CN86106553A - 具有引线端的电气元件 - Google Patents

具有引线端的电气元件 Download PDF

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CN86106553A
CN86106553A CN86106553.0A CN86106553A CN86106553A CN 86106553 A CN86106553 A CN 86106553A CN 86106553 A CN86106553 A CN 86106553A CN 86106553 A CN86106553 A CN 86106553A
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lead end
electric component
circuit board
pcb
printed circuit
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渡道裕
小林二三幸
关端正雄
黑田重雄
保川彰夫
关根茂次郎
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Hitachi Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
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Abstract

一种电气元件其引线端在厚度方向上于中间部分至少有两处予以弯曲，从而形成实际与电路基片底部相平行的节梯部分，通过改变该引线端的形状可将施加在该元件上的外力予以吸收。如需要可通过在元件上向里改变引线端的伸出位置以减小外凸尺寸，从而可避免由于水平节梯部分的形成而增加元件的布局面积。

Description

本发明涉及的电气元件可通过其引线端安装并连接在印刷电路板的表面，特别是这样一种电气元件，其引线端具有可增强连接可靠性的某种特有形状。
在印刷电路板上对诸如集成电路（IC）芯片，LSI芯片，多芯片混合模件及电阻阵列的电气元件的高密度组装的目前趋向，是将这些元件构成“平板型”，以使其引线端与印刷电路板的表面扁平相接，并将这些引线端焊接在印刷电路的焊区上。
这些表面安装器件具有的典型引线形状，如日本专利（未审查公开号为55-113353）中所述且示于图1中。此图中，标号1代表的基片通过组配可容纳电路元件的芯片基座（未示出）而具有电路功能;每个引线端5均包括接至基片1的部分2，与印刷电路板（未示出）相连接的部分3，以及连接此两部分之间的实际呈笔直的部分4。但是在将具有上述引线端的大量元件焊接于印刷电路板上以实现较多功能的组件时，就会在上述引线端与印刷电路板之间的焊接可靠性方面产生严重问题。其原因是多功能组件一般是通过将连接件插入到背面板的槽缝中，而组装过程的插入力会引起印刷电路板的弯曲，从而产生施加在焊接连接处上的明显外加力。在多功能组件的测试中，经常是进行在线测试“in-Circuit    test”，其中仅有印刷电路板的一小部分被探查，而这种检测过程也会引起印刷电路板的弯曲。在印刷电路板已弯曲的情况下，如图2所示从以实线所示的原状6弯到由虚线所示的形状16，则位于该排引线中部的引线15要承受压应力，同时位于两侧部分的引线25要承受拉压应力。在此种应力中，常规的引线形状已不再能够经受其应力，从而导致经常性的焊接连接处的断裂，因此要经常性地检测印刷电路板和位于此排引线两侧部分的连接。
本发明的目的即是提供一种电气元件，它在印刷电路板上所具有的连接结构即使当该板弯曲也能够保持其连接的可靠性，并适于高密度的组装。
在连接部分之间具有呈笔直状引线端的常规电气元件中，如以焊接来安装各元件的印刷电路板已经变形，而各引线端不能经受这种变形，便会导致焊接处的断裂。本发明即是要解决这一问题，具有创造性的这种电气元件的特点是，它所具有的引线端均在连接端部之间的厚度方向上至少在两处予以弯曲，从而形成了一节梯部分，实际上它与电路基片的底部相平行，这样通过此节梯部分的结构就可经受印刷电路板的变形。
这种节梯部分的形成会增加引线端的平面尺寸，但如果需要在印刷电路板上占据较小部分布局面积，则可将此端引线的伸出位置转向元件底部的内侧，这样便可减小引线端的凸出部分。
图1是常规电气元件的一组侧视图;
图2的侧视图表明安装在印刷电路板上的常规电气元件;
图3是利用本发明电气元件的透视图;
图4，5（A）和（B）是实施本发明电气元件的引线端侧视图;
及
图6的曲线表明根据本发明对应印刷电路板的变形，端部连接的抗弯性和抗压性。
现将本发明的一种实施方案结合附图予以说明。图3示出了具有弯曲引线端55的这种创造性的电气元件。在此实施例中，引线端55设置在陶瓷多层电路板11上，这种电路板是用氧化铝陶瓷未烧结板制成的，并经过在未烧结板上形成通孔;在此通孔的内侧及板的表面印制上钨涂料;将几层这种板叠压在一起;对这种叠压板进行烧结及将这种板进行电镀的处理。这种陶瓷板11在其下表面有用于设置引线端55的焊接区，而在其上表面则有和板内部的芯片基座、信号及电源线有连接的焊接区。在这种陶瓷多层电路板11的上侧，容纳各电路元件的芯片基座7用焊料17予以连接，而每一芯片基座在其上均配有一单独的散热器8。这种陶瓷多层电路板和所安装的元件构成了一个组件。利用银焊料连接于此陶瓷多层电路板11后侧上的是宽度为0.25毫米用42合金的96个引线端55，而且是分为2排，每排以0.762毫米的间隔形成48个引线。
图4所示为当这种电气元件安装在印刷电路板上时引线端的详细情况。引线端55利用银焊料31连接于配置在陶瓷多层电路板11后侧的引线连接焊区21处。这种引线端包括与陶瓷多层电路板11相接的部分12;与印刷电路板26相接的部分13，及在上述两个连接部分之间的中间部分14（14a，14b，14c）。中间部分14在厚度方向上于两处予以弯曲，以使它相对于陶瓷多层电路板11具有实际的垂直部分14a和14c，并中接了实际水平的节梯部分14b。在此实施例中，水平节梯部分14b位于陶瓷多层电路板11的下面，以使这种电气元件不会增加布局面积。连接部分13用焊料126连接于印刷电路板26。
如此印刷电路板26要弯曲则这种创造性的电气元件所具有的引线端可改变其形状，从而确保了使用焊料126而在连接部分13的连接可靠性。也即如图2所示，如印刷电路板从由实线所示的原状6弯曲到由虚线所示的形状16，位于该排中间部分的这种创造性的电气元件的引线端15将如图5（A）所示改变其形状，而位于该排两侧部分的引线端25将如图5（B）所示改变其形状。基于这一理由，将部分13与印刷电路板26相接的焊料126就不会处于可引起断裂的应力之下。
图6的曲线，由（I）表示了引线端水平节梯部分14b的长度和印刷电路板弯曲量（此处的连接焊料126会断裂）之间关系的测量结果。此测量结果显示了没有水平节梯部分14b（也即L＝0）的常规引线端，只要在35.814毫米（0.762毫米×47引线间距）的总长上有0.05毫米的弯曲发生就会使其连结焊料断裂，而备有0.5毫米的水平节梯部分（也即L＝0.5毫米）就可使焊料经受直至0.1毫米的弯曲，0.8毫米的水平节梯部分（也即L＝0.8毫米）可经受直至0.2毫米的弯曲。在组装插入或检测期间，印刷电路板在35毫米的总长上一般要有0.1毫米的弯曲，因此具有0.15毫米厚度的本实施例的引线端需要有至少L＝0.5毫米的水平节梯部分。这种引线端的厚度是与水平节梯部分的长度L成比例关系的，以提供一定的抗弯性，所以实际上水平节梯部分14b需要的长度应为其厚度的三倍或更大。
另外，当外力施加于该电气元件上且其大小超过弹性限度时，水平节梯部分14b的过量长度会导致引线端的颤动。图6以（Ⅱ）示出的测量结果为引线端水平节梯部分14b的长度和可导致引线端颤动的外力之间的关系。对组合安装这种电气元件而言，在制造和随后的处理工序中对每一元部件要用到5公斤的外力是不可避免的。因此从特征（Ⅱ）的鉴别情况看，水平长度L起码为1.4毫米。此长度约为引线端厚度（0.15毫米）的九倍。
虽然前述的实施例是将本发明用于其引线是安置在陶瓷多层电路板（在其上面装有芯片基座）的后侧，然而这种创造性电气元件还可呈这样一种结构，其中LSI芯片可模合（die-bonded）在陶瓷基片上。换言之，这种创造性电气元件可以是无芯片基座或类似承载件于本体上表面的电路构件。
虽然上述实施例中，是将引线端弯成一节梯形状，它也可以在连接部分12和中间部分14a之间以与图4情况相反方向弯曲，从而作为本实施例的一种改进型而使引线端与基片11的连接是将部分12的端部直接向外。
如上所述根据本发明，可在印刷电路板弯曲时，避免引线端和该电路板之间连接焊料的断裂，从而实现了电气元件的高可靠性连接。这种创造性的引线端结构具有适配在电路基片下面的弹性水平节梯部分，从而使这种电气元件具有适于高密度组装的缩小了的布局面积。

Claims (7)

1、安装在印刷电路板上的电气元件，其特征为实际扁平的电路基片和若干弯曲的引线端，其每一引线端的一侧固定在所述电路基片的下表面，而另一侧则与所述印刷电路板上的端部区扁平相接，每一所述引线端在厚度方向上于中间部分至少有两处予以弯曲，以使引线端成形为具有实际与所述电路基片下表面相平行的节梯部分。
2、根据权利要求1的电气元件其特征为，每一所述引线端的所述节梯部分具有三至九倍于所述引线厚度的长度。
3、根据权利要求1的电气元件其特征为，所述引线端的所述节梯部分的主要部分是位于所述电路基片下面的空间中。
4、安装在印刷电路板上的电气元件其特征为，一个组件带有与其相组合的电路和若干与所述组件相连接的引线端，从而使所述组件中的所述电路和所述印刷电路板之间实现电连接，每一所述引线端在厚度方向上于中间部分至少有两处予以弯曲，从而使所述引线端具有实际与所述组件下表面相平行的节梯部分。
5、根据权利要求4的电气元件其特征为，每一所述引线端的一侧予以弯曲，以使其与所述印刷电路板扁平相接从而实现电连接的目的。
6、根据权利要求4的电气元件其特征为，每一所述引线端焊接于所述组件的某一表面上。
7、根据权利要求6的电气元件其特征为，所述组件为多边形，所述多边形组件的若干边和与其相邻的若干排所述引线端相配。
CN86106553.0A 1985-09-27 1986-09-25 具有引线端的电气元件 Expired CN1004678B (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
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CN103633530A (zh) * 2013-12-02 2014-03-12 中国电子科技集团公司第四十一研究所 一种用于同轴转接器与印制板传输线的互连方法
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CN1004678B (zh) 1989-06-28
KR870003681A (ko) 1987-04-18
JPH0553066B2 (zh) 1993-08-09
JPS6273650A (ja) 1987-04-04
EP0216363A3 (en) 1988-10-12
EP0216363A2 (en) 1987-04-01
US4739125A (en) 1988-04-19

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