KR880701460A - 집적회로 밀봉 방법 및 탄력성 유전체 스트립 - Google Patents
집적회로 밀봉 방법 및 탄력성 유전체 스트립Info
- Publication number
- KR880701460A KR880701460A KR1019870701258A KR870701258A KR880701460A KR 880701460 A KR880701460 A KR 880701460A KR 1019870701258 A KR1019870701258 A KR 1019870701258A KR 870701258 A KR870701258 A KR 870701258A KR 880701460 A KR880701460 A KR 880701460A
- Authority
- KR
- South Korea
- Prior art keywords
- pct
- circuits
- integrated circuit
- strip
- sealing method
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Chemical & Material Sciences (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Details Of Aerials (AREA)
- Transmitters (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8606333A FR2598258B1 (fr) | 1986-04-30 | 1986-04-30 | Procede d'encapsulation de circuits integres. |
PCT/FR1987/000143 WO1987006763A1 (fr) | 1986-04-30 | 1987-04-29 | Procede d'encapsulation de circuits integres |
Publications (1)
Publication Number | Publication Date |
---|---|
KR880701460A true KR880701460A (ko) | 1988-07-27 |
Family
ID=9334825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870701258A KR880701460A (ko) | 1986-04-30 | 1987-12-30 | 집적회로 밀봉 방법 및 탄력성 유전체 스트립 |
Country Status (8)
Country | Link |
---|---|
US (1) | US4857483A (ko) |
EP (2) | EP0244322B1 (ko) |
JP (1) | JP2759083B2 (ko) |
KR (1) | KR880701460A (ko) |
AT (1) | ATE64493T1 (ko) |
DE (1) | DE3770691D1 (ko) |
FR (1) | FR2598258B1 (ko) |
WO (1) | WO1987006763A1 (ko) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5026667A (en) * | 1987-12-29 | 1991-06-25 | Analog Devices, Incorporated | Producing integrated circuit chips with reduced stress effects |
US4954308A (en) * | 1988-03-04 | 1990-09-04 | Citizen Watch Co., Ltd. | Resin encapsulating method |
FR2659157B2 (fr) * | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
US5049526A (en) * | 1989-06-07 | 1991-09-17 | Motorola, Inc. | Method for fabricating semiconductor device including package |
FR2659311B1 (fr) * | 1990-03-12 | 1992-05-22 | Potain Sa | Dispositif motorise de prehension de charge a commande a distance. |
US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
US5172851A (en) * | 1990-09-20 | 1992-12-22 | Matsushita Electronics Corporation | Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device |
KR940002444B1 (ko) * | 1990-11-13 | 1994-03-24 | 금성일렉트론 주식회사 | 반도체 소자의 패키지 어셈블리 방법 |
JP2765278B2 (ja) * | 1991-05-31 | 1998-06-11 | 株式会社デンソー | 電子装置の製造方法 |
US5434750A (en) * | 1992-02-07 | 1995-07-18 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package for certain non-square die shapes |
US5262927A (en) * | 1992-02-07 | 1993-11-16 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package |
US5958100A (en) * | 1993-06-03 | 1999-09-28 | Micron Technology, Inc. | Process of making a glass semiconductor package |
JP3238004B2 (ja) * | 1993-07-29 | 2001-12-10 | 株式会社東芝 | 半導体装置の製造方法 |
US5438477A (en) * | 1993-08-12 | 1995-08-01 | Lsi Logic Corporation | Die-attach technique for flip-chip style mounting of semiconductor dies |
US5388327A (en) * | 1993-09-15 | 1995-02-14 | Lsi Logic Corporation | Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package |
US5477611A (en) * | 1993-09-20 | 1995-12-26 | Tessera, Inc. | Method of forming interface between die and chip carrier |
US5581445A (en) * | 1994-02-14 | 1996-12-03 | Us3, Inc. | Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module |
US5478517A (en) * | 1994-02-28 | 1995-12-26 | Gennum Corporation | Method for molding IC chips |
US5422313A (en) * | 1994-05-03 | 1995-06-06 | Texas Instruments Incorporated | Integrated circuit device and manufacturing method using photoresist lead covering |
US5776796A (en) * | 1994-05-19 | 1998-07-07 | Tessera, Inc. | Method of encapsulating a semiconductor package |
US5834339A (en) | 1996-03-07 | 1998-11-10 | Tessera, Inc. | Methods for providing void-free layers for semiconductor assemblies |
US5915170A (en) * | 1994-09-20 | 1999-06-22 | Tessera, Inc. | Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
US6388338B1 (en) | 1995-04-28 | 2002-05-14 | Stmicroelectronics | Plastic package for an integrated electronic semiconductor device |
EP0704289B1 (en) * | 1994-09-30 | 1999-12-22 | STMicroelectronics S.r.l. | Method for manufacturing thin plastic packages |
JP3246848B2 (ja) * | 1995-02-22 | 2002-01-15 | アピックヤマダ株式会社 | 汎用ゲート位置樹脂モールド装置および樹脂モールド方法 |
AU710682B2 (en) | 1995-05-17 | 1999-09-30 | Chamberlain Group, Inc., The | Rolling code security system |
FR2741191B1 (fr) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | Procede de fabrication d'un micromodule, notamment pour cartes a puces |
US5706952A (en) * | 1996-01-11 | 1998-01-13 | Autosplice Systems Inc. | Continuous carrier for electrical or mechanical components |
US6202853B1 (en) | 1996-01-11 | 2001-03-20 | Autosplice Systems, Inc. | Secondary processing for electrical or mechanical components molded to continuous carrier supports |
US6294411B1 (en) * | 1996-10-25 | 2001-09-25 | Nippon Steel Semiconductor Corporation | Method for molding a semiconductor device utilizing a satin finish |
US5833903A (en) * | 1996-12-10 | 1998-11-10 | Great American Gumball Corporation | Injection molding encapsulation for an electronic device directly onto a substrate |
SG64985A1 (en) * | 1997-05-06 | 1999-05-25 | Advanced Systems Automation Li | Method and apparatus for moulding plastic packages |
JPH11186097A (ja) * | 1997-12-25 | 1999-07-09 | Matsushita Electric Ind Co Ltd | 電子部品の製造方法及び製造装置 |
JP3334864B2 (ja) * | 1998-11-19 | 2002-10-15 | 松下電器産業株式会社 | 電子装置 |
US6214640B1 (en) | 1999-02-10 | 2001-04-10 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages |
US6748650B2 (en) | 2001-06-27 | 2004-06-15 | Visteon Global Technologies, Inc. | Method for making a circuit assembly having an integral frame |
JP2004134591A (ja) * | 2002-10-10 | 2004-04-30 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP4039298B2 (ja) * | 2003-04-08 | 2008-01-30 | 株式会社デンソー | 樹脂封止型半導体装置およびその製造方法ならびに成形型 |
US7030504B2 (en) * | 2003-05-30 | 2006-04-18 | Asm Technology Singapore Pte Ltd. | Sectional molding system |
US8399972B2 (en) * | 2004-03-04 | 2013-03-19 | Skyworks Solutions, Inc. | Overmolded semiconductor package with a wirebond cage for EMI shielding |
US20080112151A1 (en) | 2004-03-04 | 2008-05-15 | Skyworks Solutions, Inc. | Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components |
US9148409B2 (en) | 2005-06-30 | 2015-09-29 | The Chamberlain Group, Inc. | Method and apparatus to facilitate message transmission and reception using different transmission characteristics |
US7225537B2 (en) * | 2005-01-27 | 2007-06-05 | Cardxx, Inc. | Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces |
US8422667B2 (en) | 2005-01-27 | 2013-04-16 | The Chamberlain Group, Inc. | Method and apparatus to facilitate transmission of an encrypted rolling code |
AU2005329469B2 (en) * | 2005-03-23 | 2012-02-16 | Cardxx, Inc. | Method for making Advanced Smart Cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
CN100446231C (zh) * | 2006-01-25 | 2008-12-24 | 矽品精密工业股份有限公司 | 半导体封装结构及其制法 |
CN100446230C (zh) * | 2006-01-25 | 2008-12-24 | 矽品精密工业股份有限公司 | 半导体封装结构及其制法 |
WO2008024761A2 (en) | 2006-08-21 | 2008-02-28 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
US7712933B2 (en) | 2007-03-19 | 2010-05-11 | Interlum, Llc | Light for vehicles |
US8408773B2 (en) | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
EP2232592B1 (en) * | 2007-12-12 | 2013-07-17 | Innotec Corporation | Method for overmolding a circuit board |
US7815339B2 (en) * | 2008-01-09 | 2010-10-19 | Innotec Corporation | Light module |
US9679869B2 (en) | 2011-09-02 | 2017-06-13 | Skyworks Solutions, Inc. | Transmission line for high performance radio frequency applications |
US8948712B2 (en) | 2012-05-31 | 2015-02-03 | Skyworks Solutions, Inc. | Via density and placement in radio frequency shielding applications |
WO2013188678A1 (en) | 2012-06-13 | 2013-12-19 | Innotec, Corp. | Flexible light pipe |
KR101921686B1 (ko) | 2012-06-14 | 2018-11-26 | 스카이워크스 솔루션즈, 인코포레이티드 | 와이어 본드 패드 및 관련된 시스템, 장치, 및 방법을 포함하는 전력 증폭기 모듈 |
CN104885216B (zh) | 2012-07-13 | 2017-04-12 | 天工方案公司 | 在射频屏蔽应用中的轨道设计 |
US10652743B2 (en) | 2017-12-21 | 2020-05-12 | The Chamberlain Group, Inc. | Security system for a moveable barrier operator |
CN108540086A (zh) * | 2018-01-18 | 2018-09-14 | 浙江人和光伏科技有限公司 | 一种太阳能电池接线盒的导电模块 |
US11074773B1 (en) | 2018-06-27 | 2021-07-27 | The Chamberlain Group, Inc. | Network-based control of movable barrier operators for autonomous vehicles |
WO2020028502A1 (en) | 2018-08-01 | 2020-02-06 | The Chamberlain Group, Inc. | Movable barrier operator and transmitter pairing over a network |
US10997810B2 (en) | 2019-05-16 | 2021-05-04 | The Chamberlain Group, Inc. | In-vehicle transmitter training |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5017452B2 (ko) * | 1972-06-06 | 1975-06-20 | ||
NL189379C (nl) * | 1977-05-05 | 1993-03-16 | Richardus Henricus Johannes Fi | Werkwijze voor inkapselen van micro-elektronische elementen. |
JPS54162963A (en) * | 1978-06-14 | 1979-12-25 | Mitsubishi Electric Corp | Manufacture of resin-sealed semiconductor device |
JPS57202745A (en) * | 1981-06-05 | 1982-12-11 | Yamagata Nippon Denki Kk | Manufacture of semiconductor device |
JPS5837692A (ja) * | 1981-08-31 | 1983-03-04 | ヤマハ株式会社 | 電子楽器 |
JPS5827326A (ja) * | 1981-08-11 | 1983-02-18 | Japan Steel Works Ltd:The | Icチツプの樹脂封止方法 |
FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
US4504435A (en) * | 1982-10-04 | 1985-03-12 | Texas Instruments Incorporated | Method for semiconductor device packaging |
JPS6074446A (ja) * | 1984-04-02 | 1985-04-26 | Hitachi Ltd | 半導体プラスチツクパツケ−ジの製造方法 |
JPS6164794A (ja) * | 1984-09-05 | 1986-04-03 | 日清製油株式会社 | 魚臭のないepa含有脂質成分 |
FI76220C (fi) * | 1984-09-17 | 1988-09-09 | Elkotrade Ag | Foerfarande foer inkapsling av pao ett baerarband anordnade halvledarkomponenter. |
-
1986
- 1986-04-30 FR FR8606333A patent/FR2598258B1/fr not_active Expired
-
1987
- 1987-04-29 JP JP62502800A patent/JP2759083B2/ja not_active Expired - Fee Related
- 1987-04-29 WO PCT/FR1987/000143 patent/WO1987006763A1/fr not_active Application Discontinuation
- 1987-04-29 AT AT87400986T patent/ATE64493T1/de active
- 1987-04-29 EP EP87400986A patent/EP0244322B1/fr not_active Expired - Lifetime
- 1987-04-29 US US07/148,655 patent/US4857483A/en not_active Expired - Lifetime
- 1987-04-29 EP EP87902560A patent/EP0264416A1/fr active Pending
- 1987-04-29 DE DE8787400986T patent/DE3770691D1/de not_active Expired - Fee Related
- 1987-12-30 KR KR1019870701258A patent/KR880701460A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
FR2598258B1 (fr) | 1988-10-07 |
JPS63503265A (ja) | 1988-11-24 |
US4857483A (en) | 1989-08-15 |
EP0244322A1 (fr) | 1987-11-04 |
FR2598258A1 (fr) | 1987-11-06 |
EP0264416A1 (fr) | 1988-04-27 |
JP2759083B2 (ja) | 1998-05-28 |
DE3770691D1 (de) | 1991-07-18 |
WO1987006763A1 (fr) | 1987-11-05 |
ATE64493T1 (de) | 1991-06-15 |
EP0244322B1 (fr) | 1991-06-12 |
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |