KR890011036A - 절연피복 와이어의 와이어 본딩방법 및 그 장치 - Google Patents

절연피복 와이어의 와이어 본딩방법 및 그 장치 Download PDF

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Publication number
KR890011036A
KR890011036A KR1019880016177A KR880016177A KR890011036A KR 890011036 A KR890011036 A KR 890011036A KR 1019880016177 A KR1019880016177 A KR 1019880016177A KR 880016177 A KR880016177 A KR 880016177A KR 890011036 A KR890011036 A KR 890011036A
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South Korea
Prior art keywords
wire
bonding
insulating
ball
coated
Prior art date
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KR1019880016177A
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English (en)
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KR910009779B1 (ko
Inventor
도우사꾸 고지마
쯔또무 미마따
스스무 오끼까와
미찌오 오까모또
다께시 가와나
사또시 우라야마
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
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Publication date
Priority claimed from JP62308540A external-priority patent/JPH077784B2/ja
Priority claimed from JP63091404A external-priority patent/JPH01264234A/ja
Application filed by 미다 가쓰시게, 가부시기가이샤 히다찌세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR890011036A publication Critical patent/KR890011036A/ko
Application granted granted Critical
Publication of KR910009779B1 publication Critical patent/KR910009779B1/ko

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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Abstract

내용 없음

Description

절연피복 와이어의 와이어 본딩방법 및 그 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 제 1의 본딩에서 볼의 형성방법을 도시한 개략적인 구성도.
제 2 도는 제 1 도의 방법에 의해서 형성된 볼을 도시한 정면도.
제 3 도는 제 1도와는 반대의 전극에 접속한 볼형성 방법을 도시한 개략적인 구성도.

Claims (7)

  1. 도전재의 바깥측에 절연피복해서 되는 절연피복 와이어의 본딩법으로서, 상기 피복와이어의 한쪽 끝을 아크전원의 양극측에 접속하고, 방전토오치를 아크전원의 음극측에 접속하고, 상기 절연피복 와이어의 선단과 방전토오치 사이에서 아크방전을 행해서 상기 선단에 볼을 형성하고, 상기 볼을 도전체 전극에 관한 본딩패트에 위치 결정해서 소정의 압력을 가하면서 본딩을 행하도록 한 와이어 본딩방법.
  2. 특허청구의 범위 제1항에 있어서, 상기 아크방전을 행할 때 불활성 가스 분위기 중에서 행하도록 한 와이어 본딩 방법.
  3. 특허청구의 범위 제1항에 있어서, 회전이 자유로운 금속제스풀에 상기 절연피복 와이어를 감고, 그 맨끝의 도전재를 상기 금속제스풀에 접속하고, 상기 아크전원을 상기 금속제스풀에 남아 있는 상기 절연피복을 와이어의 감긴길이에 비례해서 저하하는 전압을 인가할 수 있는 아크전원으로 하고, 상기 아크 전원의 양극측을 상기 금속제스풀에 회전접속함과 동시에 상기 금속제스풀을 접지하고, 음극측을 상기 방전토오치에 접속한 와이어 본딩방법.
  4. 도전재의 바깥측에 절연피복을 피복해서 되는 절연피복 와이어를 캐필러리의 스루홀내에 송출할 수 있게 삽입하는 것에 의해 상기 절연피복 와이어를 유지하고, 상기 절연피복 와이어의 선단을 상기 캐필러리에 의해서, 제1의 본딩패드에 위치결정해서 접합(제1의 본딩)하고, 다음에 상기 절연피복 와이어의 중간부분을 상기 캐필러리에 의해서 제2의 본딩 패드에 위치결정해서 접합(제2의 본딩)한 후 상기 절연피복 와이어를 그 다른 쪽끝에 인장력을 가해서 상기 제2의 본딩패드에서 떨어지게 하는 것에 의해 상기 제1,2의 본딩 패드 사이를 상기 절연피복 와이어로 배선하도록 한 절연피복 와이어의 와이어 본딩방법으로서, 아크전원의 양극측에 절연피복 와이어의 도전재를, 음극측에 반전토오치를 각각 접속하고, 불황성 가스 분위기중에서 아크방전을 행하여 상기 절연피복 와이어의 선단에 볼을 형성하고, 캐필러리에 의해서 상기 볼을 제1의 본딩패드에 위치결정함과 동시에 상기 볼에 소정의 압력을 가하면서 초음파 진동을 부가하는 것에 의해 제1의 본딩을 행하고, 상기 캐필러리에 의해서 상기 절연피복 와이어의 중간부분을 상기 와이어의 절연피복의 글라스 전이온도 이상으로까지 가열된 제2의 본딩패드에 위치결정함과 동시에 상기 중간부분에 소정의 압력을 가하면서 초음파 진동을 부가하는 것에 의해 제2의 본딩을 행하도록 한 절연피복 와이어의 화이어 본딩방법.
  5. 도전재의 바깥측에 절연피복 와이어를 피복해서 되는 절연피복 와이어의 한쪽끝을 캐필러리의 스루홀 내에 송출할 수 있게 삽입하고, 아크전원을 사용해서 상기 절연피복 와이어의 선단과 방전토오치 사이에서 아크 방전을 행하여 상기 선단에 볼을 형성하고, 상기 캐필러리에 의해서 상기 볼을 본딩패드에 위치결정함과 동시에 상기 볼에 소정의 압력을 가하면서 초음파 진동을 부가하는 것에 의해 본딩을 행하도록 한 절연피복 와이어의 와이어 본딩방법으로서, 회전이 자유로운 금속제스풀에 절연피복 와이어를 감고, 그 맨끝의 도전재를 상기 금속제스풀에 접속하고, 아크전원을 상기 금속제스풀에 남아 있는 상기 절연피복 와이어의 감긴길이에 비례해서 저하하는 전압을 인가할 수 있는 아크전원으로 하고, 상기 아크전원의 양극측을 상기 금속제스풀에 회전접속함과 동시에 상기 금속제스풀에 접지하고, 음극측을 방전토오치에 접속하도록 한 절연피복 와이어의 본딩방법.
  6. 도전재의 바깥둘레를 절연재로 피폭한 피복와이어의 본딩장치에서, 피복제거용의 열풍노즐(80)과 제1의 본딩종료 후에 상기 열풍노즐을 대기위치에서 피복와이어의 제2의 본딩접속부에 대향하는 소정의 높이위치에 요동시키는 구동수단(83)을 본딩헤드(85)에 탑재하여 상기 열풍노즐에서 분출하는 열풍에 의해 제2의 본딩접속부 및 그 주변부의 피복을 제거하고, 상기 피복이 제거된 제2의 본딩접속부를 초음파가 인가된 캐필러리(10)으로 가압하여 상대의 전극면에 초음파 용접하도록 한 피복와이어의 본딩장치.
  7. 도전재의 바깥쪽에 절연피복해서 되는 와이어의 본딩 장치로서, 양극측에 상기 와이어의 도전재가 접속되는 아크전원(5), 상기 아크전원의 음극측에 접속되고, 상기 와이어의 선단과의 사이에서 아크방전을 행하고, 상기 선단부에 볼을 형성하게 하도록 마련된 방전토오치(4) 및 상기 와이어의 볼을 도전체 전극에 관한 본딩패드에 위치결정해서 본딩하는 수단으로 구성된 절연피복 와이어의 본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880016177A 1987-12-08 1988-12-05 절연피복 와이어의 와이어 본딩방법 및 그 장치 KR910009779B1 (ko)

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JP62308540A JPH077784B2 (ja) 1987-12-08 1987-12-08 絶縁被覆ワイヤのワイヤボンデイング方法
JP63091404A JPH01264234A (ja) 1988-04-15 1988-04-15 被覆細線のボンディング装置
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