KR830005812A - 인쇄회로용 구리박판 및 그의 제조방법 - Google Patents
인쇄회로용 구리박판 및 그의 제조방법 Download PDFInfo
- Publication number
- KR830005812A KR830005812A KR1019810001121A KR810001121A KR830005812A KR 830005812 A KR830005812 A KR 830005812A KR 1019810001121 A KR1019810001121 A KR 1019810001121A KR 810001121 A KR810001121 A KR 810001121A KR 830005812 A KR830005812 A KR 830005812A
- Authority
- KR
- South Korea
- Prior art keywords
- printed circuit
- manufacturing
- copper foil
- copper
- nickel layer
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims 7
- 239000011889 copper foil Substances 0.000 title claims 3
- 238000004519 manufacturing process Methods 0.000 title claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 4
- 238000010306 acid treatment Methods 0.000 claims 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims 2
- 239000003792 electrolyte Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (2)
- 인쇄회로용 구리박판에 있어서, 구리층과 상기 구리츠의 한측부 또는 양측부에 형성된 니켈층을 포함하며, 상기 니켈층의 표면이 음극적인 크롬산 처리를 받는 것을 특징으로 하는 인쇄회로용 구리박판.
- 인쇄회로용 구리박판의 제조방법에 있어서, 전기도금에 의해 구리층의 한측부 또는 양측부에 니켈층을 형성시키고, 전해물로서 크롬산 처리 용액을 사용하여 음극으로 되는 상기 니켈층의 표면을 전해해적으로 처리시키는 공정들을 포함하는 것을 특징으로 하는 인쇄회로용 구리박판의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019810001121A KR840002495B1 (ko) | 1981-04-03 | 1981-04-03 | 인쇄회로용 동박(銅箔) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019810001121A KR840002495B1 (ko) | 1981-04-03 | 1981-04-03 | 인쇄회로용 동박(銅箔) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR830005812A true KR830005812A (ko) | 1983-09-09 |
| KR840002495B1 KR840002495B1 (ko) | 1984-12-31 |
Family
ID=19220611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019810001121A KR840002495B1 (ko) | 1981-04-03 | 1981-04-03 | 인쇄회로용 동박(銅箔) |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR840002495B1 (ko) |
-
1981
- 1981-04-03 KR KR1019810001121A patent/KR840002495B1/ko active
Also Published As
| Publication number | Publication date |
|---|---|
| KR840002495B1 (ko) | 1984-12-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR880701066A (ko) | 도체회로판의 제조방법. | |
| KR890016892A (ko) | 프린트회로기판의 제조방법 | |
| ES528101A0 (es) | Catodo para la produccion electrolitica de hidrogeno | |
| KR840004462A (ko) | 전해용 이온 교환막의 제조방법 | |
| DE3569583D1 (en) | Method of depositing a metal on spaced regions of a workpiece | |
| JPS5754300A (ja) | Obijokinzokubannodenkaisochi | |
| KR830005812A (ko) | 인쇄회로용 구리박판 및 그의 제조방법 | |
| KR880002413A (ko) | 프린트배선판의 제조방법 | |
| DE3867550D1 (de) | Stromzufuehrungswalze zur kontinuierlichen elektrolytischen plattierung von metallischen oder anderen stromleitenden baendern. | |
| ES2011260B3 (es) | Procedimiento de produccion de microfiltros | |
| ATE926T1 (de) | Verfahren zur behandlung von aluminiumfolien oder flachdruckplatten sowie die so erhaltenen produkte. | |
| KR830005811A (ko) | 인쇄 회로용 구리박판 및 그의 제조방법 | |
| ES450982A1 (es) | Perfeccionamientos introducidos en un procedimiento y en un aparato para la produccion de una longitud continua de chapametalica perforada. | |
| ATE58921T1 (de) | Verfahren und vorrichtung zur herstellung einer hauchduennen metallfolie durch galvanische beschichtung. | |
| FR2092478A5 (en) | Electrolytic printed circuit prodn - by electrolytic deposition - of copper | |
| KR890013226A (ko) | 전해크롬산염 용액처리강판의 제조방법 | |
| GB1449350A (en) | Laminate for printed circuit board | |
| KR890013224A (ko) | 전해크롬산염용액 처리강판의 제조방법 | |
| JPS53131235A (en) | Manufacture of one-side plated strip steel sheet | |
| GB1005619A (en) | Improvements in and relating to the deposition of copper on non-conductive surfaces | |
| JPS5782496A (en) | Pattern coloring method for aluminum or aluminum alloy | |
| JPS6482598A (en) | Copper plating method for printed board | |
| Lee et al. | Method of Depositing a Metal on Spaced Regions of a Workpiece | |
| JPS5687001A (en) | Formation of fog resistant film | |
| JPS57152485A (en) | Copper foil and its surface treatment |