KR880006967A - 싱글 인라인형 수직플러그 삽입회로 모듈 - Google Patents
싱글 인라인형 수직플러그 삽입회로 모듈 Download PDFInfo
- Publication number
- KR880006967A KR880006967A KR870013393A KR870013393A KR880006967A KR 880006967 A KR880006967 A KR 880006967A KR 870013393 A KR870013393 A KR 870013393A KR 870013393 A KR870013393 A KR 870013393A KR 880006967 A KR880006967 A KR 880006967A
- Authority
- KR
- South Korea
- Prior art keywords
- region
- resistance
- carrier
- resistive
- circuit module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09281—Layout details of a single conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Prostheses (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- External Artificial Organs (AREA)
- Glass Compositions (AREA)
- Mechanical Operated Clutches (AREA)
- Multi-Conductor Connections (AREA)
- Fuses (AREA)
- Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
- Electronic Switches (AREA)
- Channel Selection Circuits, Automatic Tuning Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Resistors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따라 구성된 회로모듈의 실시예의 단면도.
제3도는 본 발명에 따른 실시예의 저항통로 및/또는 저항표면의 크기의 예를 나타내는 다이어그램.
제4도는 본 발명에 따른 또다른 실시예의 저항통로 및/또는 저항표면의 크기의 예를 나타내는 다이어그램.
Claims (3)
- 세라믹과 같은 것으로 이루어진 캐리어가 외부의 전기적 터미널로 사용되도록 캐리어 가장자리를 따라 싱글 인라인형으로 캐리어 평면에 배열되는 일련의 금속핀과 ; 저항통로 및 또는 저항표면의 제1의 영역이 각 경우에 저항통로 및 또는 저항표면의 제2의 영역에 비해 캐리어 가장자리에 있는 금속핀에 더 가깝게 배열되는, 후막 및/또는 박막기술로 형성되는 하나 이상의 저항통로 및/또는 저항표면 : 그리고 동일한 캐리어 상에 배열되는 서로 다른 저항통로 및/또는 저항표면 사이와 금속핀(M)을 위한 프린트된 접촉표면과 저항 통로 및/또는 저항표면의 프린트된 터미널 사이의 프린트된 라인, 그리고 스위칭시스템의 가입자선의 공급 저항을 위해 부가적으로 제공되는 안전퓨우즈 및 캐패시터와 같은 전기소자에서의 적당한 라인과같은 저항통로 및/또는 저항표면의 터미널(LA)에서의 라인을 지지하는 싱글 인라인형 수직플러그 삽입회로 모듈에 있어서, 금속핀에 가깝게 위치되는 제1의 영역은 동작중 매 단위표면구역(㎠)당 제2의 영역 보다 더 높은 열확산이 이루어지는 식으로 구성되고, 저항통로 및/또는 저항표면에 속하는 라인의 터미널은 동작중 전류가 제1의 영역으로부터 제2 영역으로 또는 그와 반대로 흐르는 식으로 배열되는 것을 특징으로 하는 싱글 인라인형 수직플러그 삽입회로모듈.
- 제1항에 있어서, 제1의 영역의 필름폭 그리고 따라서 그것의 컨덕턴스 값은 제2의 영역의 필름폭 그리고 따라서 그것의 컨덕턴스값 보다더 적은 것을 특징으로 하는 싱글 인라인형 수직플러그 삽입회로모듈.
- 제1항 또는 제2항에 있어서, 제1의 영역의 필름두께 그리고 따라서 그것의 컨덕턴스 값은 제2의 영역에 필름두께 그리고 따라서 그것의 컨덕턴스값 보다더 적은 것을 특징으로 하는 싱글 인라인형 수직플러그 삽입회로모듈.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3640694.5 | 1986-11-28 | ||
DE3640694 | 1986-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR880006967A true KR880006967A (ko) | 1988-07-25 |
Family
ID=6315002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR870013393A KR880006967A (ko) | 1986-11-28 | 1987-11-27 | 싱글 인라인형 수직플러그 삽입회로 모듈 |
Country Status (10)
Country | Link |
---|---|
US (1) | US4801916A (ko) |
EP (1) | EP0268935B1 (ko) |
JP (1) | JPS63142842A (ko) |
KR (1) | KR880006967A (ko) |
AT (1) | ATE70661T1 (ko) |
BR (1) | BR8706423A (ko) |
DE (1) | DE3775349D1 (ko) |
DK (1) | DK168778B1 (ko) |
FI (1) | FI875254A (ko) |
GR (1) | GR3003994T3 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69024313T2 (de) * | 1989-10-20 | 1996-06-13 | Matsushita Electric Ind Co Ltd | Oberflächenmontierbare Netzwerkvorrichtung |
JPH03291869A (ja) * | 1990-04-09 | 1991-12-24 | Hitachi Ltd | 電子装置 |
US5039851A (en) * | 1990-05-23 | 1991-08-13 | Galileo Electro-Optics Corporation | Plug in detector module |
KR101799028B1 (ko) | 2016-09-02 | 2017-11-17 | 순천향대학교 산학협력단 | 인공치아용 월러스토나이트계 결정화 유리 및 이의 착색 방법 |
DE102018101792B4 (de) * | 2018-01-26 | 2021-03-25 | Harting Electric Gmbh & Co. Kg | Leiterkartenverbinder und dazugehörige Leiterkartenanordnung zur Übertragung hoher Stromstärken |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2691716A (en) * | 1950-12-01 | 1954-10-12 | William H Wellens | Vaporizer |
US2978664A (en) * | 1958-11-05 | 1961-04-04 | Texas Instruments Inc | Resistive element |
DE1245458B (de) * | 1966-04-27 | 1967-07-27 | Telefunken Patent | Integrierte Schaltung, deren Traegerplaettchen gut waermeleitfaehig ist |
US4118112A (en) * | 1976-12-03 | 1978-10-03 | Xerox Corporation | Method for reducing power dissipation in tapered resistor devices |
DE2655841C3 (de) * | 1976-12-09 | 1981-11-19 | Siemens AG, 1000 Berlin und 8000 München | Integrierter Widerstandsbaustein zum Einlöten in eine Flachbaugruppe |
DE3031912A1 (de) * | 1980-08-23 | 1982-04-01 | Brown, Boveri & Cie Ag, 6800 Mannheim | Anordnung zur potentialunabhaengigen waermeabfuehrung |
LU83439A1 (de) * | 1980-09-25 | 1981-10-29 | Siemens Ag | Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul |
JPS5844561U (ja) * | 1981-09-18 | 1983-03-25 | 篠塚 正男 | 直結式自動変速装置 |
DE3605692A1 (de) * | 1986-02-21 | 1986-11-06 | Siemens AG, 1000 Berlin und 8000 München | Temperaturaenderungen ausgesetzte anordnung |
-
1987
- 1987-11-11 EP EP87116665A patent/EP0268935B1/de not_active Expired - Lifetime
- 1987-11-11 AT AT87116665T patent/ATE70661T1/de not_active IP Right Cessation
- 1987-11-11 DE DE8787116665T patent/DE3775349D1/de not_active Expired - Fee Related
- 1987-11-16 US US07/121,007 patent/US4801916A/en not_active Expired - Fee Related
- 1987-11-27 KR KR870013393A patent/KR880006967A/ko not_active Application Discontinuation
- 1987-11-27 FI FI875254A patent/FI875254A/fi not_active IP Right Cessation
- 1987-11-27 BR BR8706423A patent/BR8706423A/pt not_active IP Right Cessation
- 1987-11-27 DK DK625387A patent/DK168778B1/da active
- 1987-11-27 JP JP62297904A patent/JPS63142842A/ja active Pending
-
1992
- 1992-03-11 GR GR910401859T patent/GR3003994T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
DE3775349D1 (de) | 1992-01-30 |
JPS63142842A (ja) | 1988-06-15 |
EP0268935B1 (de) | 1991-12-18 |
DK625387D0 (da) | 1987-11-27 |
US4801916A (en) | 1989-01-31 |
DK168778B1 (da) | 1994-06-06 |
FI875254A (fi) | 1988-05-29 |
EP0268935A1 (de) | 1988-06-01 |
FI875254A0 (fi) | 1987-11-27 |
ATE70661T1 (de) | 1992-01-15 |
GR3003994T3 (ko) | 1993-03-16 |
DK625387A (da) | 1988-05-29 |
BR8706423A (pt) | 1988-07-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4502098A (en) | Circuit assembly | |
US4093971A (en) | D-I-P On island | |
US3686533A (en) | Heat sink mounting arrangement for integrated circuits | |
US3384879A (en) | Diode-matrix device for data storing and translating purposes | |
US4167031A (en) | Heat dissipating assembly for semiconductor devices | |
KR950028581A (ko) | 전도 부재에 전기적으로 결합되는 이중 기층 패키지 어셈블리 | |
KR900702614A (ko) | Ptc회로 보호 소자의 어셈블리 | |
DE69133468D1 (de) | Halbleiterchipanordnungen, Herstellungsmethoden und Komponenten für dieselbe | |
KR930005177A (ko) | 3차원 멀티칩 모듈형 집적회로 | |
KR930014929A (ko) | 반도체 장치 및 그의 제조 방법 | |
KR900013826A (ko) | 발광 제어시스템용 플럭인 디머모두율 | |
US4209798A (en) | Module for integrated circuits | |
KR980006184A (ko) | 반도체 집적회로장치 | |
FR2674404B1 (fr) | Dispositif a carte a circuit integre. | |
US5159530A (en) | Electronic circuit module with power feed spring assembly | |
KR910010163A (ko) | 저항 온도 센서 | |
KR880006967A (ko) | 싱글 인라인형 수직플러그 삽입회로 모듈 | |
CA1146283A (en) | Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits | |
US5945905A (en) | High power resistor | |
GB2095039A (en) | Circuit assembly | |
KR940001485A (ko) | 표면 장착용 전기 커넥터의 단자 | |
KR880001054A (ko) | 저항성 회로망 | |
KR970024073A (ko) | 전자부품용 냉각장치(cooling apparatus for electronic parts) | |
KR100271574B1 (ko) | 정특성서미스터및정특성서미스터장치 | |
ATE38452T1 (de) | Ueberbrueckungselement. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |