KR880006967A - 싱글 인라인형 수직플러그 삽입회로 모듈 - Google Patents

싱글 인라인형 수직플러그 삽입회로 모듈 Download PDF

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Publication number
KR880006967A
KR880006967A KR870013393A KR870013393A KR880006967A KR 880006967 A KR880006967 A KR 880006967A KR 870013393 A KR870013393 A KR 870013393A KR 870013393 A KR870013393 A KR 870013393A KR 880006967 A KR880006967 A KR 880006967A
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KR
South Korea
Prior art keywords
region
resistance
carrier
resistive
circuit module
Prior art date
Application number
KR870013393A
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English (en)
Inventor
카인들 미카엘
Original Assignee
휘티쉬, 네테부쉬
지멘스 악티엔게젤샤프트
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Application filed by 휘티쉬, 네테부쉬, 지멘스 악티엔게젤샤프트 filed Critical 휘티쉬, 네테부쉬
Publication of KR880006967A publication Critical patent/KR880006967A/ko

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0317Thin film conductor layer; Thin film passive component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09281Layout details of a single conductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727Varying width along a single conductor; Conductors or pads having different widths
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10386Clip leads; Terminals gripping the edge of a substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Prostheses (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • External Artificial Organs (AREA)
  • Glass Compositions (AREA)
  • Mechanical Operated Clutches (AREA)
  • Multi-Conductor Connections (AREA)
  • Fuses (AREA)
  • Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
  • Electronic Switches (AREA)
  • Channel Selection Circuits, Automatic Tuning Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용 없음

Description

싱글 인라인형 수직플러그 삽입회로 모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따라 구성된 회로모듈의 실시예의 단면도.
제3도는 본 발명에 따른 실시예의 저항통로 및/또는 저항표면의 크기의 예를 나타내는 다이어그램.
제4도는 본 발명에 따른 또다른 실시예의 저항통로 및/또는 저항표면의 크기의 예를 나타내는 다이어그램.

Claims (3)

  1. 세라믹과 같은 것으로 이루어진 캐리어가 외부의 전기적 터미널로 사용되도록 캐리어 가장자리를 따라 싱글 인라인형으로 캐리어 평면에 배열되는 일련의 금속핀과 ; 저항통로 및 또는 저항표면의 제1의 영역이 각 경우에 저항통로 및 또는 저항표면의 제2의 영역에 비해 캐리어 가장자리에 있는 금속핀에 더 가깝게 배열되는, 후막 및/또는 박막기술로 형성되는 하나 이상의 저항통로 및/또는 저항표면 : 그리고 동일한 캐리어 상에 배열되는 서로 다른 저항통로 및/또는 저항표면 사이와 금속핀(M)을 위한 프린트된 접촉표면과 저항 통로 및/또는 저항표면의 프린트된 터미널 사이의 프린트된 라인, 그리고 스위칭시스템의 가입자선의 공급 저항을 위해 부가적으로 제공되는 안전퓨우즈 및 캐패시터와 같은 전기소자에서의 적당한 라인과같은 저항통로 및/또는 저항표면의 터미널(LA)에서의 라인을 지지하는 싱글 인라인형 수직플러그 삽입회로 모듈에 있어서, 금속핀에 가깝게 위치되는 제1의 영역은 동작중 매 단위표면구역(㎠)당 제2의 영역 보다 더 높은 열확산이 이루어지는 식으로 구성되고, 저항통로 및/또는 저항표면에 속하는 라인의 터미널은 동작중 전류가 제1의 영역으로부터 제2 영역으로 또는 그와 반대로 흐르는 식으로 배열되는 것을 특징으로 하는 싱글 인라인형 수직플러그 삽입회로모듈.
  2. 제1항에 있어서, 제1의 영역의 필름폭 그리고 따라서 그것의 컨덕턴스 값은 제2의 영역의 필름폭 그리고 따라서 그것의 컨덕턴스값 보다더 적은 것을 특징으로 하는 싱글 인라인형 수직플러그 삽입회로모듈.
  3. 제1항 또는 제2항에 있어서, 제1의 영역의 필름두께 그리고 따라서 그것의 컨덕턴스 값은 제2의 영역에 필름두께 그리고 따라서 그것의 컨덕턴스값 보다더 적은 것을 특징으로 하는 싱글 인라인형 수직플러그 삽입회로모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870013393A 1986-11-28 1987-11-27 싱글 인라인형 수직플러그 삽입회로 모듈 KR880006967A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3640694.5 1986-11-28
DE3640694 1986-11-28

Publications (1)

Publication Number Publication Date
KR880006967A true KR880006967A (ko) 1988-07-25

Family

ID=6315002

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870013393A KR880006967A (ko) 1986-11-28 1987-11-27 싱글 인라인형 수직플러그 삽입회로 모듈

Country Status (10)

Country Link
US (1) US4801916A (ko)
EP (1) EP0268935B1 (ko)
JP (1) JPS63142842A (ko)
KR (1) KR880006967A (ko)
AT (1) ATE70661T1 (ko)
BR (1) BR8706423A (ko)
DE (1) DE3775349D1 (ko)
DK (1) DK168778B1 (ko)
FI (1) FI875254A (ko)
GR (1) GR3003994T3 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69024313T2 (de) * 1989-10-20 1996-06-13 Matsushita Electric Ind Co Ltd Oberflächenmontierbare Netzwerkvorrichtung
JPH03291869A (ja) * 1990-04-09 1991-12-24 Hitachi Ltd 電子装置
US5039851A (en) * 1990-05-23 1991-08-13 Galileo Electro-Optics Corporation Plug in detector module
KR101799028B1 (ko) 2016-09-02 2017-11-17 순천향대학교 산학협력단 인공치아용 월러스토나이트계 결정화 유리 및 이의 착색 방법
DE102018101792B4 (de) * 2018-01-26 2021-03-25 Harting Electric Gmbh & Co. Kg Leiterkartenverbinder und dazugehörige Leiterkartenanordnung zur Übertragung hoher Stromstärken

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2691716A (en) * 1950-12-01 1954-10-12 William H Wellens Vaporizer
US2978664A (en) * 1958-11-05 1961-04-04 Texas Instruments Inc Resistive element
DE1245458B (de) * 1966-04-27 1967-07-27 Telefunken Patent Integrierte Schaltung, deren Traegerplaettchen gut waermeleitfaehig ist
US4118112A (en) * 1976-12-03 1978-10-03 Xerox Corporation Method for reducing power dissipation in tapered resistor devices
DE2655841C3 (de) * 1976-12-09 1981-11-19 Siemens AG, 1000 Berlin und 8000 München Integrierter Widerstandsbaustein zum Einlöten in eine Flachbaugruppe
DE3031912A1 (de) * 1980-08-23 1982-04-01 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zur potentialunabhaengigen waermeabfuehrung
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
JPS5844561U (ja) * 1981-09-18 1983-03-25 篠塚 正男 直結式自動変速装置
DE3605692A1 (de) * 1986-02-21 1986-11-06 Siemens AG, 1000 Berlin und 8000 München Temperaturaenderungen ausgesetzte anordnung

Also Published As

Publication number Publication date
DE3775349D1 (de) 1992-01-30
JPS63142842A (ja) 1988-06-15
EP0268935B1 (de) 1991-12-18
DK625387D0 (da) 1987-11-27
US4801916A (en) 1989-01-31
DK168778B1 (da) 1994-06-06
FI875254A (fi) 1988-05-29
EP0268935A1 (de) 1988-06-01
FI875254A0 (fi) 1987-11-27
ATE70661T1 (de) 1992-01-15
GR3003994T3 (ko) 1993-03-16
DK625387A (da) 1988-05-29
BR8706423A (pt) 1988-07-12

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