TW202503015A - 膜形成用組成物、基板的製造方法及膜形成用組成物的製造方法 - Google Patents

膜形成用組成物、基板的製造方法及膜形成用組成物的製造方法 Download PDF

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Publication number
TW202503015A
TW202503015A TW113120280A TW113120280A TW202503015A TW 202503015 A TW202503015 A TW 202503015A TW 113120280 A TW113120280 A TW 113120280A TW 113120280 A TW113120280 A TW 113120280A TW 202503015 A TW202503015 A TW 202503015A
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TW
Taiwan
Prior art keywords
film
forming composition
general formula
atoms
substituted
Prior art date
Application number
TW113120280A
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English (en)
Chinese (zh)
Inventor
鉄村美月
武久彩香
公文創一
Original Assignee
日商中央硝子股份有限公司
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Publication date
Application filed by 日商中央硝子股份有限公司 filed Critical 日商中央硝子股份有限公司
Publication of TW202503015A publication Critical patent/TW202503015A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/18—Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
TW113120280A 2023-05-31 2024-05-31 膜形成用組成物、基板的製造方法及膜形成用組成物的製造方法 TW202503015A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023090176 2023-05-31
JP2023-090176 2023-05-31

Publications (1)

Publication Number Publication Date
TW202503015A true TW202503015A (zh) 2025-01-16

Family

ID=93658061

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113120280A TW202503015A (zh) 2023-05-31 2024-05-31 膜形成用組成物、基板的製造方法及膜形成用組成物的製造方法

Country Status (5)

Country Link
JP (1) JPWO2024248021A1 (https=)
KR (1) KR20260015280A (https=)
CN (1) CN121153104A (https=)
TW (1) TW202503015A (https=)
WO (1) WO2024248021A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5663160B2 (ja) 2009-09-28 2015-02-04 東京応化工業株式会社 表面処理剤及び表面処理方法
SG185632A1 (en) 2010-06-07 2012-12-28 Central Glass Co Ltd Liquid chemical for foaming protecting film
KR102306472B1 (ko) * 2016-06-13 2021-09-29 후지필름 가부시키가이샤 액체 조성물이 수용된 수용 용기 및 액체 조성물의 보관 방법
US10593538B2 (en) * 2017-03-24 2020-03-17 Fujifilm Electronic Materials U.S.A., Inc. Surface treatment methods and compositions therefor
JP7277700B2 (ja) * 2018-01-15 2023-05-19 セントラル硝子株式会社 撥水性保護膜形成用薬液、及びウェハの表面処理方法
US20200035494A1 (en) * 2018-07-30 2020-01-30 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
KR20230015958A (ko) * 2020-05-21 2023-01-31 샌트랄 글래스 컴퍼니 리미티드 반도체 기판의 표면 처리 방법, 및 표면처리제 조성물

Also Published As

Publication number Publication date
KR20260015280A (ko) 2026-02-02
WO2024248021A1 (ja) 2024-12-05
JPWO2024248021A1 (https=) 2024-12-05
CN121153104A (zh) 2025-12-16

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