KR940010878A - 프린트 배선판에 있어서의 도통용부품 - Google Patents
프린트 배선판에 있어서의 도통용부품 Download PDFInfo
- Publication number
- KR940010878A KR940010878A KR1019930021897A KR930021897A KR940010878A KR 940010878 A KR940010878 A KR 940010878A KR 1019930021897 A KR1019930021897 A KR 1019930021897A KR 930021897 A KR930021897 A KR 930021897A KR 940010878 A KR940010878 A KR 940010878A
- Authority
- KR
- South Korea
- Prior art keywords
- printed wiring
- wiring board
- main body
- double
- wiring boards
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
본 발명은 양면 또는 다층 프린트 배선판의 소요 배선회로를 용이하고도 확실하게 접속하는 도통용 부품의 제공을 목적으로 한다.
상기한 목적을 달성하기 위해, 본 발명은 양면 또는 다층 프린트 배선판의 소요회로를, 각 프린트 배선판에 천공한 관통구멍을 통하여 전기적으로 접속하는 도통용부재가 절연체로 되는 본체(1)과, 상기 본체(1)에 복수의 가는선을 꼰선(4)으로 형성하는 가는선 다발을 연실한 리드선(2)으로 되는 것을 특징으로 하는 프린트 배선판에 있어서의 도통용부품.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 도통용부품 A의 단면도,
제2도는 본 발명의 도통용부품 B의 단면도,
제3도는 본 발명의 도통용부품 C의 단면도,
제4도는 양면프린트 배선판에 도통용부품 A를 적용한 경우의 설명도,
제5도는 본 발명의 실시예1를 나타내는 양면프린트 배선판에 도통용부품 B를 적용한 경우의 설명도,
제6도는 다층프린트 배선판에 도통용부품 A를 적용한 경우의 설명도,
제7도는 다층프린트 배선판에 도통용부품 B를 적용한 경우의 설명도.
Claims (1)
- 양면프린트 배선판 또는 다층프린트 배선판의 소요회로를, 각 프린트 배선판에 천공한 관통구멍(10), (10a), (10b)을 통하여 전기적으로 접속하는 도통용부재가, 절연체가 되는 본체(1)와, 상기 본체에 복수의 가는선으로 형성한 꼰선(4)의 리드선(2)을 연설하여 되는 것을 특징으로 하는 프린트 배선판에 있어서의 도통용부품.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP92-306068 | 1992-10-19 | ||
JP4306068A JPH06132658A (ja) | 1992-10-19 | 1992-10-19 | プリント配線板における導通用部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR940010878A true KR940010878A (ko) | 1994-05-26 |
Family
ID=17952663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930021897A KR940010878A (ko) | 1992-10-19 | 1993-10-19 | 프린트 배선판에 있어서의 도통용부품 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0599476A1 (ko) |
JP (1) | JPH06132658A (ko) |
KR (1) | KR940010878A (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2671554B1 (en) | 2012-06-08 | 2016-04-27 | The Procter & Gamble Company | Absorbent core for use in absorbent articles |
EP2679210B1 (en) | 2012-06-28 | 2015-01-28 | The Procter & Gamble Company | Absorbent articles with improved core |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3187426A (en) * | 1962-03-19 | 1965-06-08 | Sperry Rand Corp | Method of making printed circuit assemblies |
US3214827A (en) * | 1962-12-10 | 1965-11-02 | Sperry Rand Corp | Electrical circuitry fabrication |
-
1992
- 1992-10-19 JP JP4306068A patent/JPH06132658A/ja active Pending
-
1993
- 1993-10-19 KR KR1019930021897A patent/KR940010878A/ko not_active Application Discontinuation
- 1993-10-19 EP EP93308326A patent/EP0599476A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPH06132658A (ja) | 1994-05-13 |
EP0599476A1 (en) | 1994-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |