KR870011688A - 고온 저항층의 제조방법 - Google Patents

고온 저항층의 제조방법 Download PDF

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Publication number
KR870011688A
KR870011688A KR870004318A KR870004318A KR870011688A KR 870011688 A KR870011688 A KR 870011688A KR 870004318 A KR870004318 A KR 870004318A KR 870004318 A KR870004318 A KR 870004318A KR 870011688 A KR870011688 A KR 870011688A
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South Korea
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group
general formula
following general
polyamide
iii
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KR870004318A
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English (en)
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KR960004118B1 (en
Inventor
후퍼 베른트
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베틀라우퍼, 오일러
훽스트 아크티엔게젤샤프트
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Publication of KR870011688A publication Critical patent/KR870011688A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/18—Polybenzimidazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Polyamides (AREA)
  • Organic Insulating Materials (AREA)
  • Glass Compositions (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

내용 없음

Description

고온 저항층의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 적어도 50몰%가 하기일반식(Ⅰ)의 반복단위로 이루어진 폴리아미드-카복실산 용액을 피복시킬 표면에 적용시키고, 용액을 건조시킨 다음, 생성되는 폴리아미드-카복실산층을 180내지 400℃ 범위의 온도로 가열하여 폴리아미드로 전환시킴을 특징으로 하여, 부품상에 굳게 접착되고, 전기적으로 절연된 고온 저항층을 제조하는 방법.
    상기식에서, R1은 단일핵 내지 4핵 방향족 그룹이고, X는 산소, 황, CO,SOx또는 CR2R3(여기서, R2및 R3은 동일하거나 방이하며, 수소 또는 CH3이다.)
  2. 제1항에 있어서, R1이 펜-1,2,4,5-테트라일그룹 또는 하기일반식(Ⅱ)의 그룹인 방법,
    상기식에서, Y는 단일결합, X(여기서, X는 제1항에서 정의한 바와 같다)의 의미를 갖는 그룹 또는 하기일반식(Ⅲ)의 그룹이다.
    (상기식에서, X는 제1항에서 정의한 바와 같다)
  3. 제2항에 있어서, 폴리아미드-카복실산이 하기일반식(Ⅳ)의 단위를 추가로 함유하는 방법.
    상기식에서, Z는 하기일반식(Ⅵ),(Ⅶ) 또는 (Ⅷ)의 그룹, 페닐렌그룹 또는 나프탈렌그룹이다.
    ［상기식에서, R4,R5,R6및 R7은 동일하거나 상이하며, 수소원자 또는 탄소수 1내지 3의 알킬그룹이고;V는 단일결합, X(여기서, X는 정1항에서 정의한 바와 같다)의 의미를 갖는 그룹, 또는 그룹
    및
    중의 하나이다.］
  4. 제1항에 있어서, 폴리이미드의 적어도 50몰%가 하기일반식(V)의 반복단위로 이루어진 방법.
    상기식에서, R1및 X는 제1항에서 정의한 바와 같다.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR87004318A 1986-05-03 1987-05-02 Process for preparing high temperature resistant layers KR960004118B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3515039.8 1986-05-03
DE19863615039 DE3615039A1 (de) 1986-05-03 1986-05-03 Polyamidcarbonsaeuren, daraus hergestellte polyimide und verfahren zur herstellung von hochtemperaturbestaendigen schichten

Publications (2)

Publication Number Publication Date
KR870011688A true KR870011688A (ko) 1987-12-26
KR960004118B1 KR960004118B1 (en) 1996-03-26

Family

ID=6300116

Family Applications (1)

Application Number Title Priority Date Filing Date
KR87004318A KR960004118B1 (en) 1986-05-03 1987-05-02 Process for preparing high temperature resistant layers

Country Status (8)

Country Link
US (1) US4871833A (ko)
EP (1) EP0244715B1 (ko)
JP (1) JP2669420B2 (ko)
KR (1) KR960004118B1 (ko)
AT (1) ATE58744T1 (ko)
DE (2) DE3615039A1 (ko)
HK (1) HK83793A (ko)
SG (1) SG58592G (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2575421B2 (ja) * 1987-11-09 1997-01-22 株式会社フジクラ 耐熱性電線及びケーブル
JPH01229203A (ja) * 1988-03-09 1989-09-12 Mitsui Toatsu Chem Inc ポリイミド樹脂を用いたフィルター
JPH01231005A (ja) * 1988-03-11 1989-09-14 Mitsui Toatsu Chem Inc ポリイミド樹脂フィルター
US5071997A (en) * 1989-07-20 1991-12-10 University Of Akron Polyimides comprising substituted benzidines
US5210174A (en) * 1989-11-22 1993-05-11 Mitsui Toatsu Chemicals, Inc. Preparation process of polyimide
US5252703A (en) * 1990-06-01 1993-10-12 Ube Industries, Ltd. Polyimidosiloxane resin and composition thereof and method of applying same
US5196500A (en) * 1990-12-17 1993-03-23 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
US5310863A (en) * 1993-01-08 1994-05-10 International Business Machines Corporation Polyimide materials with improved physico-chemical properties

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3190856A (en) * 1961-06-27 1965-06-22 Shawinigan Resins Corp Polyamides from benzophenonetetra-carboxylic acids and a primary diamine
GB1216505A (en) * 1967-06-06 1970-12-23 Nat Res Dev Improvements in or relating to aromatic polyimides
GB1457191A (en) * 1974-02-28 1976-12-01 Secr Defence Aromatic fluoro-polyimide adhesive compositions
JPS56159314A (en) * 1980-05-09 1981-12-08 Ube Ind Ltd Preparation of polyimide fiber
GB2101149A (en) * 1981-04-14 1983-01-12 Hitachi Chemical Co Ltd Process for producing polyamide acid silicon type intermediate and polyimide silicon copolymer resin
JPS58152018A (ja) * 1982-03-05 1983-09-09 Hitachi Chem Co Ltd 半導体装置の保護被膜材料用組成物
US4629777A (en) * 1983-05-18 1986-12-16 Ciba-Geigy Corporation Polyimides, a process for their preparation and their use
JPS59113035A (ja) * 1983-12-05 1984-06-29 Nitto Electric Ind Co Ltd 珪素含有材からなる素地表面に密着性良好なポリイミド層を形成する方法
US4535115A (en) * 1984-08-20 1985-08-13 Gulf Oil Corporation Method of preparation of polyimide acids
US4687836A (en) * 1984-10-15 1987-08-18 Mitsui Toatsu Chemicals, Inc. Polyimide adhesives, coats and prepreg

Also Published As

Publication number Publication date
SG58592G (en) 1992-07-24
JPS62295923A (ja) 1987-12-23
JP2669420B2 (ja) 1997-10-27
ATE58744T1 (de) 1990-12-15
DE3766409D1 (de) 1991-01-10
KR960004118B1 (en) 1996-03-26
DE3615039A1 (de) 1987-11-05
EP0244715B1 (de) 1990-11-28
HK83793A (en) 1993-08-20
US4871833A (en) 1989-10-03
EP0244715A1 (de) 1987-11-11

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