KR850004780A - 중합가능한 조성물 - Google Patents
중합가능한 조성물 Download PDFInfo
- Publication number
- KR850004780A KR850004780A KR1019840007721A KR840007721A KR850004780A KR 850004780 A KR850004780 A KR 850004780A KR 1019840007721 A KR1019840007721 A KR 1019840007721A KR 840007721 A KR840007721 A KR 840007721A KR 850004780 A KR850004780 A KR 850004780A
- Authority
- KR
- South Korea
- Prior art keywords
- polymerizable composition
- layer
- aromatic
- polymerizable
- aldehyde
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims 14
- 125000003118 aryl group Chemical group 0.000 claims 8
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 7
- 238000010030 laminating Methods 0.000 claims 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 3
- 239000007795 chemical reaction product Substances 0.000 claims 3
- 239000007787 solid Substances 0.000 claims 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims 2
- 125000004429 atom Chemical group 0.000 claims 2
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- HNPDNOZNULJJDL-UHFFFAOYSA-N ethyl n-ethenylcarbamate Chemical compound CCOC(=O)NC=C HNPDNOZNULJJDL-UHFFFAOYSA-N 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 claims 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 claims 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- ANKOGHFEDCUSKJ-UHFFFAOYSA-N NC(=O)OCC.C(=C)NC(=O)OCC Chemical compound NC(=O)OCC.C(=C)NC(=O)OCC ANKOGHFEDCUSKJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000003158 alcohol group Chemical group 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000012964 benzotriazole Substances 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 125000005442 diisocyanate group Chemical group 0.000 claims 1
- 150000002009 diols Chemical class 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 125000005842 heteroatom Chemical group 0.000 claims 1
- 229920001519 homopolymer Polymers 0.000 claims 1
- -1 hydroxyalkyl ester Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920005596 polymer binder Polymers 0.000 claims 1
- 239000002491 polymer binding agent Substances 0.000 claims 1
- 238000011417 postcuring Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
- C08L33/12—Homopolymers or copolymers of methyl methacrylate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (14)
- (a) 방향족/알데히드 올리고머와 비닐우레탄으로 구성된 그룹으로부터 선택되는 중합가능하고 올레핀처럼 불포화된 1이상의 올리고머, (b) 1이상의 중합결합제 및 (c) 광중합 개시제 시스템으로 구성된 중합가능한 조성물.
- 제1항에 있어서, 1이상의 중합가능한 불포화 방향족/알데히드 올리고머에서의 방향족기는 -ø-Y1-ø-구조(여기서 ø는 페닐렌기이고 Y1는 2개의 페닐렌기 사이의 직접결합이거나, 또는 원자가 탄소 또는 헤테로 원자인 1이상의 사슬내 원자를 포함하며 1이상의 부가원자를 가질 수 있는 2가 잔류임)을 갖는 것을 특징으로 하는 중합가능한 조성물.
- 제2항에 있어서, Y1이 산소인 것을 특징으로 하는 중합가능한 조성물.
- 제1항에 있어서, 1이상의 중합가능한 올레핀처럼 불포화된 방향족/알데히드 올리고머내에서 알데히드는 포름알데히드인 것을 특징으로 하는 중합가능한 조성물.
- 제1항에 있어서, 방향족/알데히드 올리고머는 2 내지 6의 관능기를 갖는 것을 특징으로 하는 중합가능한 조성물.
- 제1항에 있어서, 방향족/알데히드 올리고머는 수평균 분자량 900 내지 1100과 무게 평균분자량 1700 내지 2500을 갖는 것을 특징으로 하는 중합가능한 조성물.
- 제1항에 있어서, 비닐 우레탄 우레탄 예비중합체와 아크릴 또는 메타크릴산의 히드록시알킬 에스테르 반응생성물이고, 상기 우레탄 예비중합체는 구조식 OCN-R2-NCO(여기서 R2는 2가 히드로카르빌라디칼임)을 갖는 디이소시아네이트와 구조식 HO-R3-OH) (여기서 R2는 2개의 페놀 또는 알콜기를 포함하는 유기화합물과 알킬렌 옥사이드의 축합물의 잔류물임)을 갖는 디올의 반응 생성물인 것을 특징으로 하는 중합가능한 조성물.
- 제1항에 있어서, 1이상의 중합 결합제가 메틸 메타크릴레이트의 활중합체 또는 공중합체인 것을 특징으로 하는 중합가능한 조성물.
- 제1항에 있어서, 광중합 개시제 시스템은 디메톡시페닐-아세토페논 및/또는 디에톡시아세토페논을 기초로 하는 것을 특징으로 하는 중합가능한 조성물.
- 제1항에 있어서, 적당히 치환된 벤조트리아졸을 포함하는 것을 특징으로 하는 중합가능한 조성물.
- 제1항에 있어서, (a) 방향족/알데히드 올리고머 40 내지 80w/w%, (b) 비닐우레탄 1 내지 40w/w%, (c) 메틸 메타크릴레이트 단중합체 또는 공중합체 10 내지 30w/w%, (d) 적당히 치환된 벤조트리아졸, (e) 광중합 개시제 시스템 및 (f) 임의적으로 상기한 바와같은 여러 첨가제로 구성되고 성분 (a)-(f)의 혼합중량%가 총 100%인 것을 특징으로 하는 중합가능한 조성물.
- 지지필름과 피복필름사이에 샌드위치된 제1항의 중합가능한 조성물을 포함하는 3층 성분.
- 중합가능한 조성물을 지지필름에 적층하며 그 필름 한쪽면에 점착성없는 고체층을 형성한다음, 피복필름을 점착성없는 고체층에 적층시키는 것으로 구성됨을 특징으로 하는 제12항의 3층 성분을 제조하는 방법.
- (a) 전도성 회로를 갖는 표면에 상기 규정한 중합가능한 조성물 층, 양호하기로는 고체층의 제1면을 적층하고 지지필름에 접착성을 갖는 제2면을 적층한 후; (b) 현상하기 위해 화학선 방사에 노출시켜 층에서 중합체 형상을 형성시키고; (c) 그결과 형성된 형상은 층으로부터 지지필름을 벗겨내고; (d)층의 노출되지않은 부분을 세척함으로써 납땜이 이용되는 1이상의 표면부분을 제외하고 상기 표면에 중합물질층을 막기게하고; 그리고 (e) 중합물질의 층을 후-경화하는 단계로 구성된 전도성 회로를 갖는 표면에 땜납 마스크를 제조하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB838332520A GB8332520D0 (en) | 1983-12-06 | 1983-12-06 | Solder masks |
| GB8332520 | 1983-12-06 | ||
| GB8414438 | 1984-06-06 | ||
| GB848414438A GB8414438D0 (en) | 1984-06-06 | 1984-06-06 | Solder masks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR850004780A true KR850004780A (ko) | 1985-07-27 |
| KR920000034B1 KR920000034B1 (ko) | 1992-01-06 |
Family
ID=26287083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019840007721A KR920000034B1 (ko) | 1983-12-06 | 1984-12-06 | 중합가능한 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0145345B1 (ko) |
| KR (1) | KR920000034B1 (ko) |
| DE (1) | DE3476704D1 (ko) |
| GB (1) | GB8429166D0 (ko) |
| PH (1) | PH20441A (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0288615A (ja) * | 1988-09-27 | 1990-03-28 | Mitsubishi Rayon Co Ltd | 難燃性液状感光性樹脂組成物 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3914194A (en) * | 1973-04-02 | 1975-10-21 | Dow Chemical Co | Unsaturated formaldehyde copolymer resins derived from diaryl oxides, sulfides, dibenzofuran or dibenzothiophene |
| US4297471A (en) * | 1979-04-13 | 1981-10-27 | Hitachi Chemical Company, Ltd. | Odorless or low-odor crosslinkable compound and resin composition containing the same |
| US4252888A (en) * | 1980-02-26 | 1981-02-24 | Minnesota Mining And Manufacturing Company | Solder mask composition |
| US4308338A (en) * | 1980-03-26 | 1981-12-29 | E. I. Du Pont De Nemours And Company | Methods of imaging photopolymerizable materials containing diester polyether |
| JPS5764734A (en) * | 1980-10-08 | 1982-04-20 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element |
| DE3382078D1 (de) * | 1982-12-06 | 1991-02-07 | Ici Plc | Aromatische oligomere und harze. |
-
1984
- 1984-11-19 GB GB848429166A patent/GB8429166D0/en active Pending
- 1984-11-19 DE DE8484307991T patent/DE3476704D1/de not_active Expired
- 1984-11-19 EP EP84307991A patent/EP0145345B1/en not_active Expired
- 1984-11-28 PH PH31503A patent/PH20441A/en unknown
- 1984-12-06 KR KR1019840007721A patent/KR920000034B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| EP0145345B1 (en) | 1989-02-08 |
| GB8429166D0 (en) | 1984-12-27 |
| EP0145345A3 (en) | 1986-07-30 |
| PH20441A (en) | 1987-01-09 |
| DE3476704D1 (en) | 1989-03-16 |
| EP0145345A2 (en) | 1985-06-19 |
| KR920000034B1 (ko) | 1992-01-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| G160 | Decision to publish patent application | ||
| E701 | Decision to grant or registration of patent right | ||
| NORF | Unpaid initial registration fee |