KR900002119B1 - 반도체 장치 및 그 보호외피의 조립방법 - Google Patents

반도체 장치 및 그 보호외피의 조립방법 Download PDF

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Publication number
KR900002119B1
KR900002119B1 KR8202125A KR820002125A KR900002119B1 KR 900002119 B1 KR900002119 B1 KR 900002119B1 KR 8202125 A KR8202125 A KR 8202125A KR 820002125 A KR820002125 A KR 820002125A KR 900002119 B1 KR900002119 B1 KR 900002119B1
Authority
KR
South Korea
Prior art keywords
plate
frame
support
assembly
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR8202125A
Other languages
English (en)
Korean (ko)
Other versions
KR840000076A (ko
Inventor
피에르 로쉬 프랑시스
Original Assignee
디.제이.삭케스
엔.브이.필립스 글로아이람펜파브리켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디.제이.삭케스, 엔.브이.필립스 글로아이람펜파브리켄 filed Critical 디.제이.삭케스
Publication of KR840000076A publication Critical patent/KR840000076A/ko
Application granted granted Critical
Publication of KR900002119B1 publication Critical patent/KR900002119B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR8202125A 1981-05-18 1982-05-15 반도체 장치 및 그 보호외피의 조립방법 Expired KR900002119B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8109817A FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
US8109817 1981-05-18

Publications (2)

Publication Number Publication Date
KR840000076A KR840000076A (ko) 1984-01-30
KR900002119B1 true KR900002119B1 (ko) 1990-04-02

Family

ID=9258561

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8202125A Expired KR900002119B1 (ko) 1981-05-18 1982-05-15 반도체 장치 및 그 보호외피의 조립방법

Country Status (7)

Country Link
JP (1) JPS57196549A (https=)
KR (1) KR900002119B1 (https=)
DE (1) DE3217345A1 (https=)
FR (1) FR2506075A1 (https=)
GB (1) GB2098801B (https=)
IT (1) IT1152406B (https=)
NL (1) NL186206C (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617647A (ja) * 1984-06-21 1986-01-14 Toshiba Corp 回路基板
JPS61218151A (ja) * 1985-03-23 1986-09-27 Hitachi Ltd 半導体装置
JP2712461B2 (ja) * 1988-12-27 1998-02-10 日本電気株式会社 半導体装置の容器
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
DE4201931C1 (https=) * 1992-01-24 1993-05-27 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh + Co.Kg, 4788 Warstein, De

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
FR1468122A (fr) * 1965-02-17 1967-02-03 Motorola Inc Boîtier pour semi-conducteurs
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors
DE1564815A1 (de) * 1966-08-27 1970-02-26 Standard Elek K Lorenz Ag Verfahren zum Einbau von Halbleiteranordnungen in miniaturisierte Schaltungen
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
JPS5116258B2 (https=) * 1971-10-30 1976-05-22
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
JPS5272170A (en) * 1975-12-12 1977-06-16 Nec Corp Package for semiconductor elements
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof

Also Published As

Publication number Publication date
FR2506075A1 (fr) 1982-11-19
NL8202010A (nl) 1982-12-16
KR840000076A (ko) 1984-01-30
NL186206C (nl) 1990-10-01
DE3217345C2 (https=) 1987-07-02
NL186206B (nl) 1990-05-01
IT1152406B (it) 1986-12-31
JPH0119269B2 (https=) 1989-04-11
FR2506075B1 (https=) 1984-10-19
IT8221289A0 (it) 1982-05-14
JPS57196549A (en) 1982-12-02
GB2098801B (en) 1985-01-03
GB2098801A (en) 1982-11-24
DE3217345A1 (de) 1982-12-02

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