JPS5116258B2 - - Google Patents
Info
- Publication number
- JPS5116258B2 JPS5116258B2 JP46085966A JP8596671A JPS5116258B2 JP S5116258 B2 JPS5116258 B2 JP S5116258B2 JP 46085966 A JP46085966 A JP 46085966A JP 8596671 A JP8596671 A JP 8596671A JP S5116258 B2 JPS5116258 B2 JP S5116258B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46085966A JPS5116258B2 (https=) | 1971-10-30 | 1971-10-30 | |
| FR7238316A FR2158043B1 (https=) | 1971-10-30 | 1972-10-27 | |
| DE2252830A DE2252830C2 (de) | 1971-10-30 | 1972-10-27 | Halbleiterbauelement mit einem Halbleiterelement in einem hermetisch geschlossenen Gehäuse |
| CA155,193A CA981800A (en) | 1971-10-30 | 1972-10-30 | Uhf band semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46085966A JPS5116258B2 (https=) | 1971-10-30 | 1971-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4852178A JPS4852178A (https=) | 1973-07-21 |
| JPS5116258B2 true JPS5116258B2 (https=) | 1976-05-22 |
Family
ID=13873462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46085966A Expired JPS5116258B2 (https=) | 1971-10-30 | 1971-10-30 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5116258B2 (https=) |
| CA (1) | CA981800A (https=) |
| DE (1) | DE2252830C2 (https=) |
| FR (1) | FR2158043B1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615059U (https=) * | 1979-07-11 | 1981-02-09 | ||
| US4320438A (en) * | 1980-05-15 | 1982-03-16 | Cts Corporation | Multi-layer ceramic package |
| FR2506075A1 (fr) * | 1981-05-18 | 1982-11-19 | Radiotechnique Compelec | Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1305115A (fr) * | 1960-11-10 | 1962-09-28 | Rca Corp | Microélément de circuit électronique et ses modes de réalisation |
| US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
| FR1543300A (fr) * | 1967-08-11 | 1968-10-25 | Radiotechnique Coprim Rtc | Boîtier pour dispositif semi-conducteur à forte dissipation calorifique |
| FR1553893A (https=) * | 1967-11-28 | 1969-01-17 | ||
| JPS4322387Y1 (https=) * | 1968-02-22 | 1968-09-19 |
-
1971
- 1971-10-30 JP JP46085966A patent/JPS5116258B2/ja not_active Expired
-
1972
- 1972-10-27 FR FR7238316A patent/FR2158043B1/fr not_active Expired
- 1972-10-27 DE DE2252830A patent/DE2252830C2/de not_active Expired
- 1972-10-30 CA CA155,193A patent/CA981800A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4852178A (https=) | 1973-07-21 |
| FR2158043B1 (https=) | 1978-08-04 |
| CA981800A (en) | 1976-01-13 |
| DE2252830A1 (de) | 1973-05-30 |
| DE2252830C2 (de) | 1983-05-26 |
| FR2158043A1 (https=) | 1973-06-08 |