KR880006763A - X선 전사장치 - Google Patents
X선 전사장치 Download PDFInfo
- Publication number
- KR880006763A KR880006763A KR870012222A KR870012222A KR880006763A KR 880006763 A KR880006763 A KR 880006763A KR 870012222 A KR870012222 A KR 870012222A KR 870012222 A KR870012222 A KR 870012222A KR 880006763 A KR880006763 A KR 880006763A
- Authority
- KR
- South Korea
- Prior art keywords
- ray
- chamber
- gas
- blower
- mask
- Prior art date
Links
- 238000001514 detection method Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
- 238000004846 x-ray emission Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 관한 X선 전사 장치의 1실시예를 도시하는 정면 일부 단면도.
제2도는 제1도에 도시하는 검출 광학계 및 촬영 장치의 부분을 확대해서 도시한 도면.
Claims (4)
- 연성 X선을 사용해서 마스크에 헝성된 패턴을 웨이퍼에 전사하는 X선 전사 장치에 있어서, 연성 X선 발생 장치, 상기 X선 방출 창에 접속되고, 내부에 X선의 투과율이 높은 기체를 채운 대기 챔버와 상기 대기 챔버에 부착되는 마스크, 상기 마스크에 대향시켜 미소한 간극을 두어 웨이퍼를 장치하는 스테이지, 상기 대기 챔버내에 마련되고 또한 마스크 및 웨이퍼의 얼라인먼트의 상을 결합시키는 검출 광학계 및 상기 검출 광학계에서 상을 결합시킨 얼라인먼트의 상을 촬영하여 영상 신호로 변환하는 촬영 장치, 상기 촬영 장치에서 발생하는 열에 의해 상기 챔버내의 기체의 온도 상승을 방지하여 상기 검출 광학계의 드리프트를 없애게 하고 상기 촬영 장치가 설치된 부근의 기체를 배출시키는 배출구, 상기 배출구에서 배출된 기체를 냉각해서 보내는 열교환기와 송풍기, 상기 열교환기와 송풍기로부터의 기체를 대기 챔버내로 되돌려서 순환시키는 취출구를 구비하여 설치한 것을 특징으로 하는 X선 전사 장치.
- 특허청구의 범위 제1항에 있어서, 상기 송풍기에서 발생하는 진동을 대기 챔버에 전파하지 않도록 용수철성을 갖는 부재로 송풍기와 내기 챔버를 접속하는 것을 특징으로 하는 X선 전사 장치.
- 특허청구의 범위 제1항에 있어서, 상기 열교환기와 송풍기를 상기 대기 쳄버의 바깥쪽에 배치하고, 이들과 배출구 및 취출구를 덕트로 접속한 것을 특징으로 하는 X선 전사 장치.
- 특허청구의 범위 제1항에 있어서, 상기 검출 광학계 및 촬영 장치는 X,Y 테이블 상에 설치한 것을 특징으로 하는 X선 전사 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61263725A JPS63119233A (ja) | 1986-11-07 | 1986-11-07 | X線転写装置 |
JP263725 | 1986-11-07 | ||
JP61-263725 | 1986-11-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880006763A true KR880006763A (ko) | 1988-07-25 |
KR900007900B1 KR900007900B1 (ko) | 1990-10-22 |
Family
ID=17393438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870012222A KR900007900B1 (ko) | 1986-11-07 | 1987-11-02 | X선 전사 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4852133A (ko) |
JP (1) | JPS63119233A (ko) |
KR (1) | KR900007900B1 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0323264B1 (en) * | 1987-12-29 | 1997-05-14 | Canon Kabushiki Kaisha | X-ray exposure process using an electrically conductive x-ray mask |
JPH0276212A (ja) * | 1988-09-13 | 1990-03-15 | Canon Inc | 多重露光方法 |
DE68922061T2 (de) * | 1988-10-03 | 1995-08-31 | Canon Kk | Vorrichtung zum Regeln der Temperatur. |
JP2731950B2 (ja) * | 1989-07-13 | 1998-03-25 | キヤノン株式会社 | 露光方法 |
US5138643A (en) * | 1989-10-02 | 1992-08-11 | Canon Kabushiki Kaisha | Exposure apparatus |
US5142120A (en) * | 1990-12-21 | 1992-08-25 | Hewlett-Packard Company | Contact cooling of a projection mask |
CA2077572C (en) * | 1991-09-07 | 1998-08-18 | Masahito Niibe | Method of and apparatus for stabilizing shapes of objects, such as optical elements, as well as exposure apparatus using same and method of manufacturing semiconductr devices |
US5491331A (en) * | 1994-04-25 | 1996-02-13 | Pilot Industries, Inc. | Soft x-ray imaging device |
US5627872A (en) * | 1995-02-03 | 1997-05-06 | Northrop Grumman Corporation | Stationary exit window for X-ray lithography beamline |
JPH09218519A (ja) * | 1996-02-09 | 1997-08-19 | Nikon Corp | 露光装置の環境制御方法及び装置 |
AU8749798A (en) * | 1997-08-29 | 1999-03-22 | Nikon Corporation | Temperature adjusting method and aligner to which this method is applied |
EP1105203B1 (en) | 1998-08-20 | 2004-01-28 | Extraction Systems, Inc. | Filters employing porous strongly acidic polymers |
JP2001052986A (ja) * | 1999-08-11 | 2001-02-23 | Nikon Corp | X線投影露光装置 |
US7540901B2 (en) * | 2000-05-05 | 2009-06-02 | Entegris, Inc. | Filters employing both acidic polymers and physical-adsorption media |
EP1357998B1 (en) * | 2000-05-05 | 2014-12-03 | Entegris, Inc. | Filters employing both acidic polymers and physical-adsorption media |
JP2006259143A (ja) * | 2005-03-16 | 2006-09-28 | Fuji Xerox Co Ltd | 配置装置及び方法 |
TWI417130B (zh) * | 2006-07-13 | 2013-12-01 | Entegris Inc | 過濾系統 |
JP6189303B2 (ja) | 2011-09-12 | 2017-08-30 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | 基板処理装置 |
US10184179B2 (en) * | 2014-01-21 | 2019-01-22 | Applied Materials, Inc. | Atomic layer deposition processing chamber permitting low-pressure tool replacement |
US10375901B2 (en) | 2014-12-09 | 2019-08-13 | Mtd Products Inc | Blower/vacuum |
TWI746907B (zh) * | 2017-12-05 | 2021-11-21 | 日商斯庫林集團股份有限公司 | 煙霧判定方法、基板處理方法及基板處理裝置 |
WO2020030256A1 (de) * | 2018-08-07 | 2020-02-13 | Ist Metz Gmbh | Belichtungsanlage und verfahren zu deren betrieb |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57169242A (en) * | 1981-04-13 | 1982-10-18 | Hitachi Ltd | X-ray transferring device |
JPS58191433A (ja) * | 1982-05-04 | 1983-11-08 | Fujitsu Ltd | X線転写方法および装置 |
US4708484A (en) * | 1984-10-24 | 1987-11-24 | Hitachi, Ltd. | Projection alignment method and apparatus |
-
1986
- 1986-11-07 JP JP61263725A patent/JPS63119233A/ja active Pending
-
1987
- 1987-11-02 KR KR1019870012222A patent/KR900007900B1/ko not_active IP Right Cessation
- 1987-11-06 US US07/117,499 patent/US4852133A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4852133A (en) | 1989-07-25 |
JPS63119233A (ja) | 1988-05-23 |
KR900007900B1 (ko) | 1990-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |