KR20260015280A - 막 형성용 조성물, 기판의 제조 방법, 및 막 형성용 조성물의 제조 방법 - Google Patents

막 형성용 조성물, 기판의 제조 방법, 및 막 형성용 조성물의 제조 방법

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Publication number
KR20260015280A
KR20260015280A KR1020257043124A KR20257043124A KR20260015280A KR 20260015280 A KR20260015280 A KR 20260015280A KR 1020257043124 A KR1020257043124 A KR 1020257043124A KR 20257043124 A KR20257043124 A KR 20257043124A KR 20260015280 A KR20260015280 A KR 20260015280A
Authority
KR
South Korea
Prior art keywords
film
forming composition
atoms
general formula
integer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257043124A
Other languages
English (en)
Korean (ko)
Inventor
미즈키 데츠무라
아야카 다케히사
소이치 구몬
Original Assignee
샌트랄 글래스 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 샌트랄 글래스 컴퍼니 리미티드 filed Critical 샌트랄 글래스 컴퍼니 리미티드
Publication of KR20260015280A publication Critical patent/KR20260015280A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/18—Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
KR1020257043124A 2023-05-31 2024-05-29 막 형성용 조성물, 기판의 제조 방법, 및 막 형성용 조성물의 제조 방법 Pending KR20260015280A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-090176 2023-05-31
JP2023090176 2023-05-31
PCT/JP2024/019656 WO2024248021A1 (ja) 2023-05-31 2024-05-29 膜形成用組成物、基板の製造方法、および膜形成用組成物の製造方法

Publications (1)

Publication Number Publication Date
KR20260015280A true KR20260015280A (ko) 2026-02-02

Family

ID=93658061

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257043124A Pending KR20260015280A (ko) 2023-05-31 2024-05-29 막 형성용 조성물, 기판의 제조 방법, 및 막 형성용 조성물의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2024248021A1 (https=)
KR (1) KR20260015280A (https=)
CN (1) CN121153104A (https=)
TW (1) TW202503015A (https=)
WO (1) WO2024248021A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011091349A (ja) 2009-09-28 2011-05-06 Tokyo Ohka Kogyo Co Ltd 表面処理剤及び表面処理方法
WO2011155407A1 (ja) 2010-06-07 2011-12-15 セントラル硝子株式会社 保護膜形成用薬液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102306472B1 (ko) * 2016-06-13 2021-09-29 후지필름 가부시키가이샤 액체 조성물이 수용된 수용 용기 및 액체 조성물의 보관 방법
US10593538B2 (en) * 2017-03-24 2020-03-17 Fujifilm Electronic Materials U.S.A., Inc. Surface treatment methods and compositions therefor
JP7277700B2 (ja) * 2018-01-15 2023-05-19 セントラル硝子株式会社 撥水性保護膜形成用薬液、及びウェハの表面処理方法
US20200035494A1 (en) * 2018-07-30 2020-01-30 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
KR20230015958A (ko) * 2020-05-21 2023-01-31 샌트랄 글래스 컴퍼니 리미티드 반도체 기판의 표면 처리 방법, 및 표면처리제 조성물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011091349A (ja) 2009-09-28 2011-05-06 Tokyo Ohka Kogyo Co Ltd 表面処理剤及び表面処理方法
WO2011155407A1 (ja) 2010-06-07 2011-12-15 セントラル硝子株式会社 保護膜形成用薬液

Also Published As

Publication number Publication date
WO2024248021A1 (ja) 2024-12-05
TW202503015A (zh) 2025-01-16
JPWO2024248021A1 (https=) 2024-12-05
CN121153104A (zh) 2025-12-16

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