FR2506075B1 - - Google Patents

Info

Publication number
FR2506075B1
FR2506075B1 FR8109817A FR8109817A FR2506075B1 FR 2506075 B1 FR2506075 B1 FR 2506075B1 FR 8109817 A FR8109817 A FR 8109817A FR 8109817 A FR8109817 A FR 8109817A FR 2506075 B1 FR2506075 B1 FR 2506075B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8109817A
Other languages
French (fr)
Other versions
FR2506075A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR8109817A priority Critical patent/FR2506075A1/fr
Priority to DE19823217345 priority patent/DE3217345A1/de
Priority to GB8214182A priority patent/GB2098801B/en
Priority to IT21289/82A priority patent/IT1152406B/it
Priority to NLAANVRAGE8202010,A priority patent/NL186206C/xx
Priority to KR8202125A priority patent/KR900002119B1/ko
Priority to JP57080878A priority patent/JPS57196549A/ja
Publication of FR2506075A1 publication Critical patent/FR2506075A1/fr
Application granted granted Critical
Publication of FR2506075B1 publication Critical patent/FR2506075B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
FR8109817A 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection Granted FR2506075A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR8109817A FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
DE19823217345 DE3217345A1 (de) 1981-05-18 1982-05-08 Verfahren zum zusammenbauen einer halbleiteranordnung und des schutzgehaeuses derselben
GB8214182A GB2098801B (en) 1981-05-18 1982-05-14 Method of assembling a semiconductor package
IT21289/82A IT1152406B (it) 1981-05-18 1982-05-14 Metodo di assemblaggio di un dispositivo semiconduttore e del proprio contenitore protettivo
NLAANVRAGE8202010,A NL186206C (nl) 1981-05-18 1982-05-14 Werkwijze voor het assembleren van een halfgeleiderinrichting en het beschermingshuis ervan.
KR8202125A KR900002119B1 (ko) 1981-05-18 1982-05-15 반도체 장치 및 그 보호외피의 조립방법
JP57080878A JPS57196549A (en) 1981-05-18 1982-05-15 Method of assembling semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8109817A FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection

Publications (2)

Publication Number Publication Date
FR2506075A1 FR2506075A1 (fr) 1982-11-19
FR2506075B1 true FR2506075B1 (https=) 1984-10-19

Family

ID=9258561

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8109817A Granted FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection

Country Status (7)

Country Link
JP (1) JPS57196549A (https=)
KR (1) KR900002119B1 (https=)
DE (1) DE3217345A1 (https=)
FR (1) FR2506075A1 (https=)
GB (1) GB2098801B (https=)
IT (1) IT1152406B (https=)
NL (1) NL186206C (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617647A (ja) * 1984-06-21 1986-01-14 Toshiba Corp 回路基板
JPS61218151A (ja) * 1985-03-23 1986-09-27 Hitachi Ltd 半導体装置
JP2712461B2 (ja) * 1988-12-27 1998-02-10 日本電気株式会社 半導体装置の容器
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
DE4201931C1 (https=) * 1992-01-24 1993-05-27 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh + Co.Kg, 4788 Warstein, De

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
FR1468122A (fr) * 1965-02-17 1967-02-03 Motorola Inc Boîtier pour semi-conducteurs
US3515952A (en) * 1965-02-17 1970-06-02 Motorola Inc Mounting structure for high power transistors
DE1564815A1 (de) * 1966-08-27 1970-02-26 Standard Elek K Lorenz Ag Verfahren zum Einbau von Halbleiteranordnungen in miniaturisierte Schaltungen
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
JPS5116258B2 (https=) * 1971-10-30 1976-05-22
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
JPS5272170A (en) * 1975-12-12 1977-06-16 Nec Corp Package for semiconductor elements
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof

Also Published As

Publication number Publication date
FR2506075A1 (fr) 1982-11-19
NL8202010A (nl) 1982-12-16
KR840000076A (ko) 1984-01-30
NL186206C (nl) 1990-10-01
KR900002119B1 (ko) 1990-04-02
DE3217345C2 (https=) 1987-07-02
NL186206B (nl) 1990-05-01
IT1152406B (it) 1986-12-31
JPH0119269B2 (https=) 1989-04-11
IT8221289A0 (it) 1982-05-14
JPS57196549A (en) 1982-12-02
GB2098801B (en) 1985-01-03
GB2098801A (en) 1982-11-24
DE3217345A1 (de) 1982-12-02

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Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
ST Notification of lapse