JPS5720445A - Handling device for wafer - Google Patents
Handling device for waferInfo
- Publication number
- JPS5720445A JPS5720445A JP9537580A JP9537580A JPS5720445A JP S5720445 A JPS5720445 A JP S5720445A JP 9537580 A JP9537580 A JP 9537580A JP 9537580 A JP9537580 A JP 9537580A JP S5720445 A JPS5720445 A JP S5720445A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- fingers
- recess
- grooves
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
PURPOSE:To enable the automatic handling of a wafer without contamination nor damage by opening and closing fingers engaged with the elevational movements of a cylinder rod, interposing the wafer between the recess at the ends of the fingers or releasing the wafer from the recess. CONSTITUTION:Fluid 8 is introduced into housings 2, 3, and cylinder rod 5 is elevationally moved via the pressure of the fluid. Fingers 15, 16 secured to the central shaft of the gears 11, 12 engaged with the rod 5 are opened or closed by the elevational movements of the rod 5. Recess grooves 17, 18 made of Teflon are, for example, formed at the ends of the fingers 15, 16, and the wafer 27 erected in the grooves 24-26 of holders 21, 23, respectively are interposed between the grooves 17, 18 by closing the fingers and are scraped. When the fingers are, on the other hand, opened, the held wafer is placed on the holder. When the existence or absence of the wafer is photoelectrically detected, it can be automated, and the contamination in the handling step can be prevented by providing clean air blowing mechanism.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9537580A JPS5720445A (en) | 1980-07-11 | 1980-07-11 | Handling device for wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9537580A JPS5720445A (en) | 1980-07-11 | 1980-07-11 | Handling device for wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5720445A true JPS5720445A (en) | 1982-02-02 |
Family
ID=14135885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9537580A Pending JPS5720445A (en) | 1980-07-11 | 1980-07-11 | Handling device for wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5720445A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1984003196A1 (en) * | 1983-02-14 | 1984-08-16 | Brooks Ass | Articulated arm transfer device |
US4666366A (en) * | 1983-02-14 | 1987-05-19 | Canon Kabushiki Kaisha | Articulated arm transfer device |
US5445172A (en) * | 1990-05-18 | 1995-08-29 | Semitool, Inc. | Wafer holder with flexibly mounted gripping fingers |
-
1980
- 1980-07-11 JP JP9537580A patent/JPS5720445A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1984003196A1 (en) * | 1983-02-14 | 1984-08-16 | Brooks Ass | Articulated arm transfer device |
US4666366A (en) * | 1983-02-14 | 1987-05-19 | Canon Kabushiki Kaisha | Articulated arm transfer device |
US4730976A (en) * | 1983-02-14 | 1988-03-15 | Aeronca Electronics, Inc. | Articulated arm transfer device |
US5445172A (en) * | 1990-05-18 | 1995-08-29 | Semitool, Inc. | Wafer holder with flexibly mounted gripping fingers |
US5573023A (en) * | 1990-05-18 | 1996-11-12 | Semitool, Inc. | Single wafer processor apparatus |
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