KR870003681A - 리드(lead)를 갖는 전기부품 - Google Patents

리드(lead)를 갖는 전기부품 Download PDF

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Publication number
KR870003681A
KR870003681A KR1019860008028A KR860008028A KR870003681A KR 870003681 A KR870003681 A KR 870003681A KR 1019860008028 A KR1019860008028 A KR 1019860008028A KR 860008028 A KR860008028 A KR 860008028A KR 870003681 A KR870003681 A KR 870003681A
Authority
KR
South Korea
Prior art keywords
leads
electrical components
circuit board
electrical
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019860008028A
Other languages
English (en)
Korean (ko)
Inventor
유따까 와따나베
후미유끼 고바야시
마사오 세끼하따
시게오 구로다
아끼오 야스까와
시게지로오 세끼네
Original Assignee
미다 가쓰시게
가부시끼 가이샤 히다찌 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미다 가쓰시게, 가부시끼 가이샤 히다찌 세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR870003681A publication Critical patent/KR870003681A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019860008028A 1985-09-27 1986-09-25 리드(lead)를 갖는 전기부품 Ceased KR870003681A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-212325 1985-09-27
JP60212325A JPS6273650A (ja) 1985-09-27 1985-09-27 電気部品

Publications (1)

Publication Number Publication Date
KR870003681A true KR870003681A (ko) 1987-04-18

Family

ID=16620667

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860008028A Ceased KR870003681A (ko) 1985-09-27 1986-09-25 리드(lead)를 갖는 전기부품

Country Status (5)

Country Link
US (1) US4739125A (https=)
EP (1) EP0216363A3 (https=)
JP (1) JPS6273650A (https=)
KR (1) KR870003681A (https=)
CN (1) CN1004678B (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4764848A (en) * 1986-11-24 1988-08-16 International Business Machines Corporation Surface mounted array strain relief device
GB8706610D0 (en) * 1987-03-19 1987-04-23 Smith Ind Plc Electrical components
JPH03124010A (ja) * 1989-10-08 1991-05-27 Murata Mfg Co Ltd 電子部品の端子
DE4038460C2 (de) * 1990-12-03 1995-02-09 Rheinmetall Gmbh SMD-Bauteilverbindung zu einer Leiterplatte
JP3164391B2 (ja) * 1991-01-14 2001-05-08 テキサス インスツルメンツ インコーポレイテツド 垂直リードオンチップパッケージ
US5239199A (en) * 1991-01-14 1993-08-24 Texas Instruments Incorporated Vertical lead-on-chip package
US5276587A (en) * 1991-04-30 1994-01-04 Sundstrand Corporation Pivotable electrical connection apparatus
DE4119741C1 (https=) * 1991-06-15 1992-11-12 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5705873A (en) * 1993-12-22 1998-01-06 Canon Denshi Kabushiki Kaisha Light-quantity control device
JP2959666B2 (ja) * 1994-11-15 1999-10-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 無線通信装置
US5610436A (en) * 1995-06-07 1997-03-11 Bourns, Inc. Surface mount device with compensation for thermal expansion effects
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5910885A (en) * 1997-12-03 1999-06-08 White Electronic Designs Corporation Electronic stack module
JP2002094332A (ja) * 2000-09-12 2002-03-29 Ge Yokogawa Medical Systems Ltd 増幅装置および磁気共鳴撮影装置
DE20117320U1 (de) * 2001-10-23 2003-02-27 Robert Bosch Gmbh, 70469 Stuttgart Kontaktiergerechte Geometrien für Transistorpins
US20090161333A1 (en) * 2007-12-19 2009-06-25 Kevin Yang Auto-cling leads of electric device
US9491859B2 (en) 2012-05-23 2016-11-08 Massachusetts Institute Of Technology Grid arrays with enhanced fatigue life
CN103633530B (zh) * 2013-12-02 2015-10-28 中国电子科技集团公司第四十一研究所 一种用于同轴转接器与印制板传输线的互连方法
JP6540398B2 (ja) * 2015-09-08 2019-07-10 株式会社オートネットワーク技術研究所 回路構成体
US10211120B2 (en) * 2015-12-23 2019-02-19 Intel Corporation Rework grid array interposer with direct power
EP3449502B1 (en) * 2016-04-26 2021-06-30 Linear Technology LLC Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits
US10497635B2 (en) 2018-03-27 2019-12-03 Linear Technology Holding Llc Stacked circuit package with molded base having laser drilled openings for upper package
US11410977B2 (en) 2018-11-13 2022-08-09 Analog Devices International Unlimited Company Electronic module for high power applications
US11844178B2 (en) 2020-06-02 2023-12-12 Analog Devices International Unlimited Company Electronic component

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49147965U (https=) * 1973-04-19 1974-12-20
JPS55113353A (en) * 1979-02-21 1980-09-01 Fujitsu Ltd Semiconductor device
BE885685A (fr) * 1979-12-19 1981-02-02 Gte Automatic Electric Lab Inc Formation de conducteurs pour le montage de circuits integres emboites, sur des circuits pelliculaires minces-epais
JPS57181144A (en) * 1981-05-01 1982-11-08 Toshiba Corp Semiconductor device
JPS5837156U (ja) * 1981-09-02 1983-03-10 セイコーエプソン株式会社 半導体装置
JPS59195752U (ja) * 1983-06-15 1984-12-26 日本電気株式会社 混成集積回路
JPS60124957A (ja) * 1983-12-09 1985-07-04 Fujitsu Ltd 半導体装置
US4647126A (en) * 1985-06-17 1987-03-03 Sperry Corporation Compliant lead clip

Also Published As

Publication number Publication date
US4739125A (en) 1988-04-19
EP0216363A2 (en) 1987-04-01
EP0216363A3 (en) 1988-10-12
CN86106553A (zh) 1987-04-22
JPH0553066B2 (https=) 1993-08-09
CN1004678B (zh) 1989-06-28
JPS6273650A (ja) 1987-04-04

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