JPWO2024248021A1 - - Google Patents

Info

Publication number
JPWO2024248021A1
JPWO2024248021A1 JP2025524123A JP2025524123A JPWO2024248021A1 JP WO2024248021 A1 JPWO2024248021 A1 JP WO2024248021A1 JP 2025524123 A JP2025524123 A JP 2025524123A JP 2025524123 A JP2025524123 A JP 2025524123A JP WO2024248021 A1 JPWO2024248021 A1 JP WO2024248021A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025524123A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024248021A1 publication Critical patent/JPWO2024248021A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/18Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/20Cleaning during device manufacture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
JP2025524123A 2023-05-31 2024-05-29 Pending JPWO2024248021A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023090176 2023-05-31
PCT/JP2024/019656 WO2024248021A1 (ja) 2023-05-31 2024-05-29 膜形成用組成物、基板の製造方法、および膜形成用組成物の製造方法

Publications (1)

Publication Number Publication Date
JPWO2024248021A1 true JPWO2024248021A1 (https=) 2024-12-05

Family

ID=93658061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025524123A Pending JPWO2024248021A1 (https=) 2023-05-31 2024-05-29

Country Status (5)

Country Link
JP (1) JPWO2024248021A1 (https=)
KR (1) KR20260015280A (https=)
CN (1) CN121153104A (https=)
TW (1) TW202503015A (https=)
WO (1) WO2024248021A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5663160B2 (ja) 2009-09-28 2015-02-04 東京応化工業株式会社 表面処理剤及び表面処理方法
SG185632A1 (en) 2010-06-07 2012-12-28 Central Glass Co Ltd Liquid chemical for foaming protecting film
KR102306472B1 (ko) * 2016-06-13 2021-09-29 후지필름 가부시키가이샤 액체 조성물이 수용된 수용 용기 및 액체 조성물의 보관 방법
US10593538B2 (en) * 2017-03-24 2020-03-17 Fujifilm Electronic Materials U.S.A., Inc. Surface treatment methods and compositions therefor
JP7277700B2 (ja) * 2018-01-15 2023-05-19 セントラル硝子株式会社 撥水性保護膜形成用薬液、及びウェハの表面処理方法
US20200035494A1 (en) * 2018-07-30 2020-01-30 Fujifilm Electronic Materials U.S.A., Inc. Surface Treatment Compositions and Methods
KR20230015958A (ko) * 2020-05-21 2023-01-31 샌트랄 글래스 컴퍼니 리미티드 반도체 기판의 표면 처리 방법, 및 표면처리제 조성물

Also Published As

Publication number Publication date
KR20260015280A (ko) 2026-02-02
WO2024248021A1 (ja) 2024-12-05
TW202503015A (zh) 2025-01-16
CN121153104A (zh) 2025-12-16

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