DE4119741C1 - - Google Patents

Info

Publication number
DE4119741C1
DE4119741C1 DE4119741A DE4119741A DE4119741C1 DE 4119741 C1 DE4119741 C1 DE 4119741C1 DE 4119741 A DE4119741 A DE 4119741A DE 4119741 A DE4119741 A DE 4119741A DE 4119741 C1 DE4119741 C1 DE 4119741C1
Authority
DE
Germany
Prior art keywords
connecting elements
llccc
circuit board
producing
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE4119741A
Other languages
German (de)
English (en)
Inventor
Helmut 8150 Holzkirchen De Roesel
Martin 8011 Egmating De Eck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Defence and Space GmbH
Original Assignee
Messerschmitt Bolkow Blohm AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6433997&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE4119741(C1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Messerschmitt Bolkow Blohm AG filed Critical Messerschmitt Bolkow Blohm AG
Priority to DE4119741A priority Critical patent/DE4119741C1/de
Priority to EP92107918A priority patent/EP0519200B1/de
Priority to DE59200897T priority patent/DE59200897D1/de
Priority to ES92107918T priority patent/ES2067978T3/es
Priority to JP4153890A priority patent/JP2515948B2/ja
Priority to US07/897,933 priority patent/US5198391A/en
Application granted granted Critical
Publication of DE4119741C1 publication Critical patent/DE4119741C1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connection Or Junction Boxes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE4119741A 1991-06-15 1991-06-15 Expired - Lifetime DE4119741C1 (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE4119741A DE4119741C1 (zh) 1991-06-15 1991-06-15
EP92107918A EP0519200B1 (de) 1991-06-15 1992-05-12 Verbindung von LLCCC-Bauelementen für die Raumfahrtelektronik
DE59200897T DE59200897D1 (de) 1991-06-15 1992-05-12 Verbindung von LLCCC-Bauelementen für die Raumfahrtelektronik.
ES92107918T ES2067978T3 (es) 1991-06-15 1992-05-12 Conexion de elementos constructivos llccc para la electronica aplicada a la astronautica.
JP4153890A JP2515948B2 (ja) 1991-06-15 1992-06-12 宇宙飛行電子技術用のｌｌｃｃｃ素子の電気接続方法
US07/897,933 US5198391A (en) 1991-06-15 1992-06-15 Method for bonding llccc-components using a leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4119741A DE4119741C1 (zh) 1991-06-15 1991-06-15

Publications (1)

Publication Number Publication Date
DE4119741C1 true DE4119741C1 (zh) 1992-11-12

Family

ID=6433997

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4119741A Expired - Lifetime DE4119741C1 (zh) 1991-06-15 1991-06-15
DE59200897T Expired - Fee Related DE59200897D1 (de) 1991-06-15 1992-05-12 Verbindung von LLCCC-Bauelementen für die Raumfahrtelektronik.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59200897T Expired - Fee Related DE59200897D1 (de) 1991-06-15 1992-05-12 Verbindung von LLCCC-Bauelementen für die Raumfahrtelektronik.

Country Status (5)

Country Link
US (1) US5198391A (zh)
EP (1) EP0519200B1 (zh)
JP (1) JP2515948B2 (zh)
DE (2) DE4119741C1 (zh)
ES (1) ES2067978T3 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19543765A1 (de) * 1995-11-24 1997-05-28 Loewe Opta Gmbh Elektrisches Bauteil mit axial herausgeführten Anschlußstiften
DE102004045948A1 (de) * 2004-09-22 2006-04-06 Epcos Ag Oberflächenmontierbares Bauelement
DE19830820B4 (de) * 1997-07-23 2006-09-07 Murata Mfg. Co., Ltd., Nagaokakyo Oberflächenmontierbares elektronisches Keramikbauteil
DE102005014413A1 (de) * 2005-03-24 2006-09-28 Conti Temic Microelectronic Gmbh Anordnung zur Wärmeableitung
US8465214B2 (en) 2009-03-18 2013-06-18 U2T Photonics Ag Arrangement comprising an electrical conductor track carrier and an optoelectronic component, and a method for producing such an arrangement

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2643074B2 (ja) * 1993-03-17 1997-08-20 インターナショナル・ビジネス・マシーンズ・コーポレイション 電気的接続構造
US5336639A (en) * 1993-06-28 1994-08-09 Motorola, Inc. Method for securing a semiconductor chip to a leadframe
US5631192A (en) * 1995-10-02 1997-05-20 Motorola, Inc. Semiconductor device on an opposed leadframe and method for making
DE19637626A1 (de) 1996-09-16 1998-03-26 Bosch Gmbh Robert Flexible Leiterbahnverbindung
US5849613A (en) * 1997-10-23 1998-12-15 Chartered Semiconductor Manufacturing Ltd. Method and mask structure for self-aligning ion implanting to form various device structures
JP2924898B1 (ja) * 1998-06-19 1999-07-26 住友電気工業株式会社 リード用部材
EP0982978B1 (de) * 1998-08-25 2005-05-25 Kiekert Aktiengesellschaft Gehäuse, insbesondere Schlossgehäuse mit elektrischen Anschlusseinrichtungen
US7663529B2 (en) 2006-08-15 2010-02-16 General Dynamics Advanced Information Systems, Inc. Methods for two-dimensional autofocus in high resolution radar systems
US8196291B2 (en) * 2006-11-06 2012-06-12 General Dynamics Advanced Information Systems, Inc. Method for manufacturing leads
DE102007030793A1 (de) * 2007-07-03 2009-01-08 Robert Bosch Gmbh Elektronisches Bauteil mit wenigstens einem Anschlusskontakt
JP2009176947A (ja) * 2008-01-24 2009-08-06 Olympus Corp ３次元モジュール
CN103633530B (zh) * 2013-12-02 2015-10-28 中国电子科技集团公司第四十一研究所 一种用于同轴转接器与印制板传输线的互连方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0216363A2 (en) * 1985-09-27 1987-04-01 Hitachi, Ltd. Electric component part having lead terminals
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2259133C3 (de) * 1972-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer Halbleiteranordnung und Anwendung des Verfahrens
US4189085A (en) * 1978-04-12 1980-02-19 Allen-Bradley Company Method of assembling a microcircuit with face-mounted leads
US4764848A (en) * 1986-11-24 1988-08-16 International Business Machines Corporation Surface mounted array strain relief device
DE3834147A1 (de) * 1988-10-07 1990-04-12 Systec Digital Analog Tech Loetverfahren zur verbindung elektronischer und/oder mechanischer bauteile mit einer leiterplatte, zusatzstoff sowie laserloetvorrichtung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
EP0216363A2 (en) * 1985-09-27 1987-04-01 Hitachi, Ltd. Electric component part having lead terminals

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Amoy, D.J.: "Eine neue LSJ-Gehäuse-Norm", elektronik industrie 11-1977, S. 18-20 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19543765A1 (de) * 1995-11-24 1997-05-28 Loewe Opta Gmbh Elektrisches Bauteil mit axial herausgeführten Anschlußstiften
DE19543765B4 (de) * 1995-11-24 2004-09-30 Loewe Opta Gmbh Verfahren zur Herstellung von Kontaktzungen und deren Verbindung in an der Unterseite eines elektrischen Bauelements vergesehenen Anschlußstiften
DE19830820B4 (de) * 1997-07-23 2006-09-07 Murata Mfg. Co., Ltd., Nagaokakyo Oberflächenmontierbares elektronisches Keramikbauteil
DE102004045948A1 (de) * 2004-09-22 2006-04-06 Epcos Ag Oberflächenmontierbares Bauelement
DE102005014413A1 (de) * 2005-03-24 2006-09-28 Conti Temic Microelectronic Gmbh Anordnung zur Wärmeableitung
US8465214B2 (en) 2009-03-18 2013-06-18 U2T Photonics Ag Arrangement comprising an electrical conductor track carrier and an optoelectronic component, and a method for producing such an arrangement

Also Published As

Publication number Publication date
EP0519200A1 (de) 1992-12-23
DE59200897D1 (de) 1995-01-19
EP0519200B1 (de) 1994-12-07
ES2067978T3 (es) 1995-04-01
JP2515948B2 (ja) 1996-07-10
JPH05183252A (ja) 1993-07-23
US5198391A (en) 1993-03-30

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Legal Events

Date Code Title Description
D1 Grant (no unexamined application published) patent law 81
8327 Change in the person/name/address of the patent owner

Owner name: DEUTSCHE AEROSPACE AG, 8000 MUENCHEN, DE

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DAIMLER-BENZ AEROSPACE AKTIENGESELLSCHAFT, 80804 M

8327 Change in the person/name/address of the patent owner

Owner name: DAIMLERCHRYSLER AEROSPACE AKTIENGESELLSCHAFT, 8099

8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: DAIMLERCHRYSLER AEROSPACE AG, 85521 OTTOBRUNN, DE

8339 Ceased/non-payment of the annual fee