GB1005619A - Improvements in and relating to the deposition of copper on non-conductive surfaces - Google Patents

Improvements in and relating to the deposition of copper on non-conductive surfaces

Info

Publication number
GB1005619A
GB1005619A GB24679/63A GB2467963A GB1005619A GB 1005619 A GB1005619 A GB 1005619A GB 24679/63 A GB24679/63 A GB 24679/63A GB 2467963 A GB2467963 A GB 2467963A GB 1005619 A GB1005619 A GB 1005619A
Authority
GB
United Kingdom
Prior art keywords
copper
sulphate solution
oxide
coated
reducible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24679/63A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1005619A publication Critical patent/GB1005619A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces

Abstract

Non-conducting porous surfaces, e.g. paper or board, are coated with copper by first impregnating the surface with a reducible copper sulphate solution, heating the impregnated surface under pressure which forms a certain amount of copper oxides, and then re-immersing in the copper sulphate solution with an applied voltage which forms the copper coating. The copper sulphate solution includes caustic soda and a little formalin or sugar together with either citric or lactic acid, Rochelle salt, or glycerin. A number of the impregnated sheets may be (1) coated with adhesive and placed together, with a sheet of copper foil on each side, and heated at up to 250 DEG F. at 100 lbs. p.s.i. A resist pattern applied, holes made as necessary, and then immersed in an electroplating bath containing reducible CuSO4 solution. Copper oxide is deposited at low current density. The panel is then treated in a reducing copper bath containing sodium carbonate, which reduces the copper oxide to metal, including the oxide coating on the walls of the holes.
GB24679/63A 1962-06-29 1963-06-21 Improvements in and relating to the deposition of copper on non-conductive surfaces Expired GB1005619A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20615862A 1962-06-29 1962-06-29

Publications (1)

Publication Number Publication Date
GB1005619A true GB1005619A (en) 1965-09-22

Family

ID=22765227

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24679/63A Expired GB1005619A (en) 1962-06-29 1963-06-21 Improvements in and relating to the deposition of copper on non-conductive surfaces

Country Status (2)

Country Link
DE (1) DE1496834B1 (en)
GB (1) GB1005619A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106757249A (en) * 2016-12-15 2017-05-31 河海大学常州校区 A kind of cathode surface nanosecond pulsed electric field prepares the solution and preparation method of nano thin-film
CN108353502A (en) * 2015-12-17 2018-07-31 株式会社藤仓 The manufacturing method of circuit board and circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU921124A1 (en) * 1979-06-19 1982-04-15 Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср Method of metallization of printed circuit board apertures

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108353502A (en) * 2015-12-17 2018-07-31 株式会社藤仓 The manufacturing method of circuit board and circuit board
EP3393217A4 (en) * 2015-12-17 2019-10-16 Fujikura Ltd. Wiring board and method for producing wiring board
CN106757249A (en) * 2016-12-15 2017-05-31 河海大学常州校区 A kind of cathode surface nanosecond pulsed electric field prepares the solution and preparation method of nano thin-film
CN106757249B (en) * 2016-12-15 2019-01-15 河海大学常州校区 A kind of cathode surface nanosecond pulsed electric field prepares the solution and preparation method of nano thin-film

Also Published As

Publication number Publication date
DE1496834B1 (en) 1970-12-23

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