KR890015653A - 인쇄회로 기판의 제조방법 - Google Patents

인쇄회로 기판의 제조방법 Download PDF

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Publication number
KR890015653A
KR890015653A KR1019880002787A KR880002787A KR890015653A KR 890015653 A KR890015653 A KR 890015653A KR 1019880002787 A KR1019880002787 A KR 1019880002787A KR 880002787 A KR880002787 A KR 880002787A KR 890015653 A KR890015653 A KR 890015653A
Authority
KR
South Korea
Prior art keywords
manufacturing
circuit board
printed circuit
metal powder
dried
Prior art date
Application number
KR1019880002787A
Other languages
English (en)
Other versions
KR900009090B1 (ko
Inventor
이범천
Original Assignee
이범천
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이범천 filed Critical 이범천
Priority to KR1019880002787A priority Critical patent/KR900009090B1/ko
Publication of KR890015653A publication Critical patent/KR890015653A/ko
Application granted granted Critical
Publication of KR900009090B1 publication Critical patent/KR900009090B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

내용 없음

Description

인쇄 회로 기판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (1)

  1. 절연체인 후판의 표면을 연마 가공하며, 상기의 가공된 표면에 통상의 접착제를 도포하고, 상기의 도포된 접착제가 응고되기 전에 전도성의 금속 분말을 분사한 뒤 가압 건조시키며, 상기의 가압건조된 부위를 제외한 후판의 금속 분말을 제거하고, 상기의 가압건조된 금속분말에 전도성이 강한 구리, 은 또는 금을 포함한 금속액을 도금하는 단계를 포함함을 특징으로 하는 인쇄회로 기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880002787A 1988-03-16 1988-03-16 인쇄회로 기판의 제조방법 KR900009090B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019880002787A KR900009090B1 (ko) 1988-03-16 1988-03-16 인쇄회로 기판의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880002787A KR900009090B1 (ko) 1988-03-16 1988-03-16 인쇄회로 기판의 제조방법

Publications (2)

Publication Number Publication Date
KR890015653A true KR890015653A (ko) 1989-10-30
KR900009090B1 KR900009090B1 (ko) 1990-12-20

Family

ID=19272865

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880002787A KR900009090B1 (ko) 1988-03-16 1988-03-16 인쇄회로 기판의 제조방법

Country Status (1)

Country Link
KR (1) KR900009090B1 (ko)

Also Published As

Publication number Publication date
KR900009090B1 (ko) 1990-12-20

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