KR900000205B1 - 결속상태가 개선된 반도체 장치의 제조장치 - Google Patents

결속상태가 개선된 반도체 장치의 제조장치 Download PDF

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KR900000205B1
KR900000205B1 KR1019850005537A KR850005537A KR900000205B1 KR 900000205 B1 KR900000205 B1 KR 900000205B1 KR 1019850005537 A KR1019850005537 A KR 1019850005537A KR 850005537 A KR850005537 A KR 850005537A KR 900000205 B1 KR900000205 B1 KR 900000205B1
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South Korea
Prior art keywords
wire
binding
gas
bowl
manufacturing apparatus
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KR1019850005537A
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English (en)
Korean (ko)
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KR860003654A (ko
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마쯔오 고바야시
오사무 우스다
요시히꼬 사노
고이찌로 아쯔미
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가부시끼가이샤 도오시바
사바 쇼오이찌
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Priority claimed from JP59219902A external-priority patent/JPS6197937A/ja
Priority claimed from JP59219903A external-priority patent/JPS6197938A/ja
Application filed by 가부시끼가이샤 도오시바, 사바 쇼오이찌 filed Critical 가부시끼가이샤 도오시바
Publication of KR860003654A publication Critical patent/KR860003654A/ko
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Publication of KR900000205B1 publication Critical patent/KR900000205B1/ko

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
KR1019850005537A 1984-10-19 1985-07-31 결속상태가 개선된 반도체 장치의 제조장치 KR900000205B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP59-219902 1984-10-19
JP59219902A JPS6197937A (ja) 1984-10-19 1984-10-19 半導体素子の組立方法及びその装置
JP59-219903 1984-10-19
JP59219903A JPS6197938A (ja) 1984-10-19 1984-10-19 半導体素子の組立方法

Publications (2)

Publication Number Publication Date
KR860003654A KR860003654A (ko) 1986-05-28
KR900000205B1 true KR900000205B1 (ko) 1990-01-23

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Country Status (2)

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KR (1) KR900000205B1 (zh)
CN (1) CN85106110B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI244419B (en) * 2003-09-25 2005-12-01 Unaxis Internat Tranding Ltd Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate
CN100336191C (zh) * 2005-03-04 2007-09-05 汕头华汕电子器件有限公司 用铜线形成半导体器件内引线的方法
CN104260009B (zh) * 2014-08-23 2016-05-11 华东光电集成器件研究所 一种衬底粘接夹持定位装置

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KR860003654A (ko) 1986-05-28
CN85106110B (zh) 1987-12-09
CN85106110A (zh) 1986-10-01

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