shaft of the gears 11, 12 engaged with the rod 5 are opened or closed by the elevational movements of the rod 5. Recess grooves 17, 18 made of Teflon are, for example, formed at the ends of the fingers 15, 16, and the wafer 27 erected in the grooves 24-26 of holders 21, 23, respectively are interposed between the grooves 17, 18 by closing the fingers and are scraped. When the fingers are, on the other hand, opened, the held wafer is placed on the holder. When the existence or absence of the wafer is photoelectrically detected, it can be automated, and the contamination in the handling step can be prevented by providing clean air blowing mechanism.
JP9537580A 1980-07-11 1980-07-11 Handling device for wafer Pending JPS5720445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9537580A JPS5720445A (en) 1980-07-11 1980-07-11 Handling device for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9537580A JPS5720445A (en) 1980-07-11 1980-07-11 Handling device for wafer

Publications (1)

Publication Number Publication Date
JPS5720445A true JPS5720445A (en) 1982-02-02

Family

ID=14135885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9537580A Pending JPS5720445A (en) 1980-07-11 1980-07-11 Handling device for wafer

Country Status (1)

Country Link
JP (1) JPS5720445A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984003196A1 (en) * 1983-02-14 1984-08-16 Brooks Ass Articulated arm transfer device
US4666366A (en) * 1983-02-14 1987-05-19 Canon Kabushiki Kaisha Articulated arm transfer device
US5445172A (en) * 1990-05-18 1995-08-29 Semitool, Inc. Wafer holder with flexibly mounted gripping fingers

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984003196A1 (en) * 1983-02-14 1984-08-16 Brooks Ass Articulated arm transfer device
US4666366A (en) * 1983-02-14 1987-05-19 Canon Kabushiki Kaisha Articulated arm transfer device
US4730976A (en) * 1983-02-14 1988-03-15 Aeronca Electronics, Inc. Articulated arm transfer device
US5445172A (en) * 1990-05-18 1995-08-29 Semitool, Inc. Wafer holder with flexibly mounted gripping fingers
US5573023A (en) * 1990-05-18 1996-11-12 Semitool, Inc. Single wafer processor apparatus

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