KR890011028A - 실리콘 기판상에 단결정 β-sic층을 성장시키는 방법 - Google Patents
실리콘 기판상에 단결정 β-sic층을 성장시키는 방법 Download PDFInfo
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- KR890011028A KR890011028A KR1019880016974A KR880016974A KR890011028A KR 890011028 A KR890011028 A KR 890011028A KR 1019880016974 A KR1019880016974 A KR 1019880016974A KR 880016974 A KR880016974 A KR 880016974A KR 890011028 A KR890011028 A KR 890011028A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 24
- 229910052710 silicon Inorganic materials 0.000 title claims description 24
- 239000010703 silicon Substances 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims 16
- 239000013078 crystal Substances 0.000 title description 2
- 239000007789 gas Substances 0.000 claims 19
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 13
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims 6
- 239000005046 Chlorosilane Substances 0.000 claims 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 5
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 5
- 239000004215 Carbon black (E152) Substances 0.000 claims 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims 4
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims 4
- 229930195733 hydrocarbon Natural products 0.000 claims 4
- 150000002430 hydrocarbons Chemical class 0.000 claims 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 claims 1
- 239000001294 propane Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims 1
- 239000005052 trichlorosilane Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- H01L21/205—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/901—Levitation, reduced gravity, microgravity, space
- Y10S117/902—Specified orientation, shape, crystallography, or size of seed or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/148—Silicon carbide
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 따른 버퍼층과 단결정 β-sic층을 갖는 실리콘 기판의 단면도.
제 2 도는 본 발명에 사용되는 화학 기상 성장에 대한 반응용기(reactor chamber)의 단면도와 가스 흐름도.
Claims (12)
- 반응용기에 반도체 기판을 제공하는 단계(a)와, 상기 반응용기안에 압력을 대기합 이하로 감소기키는 단계(b)와, 상기 반응용기에 아세틸렌을 함유하는 첫번째 혼합가스를 흐르게 하는 단계(c)와, 그 위에 탄화 실리콘의 버퍼층이 성장되도록 상기 실리콘 기판을 800-1000℃의 온도로 가열하는 단계(d)와, 상기 첫번째 혼합가스를 중단하고, 탄화수소와 클로로실란 가스들을 함유하는 두번째 혼합가스를 상기 반응용기에 흐르게 하는 단계(e)와, 상기 단결정 실리콘 카바이드(β-sic)층이 상기 버퍼층상에 성장하도록 상기 실리콘 기판을 1000℃보다 낮은 온도로 가열하는 단계(f)로 이루어지는 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층을 성장시키는 방법.
- 제 1 항에 있어서, 단계(e)에서 상기 탄화수소 가스가 프로판과 아세틸렌 가스들의 그룹으로 부터 선택되는 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층이 성장시키는 방법.
- 제 1 항에 있어서, 단계(e)에서 상기 클로로실란 가스가 트리클로로실란과 디클로로실란과 가스의 그룹으로부터 선택되는 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층을 성장시키는 방법.
- 제 1 항에 있어서, 상기 실리콘 기판이에 대하여 0.5°-10°오프(111)의 면지수를 갖는 실리콘 기판상에 단결정 실리콘(β-sic)층을 성장시키는 방법.
- 제 1 항에 있어서, 상기 버퍼층 성장의 상기 단계(d)를 60-100Å 두께의 상기 버퍼층이 얻어질때 까지 계속하는 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층을 성장시키는 방법.
- 제 1 항에 있어서, 단계(d)에서 실리콘 기판의 상기 온도가 810-850℃의 범위에 있는 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층을 성장시키기 위한 방법.
- 제 1 항에 있어서, 단계(f)에서 실리콘 기판의 상기 온도가 850-950℃의 범위에 있는 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층을 성장시키기 위한 방법.
- 제 1 항에 있어서, 단계(c)에서 상기 첫번째 혼합가스가 수소가스를 포함하고, 상기 수소 가스와 아세틸렌 가스의 혼합비가 10보다 큰 실리콘 기판상에 단결성 실리콘 카바이드(β-sic)층을 성장시키는 방법.
- 제 1 항에 있어서, 상기 클로로실란 가스와 탄화수소 가스의 혼합비가 30보다 큰 실리콘 기판상에 단결성 실리콘 카바이드(β-sic)층을 성장시키는 방법.
- 제 1 항에 있어서, 단계(e)에서 상기 두번째 혼합가스가 수소가스를 함유하고, 상기 수소가스와 함께 첨가하는 다른 가스들의 혼합비가 10보다 큰 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층을 성장시키기 위한 방법.
- 제 1 항에 있어서, 단계(e)와 단계(f)에서 상기 단결성 실리콘 카바이드(β-sic)층의 성장 공정을 1㎛보다 큰 두께를 갖는 상기 β-sic층이 얻어질 때까지 계속하는 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층을 성장시키기 위한 방법.
- 반응용기에 실리콘 기판을 제공하는 단계와, 상기 반응용기 안의 입력을 대기압 아래의 레벨로 감소시키는 단계와, 반응용기로 수소가스를 흐르게 하는 단계와, 상기 실리콘 기판을 800-1000℃의 온도로 가열하여 상기 실리콘 기판의 표면을 세척하는 단계와, 아세틸렌을 함유하는 첫번째 혼합가스를 상기 반응용기도 흐르게 하는 단계와, 상기 실리콘 기판을 800-1000℃의 온도로 가열하여 탄화 실리콘의 버퍼층을 상기 실리콘 기판상에 성장시키는 단계와, 상기 첫번째 혼합가스를 중단하고, 탄화수소와 클로로실란 가스들을 함유하는 두번째 혼합가스를 상기 반응용기로 흐르게 하는 단계와, 상기 실리콘 기판을 1000℃보다 낮은 온도로 가열하여 단결정 실리콘 카바이드(β-sic)층을 상기 버퍼층위에 성장시키는 단계들로 이루어지는 실리콘 기판상에 단결정 실리콘 카바이드(β-sic)층을 성장시키는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62320100A JP2534525B2 (ja) | 1987-12-19 | 1987-12-19 | β−炭化シリコン層の製造方法 |
JP87-320100 | 1987-12-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890011028A true KR890011028A (ko) | 1989-08-12 |
KR920004173B1 KR920004173B1 (ko) | 1992-05-30 |
Family
ID=18117713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880016974A KR920004173B1 (ko) | 1987-12-19 | 1988-12-19 | 실리콘 기판상에 단결정 β-sic층을 성장시키는 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4855254A (ko) |
EP (1) | EP0322615B1 (ko) |
JP (1) | JP2534525B2 (ko) |
KR (1) | KR920004173B1 (ko) |
DE (1) | DE3879143T2 (ko) |
Cited By (1)
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KR100475040B1 (ko) * | 1995-11-08 | 2005-06-20 | 크리 인코포레이티드 | 실리콘카바이드상의산화막결함저감방법 |
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US9797064B2 (en) | 2013-02-05 | 2017-10-24 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion |
US9017804B2 (en) | 2013-02-05 | 2015-04-28 | Dow Corning Corporation | Method to reduce dislocations in SiC crystal growth |
US9738991B2 (en) | 2013-02-05 | 2017-08-22 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion |
US8940614B2 (en) | 2013-03-15 | 2015-01-27 | Dow Corning Corporation | SiC substrate with SiC epitaxial film |
US9279192B2 (en) | 2014-07-29 | 2016-03-08 | Dow Corning Corporation | Method for manufacturing SiC wafer fit for integration with power device manufacturing technology |
JP2015145536A (ja) * | 2015-03-24 | 2015-08-13 | セイコーエプソン株式会社 | 立方晶炭化珪素膜の製造方法 |
RU2578104C1 (ru) * | 2015-04-07 | 2016-03-20 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" (МИЭТ) | Способ газофазной карбидизации поверхности монокристаллического кремния ориентации (111), (100) |
EP3503163A1 (en) * | 2017-12-21 | 2019-06-26 | EpiGan NV | A method for forming a silicon carbide film onto a silicon substrate |
CN109599329B (zh) * | 2018-12-05 | 2023-08-08 | 江西兆驰半导体有限公司 | 一种硅衬底上生长氮极性iii族氮化物半导体层的方法 |
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GB1054518A (ko) * | 1964-12-05 | 1900-01-01 | ||
US4000028A (en) * | 1973-04-24 | 1976-12-28 | Rohm And Haas Company | Method of making absorbent pads |
DE2364989C3 (de) * | 1973-12-28 | 1979-10-18 | Consortium Fuer Elektrochemische Industrie Gmbh, 8000 Muenchen | Verfahren zur Herstellung von Schichten aus Siliciumcarbid auf einem Siliciumsubstrat |
US3956032A (en) * | 1974-09-24 | 1976-05-11 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Process for fabricating SiC semiconductor devices |
US4459338A (en) * | 1982-03-19 | 1984-07-10 | The United States Of America As Represented By The United States Department Of Energy | Method of deposition of silicon carbide layers on substrates and product |
JPS59203799A (ja) * | 1983-04-28 | 1984-11-17 | Sharp Corp | 炭化珪素単結晶基板の製造方法 |
US4865659A (en) * | 1986-11-27 | 1989-09-12 | Sharp Kabushiki Kaisha | Heteroepitaxial growth of SiC on Si |
-
1987
- 1987-12-19 JP JP62320100A patent/JP2534525B2/ja not_active Expired - Fee Related
-
1988
- 1988-12-09 DE DE8888120580T patent/DE3879143T2/de not_active Expired - Fee Related
- 1988-12-09 EP EP88120580A patent/EP0322615B1/en not_active Expired - Lifetime
- 1988-12-13 US US07/283,642 patent/US4855254A/en not_active Expired - Lifetime
- 1988-12-19 KR KR1019880016974A patent/KR920004173B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100475040B1 (ko) * | 1995-11-08 | 2005-06-20 | 크리 인코포레이티드 | 실리콘카바이드상의산화막결함저감방법 |
Also Published As
Publication number | Publication date |
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EP0322615B1 (en) | 1993-03-10 |
DE3879143T2 (de) | 1993-06-17 |
JPH01162326A (ja) | 1989-06-26 |
US4855254A (en) | 1989-08-08 |
EP0322615A1 (en) | 1989-07-05 |
KR920004173B1 (ko) | 1992-05-30 |
JP2534525B2 (ja) | 1996-09-18 |
DE3879143D1 (de) | 1993-04-15 |
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