KR850008251A - 내열 구조의 플라스틱 밀봉형 ic 장치 - Google Patents

내열 구조의 플라스틱 밀봉형 ic 장치

Info

Publication number
KR850008251A
KR850008251A KR1019850002223A KR850002223A KR850008251A KR 850008251 A KR850008251 A KR 850008251A KR 1019850002223 A KR1019850002223 A KR 1019850002223A KR 850002223 A KR850002223 A KR 850002223A KR 850008251 A KR850008251 A KR 850008251A
Authority
KR
South Korea
Prior art keywords
heat
resistant plastic
plastic sealed
sealed
resistant
Prior art date
Application number
KR1019850002223A
Other languages
English (en)
Other versions
KR970000215B1 (ko
Inventor
세이고오 남부
히로유끼 후까자와
신지 다께이
Original Assignee
오기뎅기고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오기뎅기고오교 가부시끼가이샤 filed Critical 오기뎅기고오교 가부시끼가이샤
Publication of KR850008251A publication Critical patent/KR850008251A/ko
Application granted granted Critical
Publication of KR970000215B1 publication Critical patent/KR970000215B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1019850002223A 1984-04-02 1985-04-02 내열 구조의 플라스틱 밀봉형 ic 장치 KR970000215B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59-63178 1984-04-02
JP59063178A JPS60208847A (ja) 1984-04-02 1984-04-02 表面実装型ｉｃに内在する水分の排出方法

Publications (2)

Publication Number Publication Date
KR850008251A true KR850008251A (ko) 1985-12-13
KR970000215B1 KR970000215B1 (ko) 1997-01-06

Family

ID=13221729

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850002223A KR970000215B1 (ko) 1984-04-02 1985-04-02 내열 구조의 플라스틱 밀봉형 ic 장치

Country Status (3)

Country Link
US (1) US4866506A (ko)
JP (1) JPS60208847A (ko)
KR (1) KR970000215B1 (ko)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4777520A (en) * 1986-03-27 1988-10-11 Oki Electric Industry Co. Ltd. Heat-resistant plastic semiconductor device
KR960015106B1 (ko) 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
US5208467A (en) * 1988-07-28 1993-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a film-covered packaged component
JP2677632B2 (ja) * 1988-09-30 1997-11-17 株式会社東芝 超薄型表面実装樹脂封止半導体装置
JP3072632B2 (ja) * 1988-10-03 2000-07-31 セイコーエプソン株式会社 圧電発振器
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
US5122858A (en) * 1990-09-10 1992-06-16 Olin Corporation Lead frame having polymer coated surface portions
US5105259A (en) * 1990-09-28 1992-04-14 Motorola, Inc. Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation
US5147821A (en) * 1990-09-28 1992-09-15 Motorola, Inc. Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation
US5172214A (en) * 1991-02-06 1992-12-15 Motorola, Inc. Leadless semiconductor device and method for making the same
JPH07500947A (ja) * 1991-07-08 1995-01-26 モトローラ・インコーポレーテッド チップキャリヤのための湿気除去
US5612576A (en) * 1992-10-13 1997-03-18 Motorola Self-opening vent hole in an overmolded semiconductor device
JPH06209054A (ja) * 1993-01-08 1994-07-26 Mitsubishi Electric Corp 半導体装置
US5474958A (en) * 1993-05-04 1995-12-12 Motorola, Inc. Method for making semiconductor device having no die supporting surface
JPH08130267A (ja) * 1994-11-01 1996-05-21 Mitsubishi Electric Corp 樹脂封止型半導体パッケージ、それを用いた樹脂封止型半導体装置およびその製造方法
JP3414017B2 (ja) * 1994-12-09 2003-06-09 ソニー株式会社 半導体装置
US5721450A (en) * 1995-06-12 1998-02-24 Motorola, Inc. Moisture relief for chip carriers
US5696666A (en) * 1995-10-11 1997-12-09 Motorola, Inc. Low profile exposed die chip carrier package
WO1997035342A1 (en) * 1996-03-22 1997-09-25 The Whitaker Corporation Printed wiring board substrate for chip on board device and process for fabrication thereof
KR19980030032A (ko) * 1996-10-29 1998-07-25 황인길 반도체 패키지
US5773877A (en) 1997-02-07 1998-06-30 Ford Motor Company Plastic encapsulated IC package and method of designing same
US6080932A (en) * 1998-04-14 2000-06-27 Tessera, Inc. Semiconductor package assemblies with moisture vents
US6589820B1 (en) 2000-06-16 2003-07-08 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6483044B1 (en) * 2000-08-23 2002-11-19 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US6979595B1 (en) * 2000-08-24 2005-12-27 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US6838760B1 (en) * 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
US6448637B1 (en) 2001-11-28 2002-09-10 Intersil Americas Inc. Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment
US6773964B2 (en) * 2002-09-30 2004-08-10 Koninklijke Philips Electronics N.V. Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same
DE10350239A1 (de) * 2003-10-27 2005-06-16 Infineon Technologies Ag Halbleiterbauteil mit Gehäusekunststoffmasse, Halbleiterchip und Schaltungsträger sowie Verfahren zur Herstellung desselben
US7833456B2 (en) 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US9029991B2 (en) * 2010-11-16 2015-05-12 Conexant Systems, Inc. Semiconductor packages with reduced solder voiding
ITTO20120854A1 (it) * 2012-09-28 2014-03-29 Stmicroelectronics Malta Ltd Contenitore a montaggio superficiale perfezionato per un dispositivo integrato a semiconduttori, relativo assemblaggio e procedimento di fabbricazione

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US3902148A (en) * 1970-11-27 1975-08-26 Signetics Corp Semiconductor lead structure and assembly and method for fabricating same
US4025716A (en) * 1975-01-30 1977-05-24 Burroughs Corporation Dual in-line package with window frame
JPS5366171U (ko) * 1976-11-06 1978-06-03
US4329701A (en) * 1978-03-20 1982-05-11 The Trane Company Semiconductor package
JPS5577160A (en) * 1978-12-07 1980-06-10 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
KR970000215B1 (ko) 1997-01-06
JPH0239865B2 (ko) 1990-09-07
JPS60208847A (ja) 1985-10-21
US4866506A (en) 1989-09-12

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