KR940010878A - 프린트 배선판에 있어서의 도통용부품 - Google Patents

프린트 배선판에 있어서의 도통용부품 Download PDF

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Publication number
KR940010878A
KR940010878A KR1019930021897A KR930021897A KR940010878A KR 940010878 A KR940010878 A KR 940010878A KR 1019930021897 A KR1019930021897 A KR 1019930021897A KR 930021897 A KR930021897 A KR 930021897A KR 940010878 A KR940010878 A KR 940010878A
Authority
KR
South Korea
Prior art keywords
printed wiring
wiring board
main body
double
wiring boards
Prior art date
Application number
KR1019930021897A
Other languages
English (en)
Inventor
신 가와까미
Original Assignee
나까야마 노보루
니혼 시엠케이 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나까야마 노보루, 니혼 시엠케이 가부시끼가이샤 filed Critical 나까야마 노보루
Publication of KR940010878A publication Critical patent/KR940010878A/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0305Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0373Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845Stepped hole, via, edge, bump or conductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

본 발명은 양면 또는 다층 프린트 배선판의 소요 배선회로를 용이하고도 확실하게 접속하는 도통용 부품의 제공을 목적으로 한다.
상기한 목적을 달성하기 위해, 본 발명은 양면 또는 다층 프린트 배선판의 소요회로를, 각 프린트 배선판에 천공한 관통구멍을 통하여 전기적으로 접속하는 도통용부재가 절연체로 되는 본체(1)과, 상기 본체(1)에 복수의 가는선을 꼰선(4)으로 형성하는 가는선 다발을 연실한 리드선(2)으로 되는 것을 특징으로 하는 프린트 배선판에 있어서의 도통용부품.

Description

프린트 배선판에 있어서의 도통용부품
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 도통용부품 A의 단면도,
제2도는 본 발명의 도통용부품 B의 단면도,
제3도는 본 발명의 도통용부품 C의 단면도,
제4도는 양면프린트 배선판에 도통용부품 A를 적용한 경우의 설명도,
제5도는 본 발명의 실시예1를 나타내는 양면프린트 배선판에 도통용부품 B를 적용한 경우의 설명도,
제6도는 다층프린트 배선판에 도통용부품 A를 적용한 경우의 설명도,
제7도는 다층프린트 배선판에 도통용부품 B를 적용한 경우의 설명도.

Claims (1)

  1. 양면프린트 배선판 또는 다층프린트 배선판의 소요회로를, 각 프린트 배선판에 천공한 관통구멍(10), (10a), (10b)을 통하여 전기적으로 접속하는 도통용부재가, 절연체가 되는 본체(1)와, 상기 본체에 복수의 가는선으로 형성한 꼰선(4)의 리드선(2)을 연설하여 되는 것을 특징으로 하는 프린트 배선판에 있어서의 도통용부품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930021897A 1992-10-19 1993-10-19 프린트 배선판에 있어서의 도통용부품 KR940010878A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-306068 1992-10-19
JP4306068A JPH06132658A (ja) 1992-10-19 1992-10-19 プリント配線板における導通用部品

Publications (1)

Publication Number Publication Date
KR940010878A true KR940010878A (ko) 1994-05-26

Family

ID=17952663

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930021897A KR940010878A (ko) 1992-10-19 1993-10-19 프린트 배선판에 있어서의 도통용부품

Country Status (3)

Country Link
EP (1) EP0599476A1 (ko)
JP (1) JPH06132658A (ko)
KR (1) KR940010878A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2671554B1 (en) 2012-06-08 2016-04-27 The Procter & Gamble Company Absorbent core for use in absorbent articles
EP2679210B1 (en) 2012-06-28 2015-01-28 The Procter & Gamble Company Absorbent articles with improved core

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187426A (en) * 1962-03-19 1965-06-08 Sperry Rand Corp Method of making printed circuit assemblies
US3214827A (en) * 1962-12-10 1965-11-02 Sperry Rand Corp Electrical circuitry fabrication

Also Published As

Publication number Publication date
JPH06132658A (ja) 1994-05-13
EP0599476A1 (en) 1994-06-01

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